公开(公告)号：US12104268B2

公开(公告)日：2024-10-01

申请号：US18340299

申请日：2023-06-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Zong-Kun Lin ,  Hsuan-Chih Chu ,  Chien-Hsun Pan ,  Yen-Yu Chen ,  Yi-Ming Dai

IPC: C25D21/06 ,  B01D61/18 ,  B01D63/16

CPC classification number: C25D21/06 ,  B01D61/18 ,  B01D63/16 ,  B01D2311/2642 ,  B01D2313/18 ,  B01D2313/44

Abstract: The treatment system provides a feature that may reduce cost of the electrochemical plating process by reusing the virgin makeup solution in the spent electrochemical plating bath. The treatment system provides a rotating filter shaft which receives the spent electrochemical plating bath and captures the additives and by-products created by the additives during the electrochemical plating process. To capture the additives and the by-products, the rotating filter shaft includes one or more types of membranes. Materials such as semi-permeable membrane are used to capture the used additives and by-products in the spent electrochemical plating bath. The treatment system may be equipped with an electrochemical sensor to monitor a level of additives in the filtered electrochemical plating bath.

公开(公告)号：US20250167037A1

公开(公告)日：2025-05-22

申请号：US18512146

申请日：2023-11-17

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chia-Hsi Wang ,  Yen-Yu Chen ,  Yi-Hu Lo ,  Pei-Shih Tsai ,  Zong-Kun Lin

IPC: H01L21/687 ,  H01L21/306 ,  H01L21/67

Abstract: A wafer chuck assembly is provided. In one embodiment, the chuck assembly comprises a hub, a plurality of arms mounted to the hub and a plurality of holders. Each arm extends outwardly from the hub, and each arm has a proximal end adjacent the hub and a distal end remote from the hub. Each holder is mounted at the distal end of each respective arm, and each holder has a plurality of support pins configured to support a wafer.

公开(公告)号：US11732379B2

公开(公告)日：2023-08-22

申请号：US16901967

申请日：2020-06-15

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Zong-Kun Lin ,  Hsuan-Chih Chu ,  Chien-Hsun Pan ,  Yen-Yu Chen ,  Yi-Ming Dai

IPC: B01D61/18 ,  B01D63/16 ,  C25D21/06

CPC classification number: C25D21/06 ,  B01D61/18 ,  B01D63/16 ,  B01D2311/2642 ,  B01D2313/18 ,  B01D2313/22 ,  B01D2313/44

Abstract: The treatment system provides a feature that may reduce cost of the electrochemical plating process by reusing the virgin makeup solution in the spent electrochemical plating bath. The treatment system provides a rotating filter shaft which receives the spent electrochemical plating bath and captures the additives and by-products created by the additives during the electrochemical plating process. To capture the additives and the by-products, the rotating filter shaft includes one or more types of membranes. Materials such as semi-permeable membrane are used to capture the used additives and by-products in the spent electrochemical plating bath. The treatment system may be equipped with an electrochemical sensor to monitor a level of additives in the filtered electrochemical plating bath.