公开(公告)号：US20250069940A1

公开(公告)日：2025-02-27

申请号：US18946976

申请日：2024-11-14

Applicant: Tokyo Electron Limited

Inventor： Norihiko AMIKURA ,  Masatomo KITA ,  Masahiro DOGOME ,  Takami FUKASAWA ,  Daisuke HAYASHI ,  Toshiaki TOYOMAKI

IPC: H01L21/687 ,  B25J11/00 ,  H01L21/683

Abstract: A transfer device for simultaneously or separately transferring a wafer and a consumable part having a circular shape is disclosed. The consumable part is disposed in a wafer processing module, and the outer diameter of the consumable part is larger than the outer diameter of the wafer. The transfer device comprises an end effector configured to place the wafer and the consumable part thereon simultaneously or separately, an arm configured to move the end effector, and a controller configured to control the arm, to place the consumable part on the end effector such that the center of gravity of the consumable part coincides with a first position when transferring the consumable part, and to place the wafer on the end effector such that the center of gravity of the wafer coincides with a second position between the first position and front ends of the end effector when transferring the wafer.

公开(公告)号：US20220243336A1

公开(公告)日：2022-08-04

申请号：US17589907

申请日：2022-02-01

Applicant: Tokyo Electron Limited

Inventor： Norihiko AMIKURA ,  Masatomo KITA ,  Toshiyuki MAKABE

IPC: C23C16/54 ,  C23C16/505 ,  C23C16/458

Abstract: A storage container for accommodating an annular member having a notch on at least one of an outer circumference and an inner circumference thereof is disclosed. The storage container comprises a base plate on which the annular member is placed. The base plate comprises a plurality of guide pins that protrude from the base plate and are configured to position the annular member. The plurality of guide pins include a pin engaged with the notch.

公开(公告)号：US20220080476A1

公开(公告)日：2022-03-17

申请号：US17478197

申请日：2021-09-17

Applicant: TOKYO ELECTRON LIMITED

Inventor： Norihiko AMIKURA ,  Hideyuki OSADA ,  Genichi NANASAKI ,  Seiichi KAISE ,  Masatomo KITA ,  Takashi TAKIZAWA ,  Eiji TAKAHASHI

IPC: B08B9/093 ,  H01J37/32 ,  B08B13/00

Abstract: A substrate processing apparatus is disclosed. The apparatus comprises a vacuum transfer chamber including a top surface, a bottom surface, and side surfaces between the top and the bottom surfaces, including a first side surface and a second side surface opposite to the first side surface; a transfer robot, disposed in the vacuum transfer chamber, for transfering a substrate; a load lock module connected to the first side surface; a pipe, connected to a purge gas supply source, for supplying a purge gas into the vacuum transfer chamber; one or more gas ports provided in the top surface in the vicinity of the second side surface and connected to the pipe; and one or more exhaust ports, provided in the bottom surface in the vicinity of the first side surface, to which an exhaust pump for exhausting the purge gas supplied into the vacuum transfer chamber is connected.

公开(公告)号：US20180012735A1

公开(公告)日：2018-01-11

申请号：US15645521

申请日：2017-07-10

Applicant: TOKYO ELECTRON LIMITED

Inventor： Atsushi SAWACHI ,  Norihiko AMIKURA ,  Kouji NISHINO ,  Yohei SAWADA ,  Yoshiharu KISHIDA

IPC: H01J37/32 ,  F16K7/12 ,  F16K31/00 ,  G05D7/06 ,  H01L21/67 ,  H01L21/3065

Abstract: A gas supply system includes: a first flow channel connecting a first gas source and a chamber; a second flow channel connecting a second gas source and the first flow channel; a control valve, provided in the second flow channel, configured to control a flow rate of the second gas; an orifice provided downstream of the control valve and at a terminus of the second flow channel; a switching valve, provided at a connection point between the first flow channel and the terminus of the second flow channel, configured to control a supply timing of the second gas; an exhaust mechanism, connected to a flow channel between the control valve and the orifice in the second flow channel, configured to exhaust the second gas; and a controller configured to bring the control valve, the switching valve and the exhaust mechanism into operation.

公开(公告)号：US20150206713A1

公开(公告)日：2015-07-23

申请号：US14600224

申请日：2015-01-20

Applicant: TOKYO ELECTRON LIMITED

Inventor： Norihiko AMIKURA ,  Norikazu SASAKI ,  Atsushi SAWACHI

IPC: H01J37/32 ,  H01L21/67

CPC classification number: H01J37/3244 ,  H01J37/32449 ,  H01L21/31116

Abstract: Processing gases respectively supplied from multiple gas supply lines into a processing vessel can be switched at a high speed in a uniform manner. A plasma processing apparatus includes the processing vessel configured to perform therein a plasma process to a target substrate; and a gas inlet member including first gas discharge holes and second gas discharge holes which are alternately arranged to be adjacent to each other and respectively communicate with a first gas supply line and a second gas supply line, which are switchable. Further, the first gas discharge holes and the second gas discharge holes independently and respectively introduce a first processing gas and a second processing gas, which are respectively supplied from the first gas supply line and the second gas supply line and used in the plasma process, into the processing vessel.

