公开(公告)号：US20130228323A1

公开(公告)日：2013-09-05

申请号：US13772467

申请日：2013-02-21

Applicant: TOKYO ELECTRON LIMITED

Inventor： Toshiyuki MAKABE ,  Taketoshi OKAJO

IPC: F28F27/02

CPC classification number: F28F27/02 ,  H01L21/67109

Abstract: A substrate processing apparatus includes: a processing chamber; a support base; an electrostatic chuck; a chiller; a first channel; a second channel; a bypass channel; and a flow rate control valve. The first channel connects the chiller and a coolant entrance of the support base and the second channel connects the chiller and a coolant exit of the support base. The bypass channel branches from a midway of the first channel and is connected to a midway of the second channel. The flow rate control valve controls a flow rate of coolant flowing through the bypass channel.

Abstract translation: 一种基板处理装置，包括：处理室; 支持基地 静电卡盘 一个冷水机组 第一个渠道 第二个渠道 旁路通道 和流量控制阀。 第一通道连接冷却器和支撑基座的冷却剂入口，第二通道连接冷却器和支撑基座的冷却剂出口。 旁路通道从第一通道的中途分支并连接到第二通道的中途。 流量控制阀控制流过旁路通道的冷却剂的流量。

公开(公告)号：US20250054793A1

公开(公告)日：2025-02-13

申请号：US18927144

申请日：2024-10-25

Applicant: Tokyo Electron Limited

Inventor： Norihiko AMIKURA ,  Masatomo KITA ,  Toshiyuki MAKABE ,  Shin MATSUURA ,  Nobutaka SASAKI ,  Gyeong min PARK

IPC: H01L21/677 ,  H01J37/32 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687

Abstract: A substrate processing system includes a vacuum transfer module, a substrate processing module connected to the vacuum transfer module and including: a substrate processing chamber; a stage disposed in the substrate processing chamber; a first ring and a second ring disposed so as to surround a substrate placed on the stage; and a lifter configured to vertically move the first ring and the second ring with respect to the stage; a storage module connected to the vacuum transfer module and including a vertically movable ring storage; and a controller configured to selectively execute a simultaneous transfer mode in which the first ring and the second ring are simultaneously transferred between the substrate processing module and the storage module, and a sole transfer mode in which the second ring is solely transferred between the substrate processing module and the storage module.

公开(公告)号：US20220243336A1

公开(公告)日：2022-08-04

申请号：US17589907

申请日：2022-02-01

Applicant: Tokyo Electron Limited

Inventor： Norihiko AMIKURA ,  Masatomo KITA ,  Toshiyuki MAKABE

IPC: C23C16/54 ,  C23C16/505 ,  C23C16/458

Abstract: A storage container for accommodating an annular member having a notch on at least one of an outer circumference and an inner circumference thereof is disclosed. The storage container comprises a base plate on which the annular member is placed. The base plate comprises a plurality of guide pins that protrude from the base plate and are configured to position the annular member. The plurality of guide pins include a pin engaged with the notch.

公开(公告)号：US20140238609A1

公开(公告)日：2014-08-28

申请号：US14191953

申请日：2014-02-27

Applicant: TOKYO ELECTRON LIMITED

Inventor： Taketoshi TOMIOKA ,  Taku GOHIRA ,  Toshiyuki MAKABE

IPC: H01L21/683 ,  H01L21/67

CPC classification number: H01L21/6831 ,  H01L21/67109 ,  H01L21/6875 ,  Y10T279/23

Abstract: A mounting table includes a base and an electrostatic chuck provided on the base. The base has first and second top surface on which the electrostatic chuck and a focus ring are respectively provided. The second top surface is provided below the first top surface. A coolant path in the base has central and peripheral paths extending below the first and second top surfaces, respectively. The peripheral path has a portion extending along a side surface toward the first top surface. The mounting surface has central and peripheral regions. The mounting surface has protrusions formed in a dot shape. The protrusions are formed such that a contact area between the protrusions of the peripheral region and the backside of an object per unit area becomes greater than a contact area between the protrusions of the central region and the backside of the object per unit area.

Abstract translation: 安装台包括设置在基座上的基座和静电卡盘。 基座具有第一和第二顶表面，静电卡盘和聚焦环分别设置有第一和第二顶表面。 第二顶表面设置在第一顶表面下方。 基座中的冷却剂路径分别具有在第一和第二顶表面下方延伸的中心和周边路径。 周边路径具有沿着侧表面朝向第一顶表面延伸的部分。 安装表面具有中央和周边区域。 安装表面具有形成为点状的突起。 这些突起形成为使得周边区域的突起与每单位面积的物体的背面之间的接触面积变得大于每单位面积的中心区域的突起与物体的背面之间的接触面积。

公开(公告)号：US20230215753A1

公开(公告)日：2023-07-06

申请号：US18182716

申请日：2023-03-13

Applicant: Tokyo Electron Limited

Inventor： Norihiko AMIKURA ,  Masatomo KITA ,  Toshiyuki MAKABE ,  Shin MATSUURA ,  Nobutaka SASAKI ,  Gyeong min PARK

IPC: H01L21/677 ,  H01L21/687 ,  H01L21/683 ,  H01L21/67 ,  H01J37/32

CPC classification number: H01L21/67742 ,  H01J37/32642 ,  H01J37/32715 ,  H01L21/6838 ,  H01L21/67196 ,  H01L21/68707 ,  H01L21/68721 ,  H01L21/68742 ,  H01J2237/2007

Abstract: A substrate processing system includes a vacuum transfer module; a plasma process module; a transfer robot in the vacuum transfer module; a stage in the plasma process module; a first ring disposed on the stage and a second ring disposed on the first ring to surround a substrate that is placed on the stage, the second ring having an inner diameter smaller than an inner diameter of the first ring; actuators to move support pins vertically to raise the first and the second rings and a transfer jig; and a controller configured to selectively execute a simultaneous transfer mode in which the transfer robot is caused to simultaneously transfer the first ring and the second ring and a sole transfer mode in which the transfer robot is caused to transfer only the second ring.