Thermal Probe
    1.
    发明申请
    Thermal Probe 审中-公开
    热探头

    公开(公告)号:US20150013957A1

    公开(公告)日:2015-01-15

    申请号:US14498059

    申请日:2014-09-26

    Abstract: A temperature probe having a terminal attachment arrangement for securing and selectively releasing an electrical connection is disclosed. The temperature probe further includes a housing for sealing the temperature probe to a structure, such as a HVAC duct.

    Abstract translation: 公开了具有用于固定和选择性地释放电连接的端子附接装置的温度探头。 温度探头还包括用于将温度探针密封到例如HVAC导管的结构的壳体。

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