Abstract translation: 分别从多个气体供给管路供给到处理容器中的处理气体可以以均匀的方式高速地切换。 等离子体处理装置包括：处理容器，被配置为在目标衬底中执行等离子体处理; 以及包括第一气体排出孔和第二气体排出孔的气体入口构件，所述第一气体排出孔和第二气体排出孔彼此相邻配置并分别与可切换的第一气体供给管线和第二气体供给管路连通。 此外，第一气体排出孔和第二气体排出孔独立地分别引入从第一气体供给管线和第二气体供给管线分别供给并用于等离子体处理的第一处理气体和第二处理气体， 进入处理容器。

公开(公告)号：US20240222185A1

公开(公告)日：2024-07-04

申请号：US18605892

申请日：2024-03-15

Applicant: Tokyo Electron Limited

Inventor： Tatsuru OKAMURA ,  Norihiko AMIKURA ,  Masatomo KITA ,  Takehiro SHINDO

IPC: H01L21/687 ,  B25J11/00 ,  B25J19/00 ,  H01L21/67

CPC classification number: H01L21/68707 ,  B25J11/0095 ,  B25J19/0054 ,  H01L21/67248 ,  H01L21/67253

Abstract: A substrate transfer system includes a substrate processing assembly, a substrate transfer assembly, and a controller. The substrate processing assembly includes a substrate processing chamber, a substrate support, and a first temperature sensor that measures a temperature of the substrate support. The substrate transfer assembly includes a substrate transfer chamber, a robotic substrate transferrer, and a temperature control system. The robotic substrate transferrer includes a first end-effector that holds a high-temperature substrate, a second end-effector that holds a low-temperature substrate, and a deposit detector located adjacent to at least one of the end-effectors. The temperature control system includes a cooling gas supply that supplies a cooling gas into the robotic substrate transferrer, a second temperature sensor that measures a temperature of an internal space of the robotic substrate transferrer, and a temperature adjuster that adjusts a temperature of the cooling gas based on an output from the second temperature sensor.

公开(公告)号：US20240186158A1

公开(公告)日：2024-06-06

申请号：US18525930

申请日：2023-12-01

Applicant: Tokyo Electron Limited

Inventor： Norihiko AMIKURA ,  Makoto SAEGUSA ,  Toshiaki TOYOMAKI ,  Seiichi KAISE ,  Masatomo KITA

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67196 ,  H01L21/67184 ,  H01L21/67742

Abstract: The present disclosure provides a transfer module, comprising: a first transfer chamber; a second transfer chamber, the second transfer chamber capable of accommodating a container accommodating a plurality of objects; and an opening/closing door configured to partition the first transfer chamber and the second transfer chamber, wherein the first transfer chamber has an accommodation portion configured to accommodate the object to be carried into the second transfer chamber, and the container accommodating the plurality of objects is carried into the second transfer chamber, the plurality of objects are transferred from the container to the accommodation portion in the first transfer chamber, the object is transferred from the accommodation portion into the vacuum transfer module, and the object carried out from the vacuum transfer module is transferred into the container without passing through the accommodation portion.

公开(公告)号：US20230215753A1

公开(公告)日：2023-07-06

申请号：US18182716

申请日：2023-03-13

Applicant: Tokyo Electron Limited

Inventor： Norihiko AMIKURA ,  Masatomo KITA ,  Toshiyuki MAKABE ,  Shin MATSUURA ,  Nobutaka SASAKI ,  Gyeong min PARK

IPC: H01L21/677 ,  H01L21/687 ,  H01L21/683 ,  H01L21/67 ,  H01J37/32

CPC classification number: H01L21/67742 ,  H01J37/32642 ,  H01J37/32715 ,  H01L21/6838 ,  H01L21/67196 ,  H01L21/68707 ,  H01L21/68721 ,  H01L21/68742 ,  H01J2237/2007

Abstract: A substrate processing system includes a vacuum transfer module; a plasma process module; a transfer robot in the vacuum transfer module; a stage in the plasma process module; a first ring disposed on the stage and a second ring disposed on the first ring to surround a substrate that is placed on the stage, the second ring having an inner diameter smaller than an inner diameter of the first ring; actuators to move support pins vertically to raise the first and the second rings and a transfer jig; and a controller configured to selectively execute a simultaneous transfer mode in which the transfer robot is caused to simultaneously transfer the first ring and the second ring and a sole transfer mode in which the transfer robot is caused to transfer only the second ring.

公开(公告)号：US20210398838A1

公开(公告)日：2021-12-23

申请号：US17351294

申请日：2021-06-18

Applicant: Tokyo Electron Limited

Inventor： Norihiko AMIKURA ,  Masatomo KITA

IPC: H01L21/68 ,  H01L21/687

Abstract: A storage module includes a substrate support, a sensor, a rotating unit, a storage unit and an elevating unit. The substrate support has a consumable member thereon. The sensor detects an orientation of the consumable member. The rotating unit rotates the consumable member in a predetermined direction based on the orientation of the consumable member detected by the sensor. The storage unit is disposed below the substrate support to store the consumable member. The elevating unit vertically moves the storage unit.

公开(公告)号：US20210287927A1

公开(公告)日：2021-09-16

申请号：US17195163

申请日：2021-03-08

Applicant: TOKYO ELECTRON LIMITED

Inventor： Norihiko AMIKURA ,  Masatomo KITA

IPC: H01L21/683 ,  H01L21/687 ,  H01L21/67 ,  H01L21/677

Abstract: A substrate processing system includes a substrate processing module, an atmospheric substrate transfer module, a first and a second vacuum substrate transfer module, a load lock module, and a vacuum substrate transfer robot. The first vacuum substrate transfer module having a first transfer space is disposed adjacent to the atmospheric substrate transfer module and the substrate processing module. The second vacuum substrate transfer module, having a second transfer space in communication with the first transfer space and external dimensions smaller than those of the first vacuum substrate transfer module in a plan view, is disposed on or under the first vacuum substrate transfer module. The load lock module is disposed between the atmospheric substrate transfer module and the second vacuum substrate transfer module. The vacuum substrate transfer robot is disposed in the first transfer space or the second transfer space to transfer a substrate.