公开(公告)号：US20150097539A1

公开(公告)日：2015-04-09

申请号：US14518776

申请日：2014-10-20

Applicant: Texas Instruments Incorporated

Inventor： Scott E. Ragona ,  Rengang Chen ,  David Jauregui

IPC: H02M3/158

CPC classification number: H02M3/1588 ,  H02M2001/0009 ,  Y02B70/1466

Abstract: A switching converter having a high-side switching transistor and a low-side switching transistor and an inductor, having a circuit for generating a simulated waveform representing a sawtooth inductor current waveform. A circuit for monitoring and voltage at a switch node between the high-side and low-side transistors to determine a time during which the inductor current is increasing and a time during which the inductor current is decreasing wherein voltage across the low-side transistor when it is conducting represents a first portion of the simulated sawtooth inductor current waveform. A circuit for utilizing the time when the inductor current is increasing, the time when the inductor current is decreasing and the voltage across the low-side transistor when it is conducting to generate a portion of the simulated inductor current waveform when the high-side transistor is conducting. A method and a power supply utilizing this circuit are also disclosed.

Abstract translation: 一种具有高侧开关晶体管和低侧开关晶体管和电感器的开关转换器，具有用于产生表示锯齿波电感电流波形的模拟波形的电路。 用于在高侧和低侧晶体管之间的开关节点处监视和电压的电路，以确定电感器电流增加的时间和电感器电流下降的时间，其中低侧晶体管的电压 它是导电表示模拟锯齿电感器电流波形的第一部分。 电路用于利用电感电流增加的时间，电感电流下降的时间和低侧晶体管导通时的电压，以在高侧晶体管产生模拟电感电流波形时产生一部分 正在进行。 还公开了一种利用该电路的方法和电源。

公开(公告)号：US20140247562A1

公开(公告)日：2014-09-04

申请号：US14274878

申请日：2014-05-12

Applicant: Texas Instruments Incorporated

Inventor： Juan A. Herbsommer ,  Osvaldo J. Lopez ,  Jonathan A. Noquil ,  David Jauregui ,  Lucian Hriscu

IPC: H05K7/20

CPC classification number: H02M3/00 ,  H01R43/26 ,  H02B1/48 ,  H05K7/2039 ,  H05K7/2089 ,  H05K7/209 ,  Y10T29/49002 ,  Y10T29/49073 ,  Y10T29/49117

Abstract: An apparatus includes a heat-generating component and a thermally inert component positioned in close proximity to the heat-generating component. A housing for the thermally inert component is in touch with the heat-generating component and is structured to transform the thermally inert component into a heat sink for the heat-generating component

Abstract translation: 一种装置包括发热部件和靠近发热部件定位的热惰性部件。 用于热惰性组分的壳体与发热组件接触，并且被构造成将热惰性组分转化成用于发热组件的散热器

公开(公告)号：US09966855B2

公开(公告)日：2018-05-08

申请号：US14518776

申请日：2014-10-20

Applicant: Texas Instruments Incorporated

Inventor： Scott E. Ragona ,  Rengang Chen ,  David Jauregui

IPC: H02M3/158 ,  H02M1/00

CPC classification number: H02M3/1588 ,  H02M2001/0009 ,  Y02B70/1466

Abstract: A switching converter having a high-side switching transistor and a low-side switching transistor and an inductor, having a circuit for generating a simulated waveform representing a sawtooth inductor current waveform. A circuit for monitoring and voltage at a switch node between the high-side and low-side transistors to determine a time during which the inductor current is increasing and a time during which the inductor current is decreasing wherein voltage across the low-side transistor when it is conducting represents a first portion of the simulated sawtooth inductor current waveform. A circuit for utilizing the time when the inductor current is increasing, the time when the inductor current is decreasing and the voltage across the low-side transistor when it is conducting to generate a portion of the simulated inductor current waveform when the high-side transistor is conducting. A method and a power supply utilizing this circuit are also disclosed.

公开(公告)号：US20180226892A1

公开(公告)日：2018-08-09

申请号：US15942962

申请日：2018-04-02

Applicant: Texas Instruments Incorporated

Inventor： Scott E. Ragona ,  Rengang Chen ,  David Jauregui

IPC: H02M3/158 ,  H02M1/00

CPC classification number: H02M3/1588 ,  H02M2001/0009 ,  Y02B70/1466

Abstract: A switching converter having a high-side switching transistor and a low-side switching transistor and an inductor, having a circuit for generating a simulated waveform representing a sawtooth inductor current waveform. A circuit for monitoring and voltage at a switch node between the high-side and low-side transistors to determine a time during which the inductor current is increasing and a time during which the inductor current is decreasing wherein voltage across the low-side transistor when it is conducting represents a first portion of the simulated sawtooth inductor current waveform. A circuit for utilizing the time when the inductor current is increasing, the time when the inductor current is decreasing and the voltage across the low-side transistor when it is conducting to generate a portion of the simulated inductor current waveform when the high-side transistor is conducting. A method and a power supply utilizing this circuit are also disclosed.

