-
公开(公告)号：US10991641B2
公开(公告)日：2021-04-27
申请号：US16867352
申请日：2020-05-05
Applicant: Texas Instruments Incorporated
Inventor： Benjamin Michael Sutton , Sreenivasan K Koduri , Subhashish Mukherjee
IPC: H01L23/495 , H01L23/522
Abstract: A coupling device provides galvanic isolation using a leadframe that is configured to support two integrated circuit chips in a coplanar manner. Each chip contains an inductive coupling coil. The lead frame includes a set of bond pads for attaching bond wires to couple to the two integrated circuit chips. Two separated die attach pads support the two chips. Each die attach pad is configured to support one of the two integrated circuit chips with a plurality of cantilevered fingers.
-
公开(公告)号：US20160096727A1
公开(公告)日：2016-04-07
申请号：US14967515
申请日：2015-12-14
Applicant: Texas Instruments Incorporated
Abstract: A method of forming a packaged electronic device includes fabricating a MEMS structure, such as a BAW structure, on a first semiconductor wafer substrate; forming a cavity in a second semiconductor wafer substrate; and mounting the second substrate on the first substrate such that the MEMS structure is positioned inside the cavity in the second substrate using epoxy die attachment film. A wafer level assembly and an integrated circuit package are also described.
Abstract translation: 形成封装的电子器件的方法包括在第一半导体晶片衬底上制造诸如BAW结构的MEMS结构; 在第二半导体晶片衬底中形成空腔; 以及将所述第二基板安装在所述第一基板上，使得所述MEMS结构使用环氧树脂模附着膜定位在所述第二基板的所述腔内。 还描述了晶片级组件和集成电路封装。
-
公开(公告)号：US10854370B2
公开(公告)日：2020-12-01
申请号：US15809750
申请日：2017-11-10
Applicant: Texas Instruments Incorporated
Inventor： Haiying Li , Benjamin Michael Sutton , Ming Li
Abstract: An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.
-
4.发明申请公开(公告)号：US20200266131A1
公开(公告)日：2020-08-20
申请号：US16867352
申请日：2020-05-05
Applicant: Texas Instruments Incorporated
Inventor： Benjamin Michael Sutton , Sreenivasan K. Koduri , Subhashish Mukherjee
IPC: H01L23/495
Abstract: A coupling device provides galvanic isolation using a leadframe that is configured to support two integrated circuit chips in a coplanar manner. Each chip contains an inductive coupling coil. The lead frame includes a set of bond pads for attaching bond wires to couple to the two integrated circuit chips. Two separated die attach pads support the two chips. Each die attach pad is configured to support one of the two integrated circuit chips with a plurality of cantilevered fingers.
-
公开(公告)号：US20180336994A1
公开(公告)日：2018-11-22
申请号：US15809750
申请日：2017-11-10
Applicant: Texas Instruments Incorporated
Inventor： Haiying Li , Benjamin Michael Sutton , Ming Li
CPC classification number: H01F27/2804 , H01F17/0033 , H01F17/045 , H01F17/062 , H01F27/022 , H01F27/2895 , H01F27/327 , H01F41/041 , H01F41/127 , H01F2027/2809 , H01F2027/2814
Abstract: An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.
-
Patent Agency Ranking
公开(公告)号：US10256027B2
公开(公告)日：2019-04-09
申请号：US14576934
申请日：2014-12-19
Applicant: Texas Instruments Incorporated
Inventor： Haiying Li , Benjamin Michael Sutton , Ming Li
Abstract: An embodiment of coil assembly includes a laterally disposed ferrite ring having a central opening. A laterally disposed annular conductive member is positioned above the ferrite ring and has a plurality of spaced-apart circumferential segments. A plurality of bond wires are connected at opposite ends thereof to outer and inner portions of the plurality of spaced-apart circumferential segments. A layer of mold compound covers the ferrite ring and the bond wires.
-
公开(公告)号：US20170294263A1
公开(公告)日：2017-10-12
申请号：US15634336
申请日：2017-06-27
Applicant: Texas Instruments Incorporated
Inventor： Haiying Li , Benjamin Michael Sutton , Ming Li
CPC classification number: H01F27/2804 , H01F17/0033 , H01F17/045 , H01F17/062 , H01F27/022 , H01F27/2895 , H01F27/327 , H01F41/041 , H01F41/127 , H01F2027/2809 , H01F2027/2814
Abstract: An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.
-
公开(公告)号：US09527728B2
公开(公告)日：2016-12-27
申请号：US13947235
申请日：2013-07-22
Applicant: Texas Instruments Incorporated
CPC classification number: B81C1/00269 , B81C2203/0118 , B81C2203/0154 , H03H3/0076
Abstract: A method of forming a packaged electronic device includes fabricating a MEMS structure, such as a BAW structure, on a first semiconductor wafer substrate; forming a cavity in a second semiconductor wafer substrate; and mounting the second substrate on the first substrate such that the MEMS structure is positioned inside the cavity in the second substrate. A wafer level assembly and an integrated circuit package are also described.
Abstract translation: 形成封装的电子器件的方法包括在第一半导体晶片衬底上制造诸如BAW结构的MEMS结构; 在第二半导体晶片衬底中形成空腔; 以及将所述第二基板安装在所述第一基板上，使得所述MEMS结构位于所述第二基板中的所述腔内。 还描述了晶片级组件和集成电路封装。
-
公开(公告)号：US20210249336A1
公开(公告)日：2021-08-12
申请号：US17242121
申请日：2021-04-27
Applicant: Texas Instruments Incorporated
Inventor： Benjamin Michael Sutton , Sreenivasan K. Koduri , Subhashish Mukherjee
IPC: H01L23/495
Abstract: A coupling device provides galvanic isolation using a leadframe that is configured to support two integrated circuit chips in a coplanar manner. Each chip contains an inductive coupling coil. The lead frame includes a set of bond pads for attaching bond wires to couple to the two integrated circuit chips. Two separated die attach pads support the two chips. Each die attach pad is configured to support one of the two integrated circuit chips with a plurality of cantilevered fingers.
-
公开(公告)号：US10978239B2
公开(公告)日：2021-04-13
申请号：US15634336
申请日：2017-06-27
Applicant: Texas Instruments Incorporated
Inventor： Haiying Li , Benjamin Michael Sutton , Ming Li
IPC: H01F5/00 , H01F27/28 , H01F17/00 , H01F17/06 , H01F17/04 , H01F27/02 , H01F41/04 , H01F27/32 , H01F41/12
Abstract: An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.
-
-
-
-
-
-
-
-
-
Search Results
16
records
(took 0.013 seconds)