公开(公告)号：US08910369B2

公开(公告)日：2014-12-16

申请号：US14275009

申请日：2014-05-12

Applicant: Texas Instruments Incorporated

Inventor： Juan A Herbsommer ,  Osvaldo J Lopez ,  Jonathan A Noquil ,  David Jauregui ,  Lucian Hriscu

IPC: H05K7/20 ,  H02M3/00 ,  H01R43/26 ,  H02B1/48

CPC classification number: H02M3/00 ,  H01R43/26 ,  H02B1/48 ,  H05K7/2039 ,  H05K7/2089 ,  H05K7/209 ,  Y10T29/49002 ,  Y10T29/49073 ,  Y10T29/49117

Abstract: A method for fabricating a power supply converter comprises a load inductor wrapped by a metal sleeve structured to transform the inductor into a heat sink positioned to deposit layers of solder paste on a sleeve surface and on the inductor leads. A metal carrier having a portion of a first thickness and portions of a greater second thickness is placed on the solder layers of the inductor. The carrier portion of first thickness is aligned with the inductor sleeve. The carrier portions of second thickness are aligned with the inductor leads. A sync and a control FET are placed side-by-side on solder layers deposited on the carrier portion of first thickness opposite the inductor sleeve. Reflowing is preformed and the solder layers are solidified. The FETs, the carrier and the inductor become integrated and the un-soldered surfaces of the FETs and the carrier portions of second thickness become coplanar.

Abstract translation: 一种用于制造电源转换器的方法包括由金属套管包围的负载感应器，所述金属套管构造成将电感器转换成散热器，该散热器定位成在套筒表面上和电感器引线上沉积焊膏层。 具有第一厚度的一部分和更大的第二厚度的部分的金属载体被放置在电感器的焊料层上。 第一厚度的载体部分与电感器套筒对准。 第二厚度的载体部分与电感器引线对准。 同步和控制FET并排放置在沉积在与电感器套筒相对的第一厚度的载体部分上的焊料层上。 进行回流，并使焊料层固化。 FET，载体和电感器变得集成，并且FET的未焊接表面和第二厚度的载体部分变得共面。

公开(公告)号：US20140245598A1

公开(公告)日：2014-09-04

申请号：US14275009

申请日：2014-05-12

Applicant: Texas Instruments Incorporated

Inventor： Juan A. Herbsommer ,  Osvaldo J. Lopez ,  Jonathan A. Noquil ,  David Jauregui ,  Lucian Hriscu

IPC: H02M3/00

CPC classification number: H02M3/00 ,  H01R43/26 ,  H02B1/48 ,  H05K7/2039 ,  H05K7/2089 ,  H05K7/209 ,  Y10T29/49002 ,  Y10T29/49073 ,  Y10T29/49117

Abstract: A method for fabricating a power supply converter comprises a load inductor wrapped by a metal sleeve structured to transform the inductor into a heat sink positioned to deposit layers of solder paste on a sleeve surface and on the inductor leads. A metal carrier having a portion of a first thickness and portions of a greater second thickness is placed on the solder layers of the inductor. The carrier portion of first thickness is aligned with the inductor sleeve. The carrier portions of second thickness are aligned with the inductor leads. A sync and a control FET are placed side-by-side on solder layers deposited on the carrier portion of first thickness opposite the inductor sleeve. Reflowing is preformed and the solder layers are solidified. The FETs, the carrier and the inductor become integrated and the un-soldered surfaces of the FETs and the carrier portions of second thickness become coplanar.

Abstract translation: 一种用于制造电源转换器的方法包括由金属套管包围的负载感应器，所述金属套管构造成将电感器转换成散热器，该散热器定位成在套筒表面上和电感器引线上沉积焊膏层。 具有第一厚度的一部分和更大的第二厚度的部分的金属载体被放置在电感器的焊料层上。 第一厚度的载体部分与电感器套筒对准。 第二厚度的载体部分与电感器引线对准。 同步和控制FET并排放置在沉积在与电感器套筒相对的第一厚度的载体部分上的焊料层上。 进行回流，并使焊料层固化。 FET，载体和电感器变得集成，并且FET的未焊接表面和第二厚度的载体部分变得共面。