摘要:
Provided is a manufacturing method of a solid-state imaging device, which is able to realize a solid-state imaging device whose reflection prevention coating is even and that does not have image noise in case of adopting a spincoating method in applying a material of the reflection prevention coating onto microlenses of the solid-state imaging device. In the solid-state imaging device 1 according to the present invention, a barrier wall pattern 7 is formed, as a step alleviating structure, in dicing areas 5X formed between adjacent imaging areas 9. The barrier wall pattern 7 has a rectangular sectional form. With use of the barrier wall pattern 7 in the spincoating method, reflection prevention coating 8 is coated onto the microlenses 6 more evenly than in conventional cases.
摘要:
Provided is a manufacturing method of a solid-state imaging device, which is able to realize a solid-state imaging device whose reflection prevention coating is even and that does not have image noise in case of adopting a spincoating method in applying a material of the reflection prevention coating onto microlenses of the solid-state imaging device. In the solid-state imaging device 1 according to the present invention, a barrier wall pattern 7 is formed, as a step alleviating structure, in dicing areas 5X formed between adjacent imaging areas 9. The barrier wall pattern 7 has a rectangular sectional form. With use of the barrier wall pattern 7 in the spincoating method, reflection prevention coating 8 is coated onto the microlenses 6 more evenly than in conventional cases.
摘要:
A solid-state image sensing device comprises: a light receiving unit for receiving light; a microlens formed above the light receiving unit; a fluorine-containing resin material layer formed on the microlens; and a transparent substrate provided over the fluorine-containing resin material layer. A resin layer adheres the fluorine-containing resin material layer and the transparent substrate.
摘要:
A solid-state image sensing device comprises: a light receiving unit for receiving light; a microlens formed above the light receiving unit; a fluorine-containing resin material layer formed on the microlens; and a transparent substrate provided over the fluorine-containing resin material layer. A resin layer adheres the fluorine-containing resin material layer and the transparent substrate.
摘要:
A solid-state image sensing device comprises: a light receiving unit for receiving light; a microlens formed above the light receiving unit; a fluorine-containing resin material layer formed on the microlens; and a transparent substrate provided over the fluorine-containing resin material layer. A resin layer adheres the fluorine-containing resin material layer and the transparent substrate.
摘要:
A solid state imaging device of the present invention comprises: a semiconductor substrate; a plurality of light receiving elements arranged in a matrix configuration on the semiconductor substrate; a plurality of color filter segments provided above the light receiving elements; and a light collector provided above the color filter segments for collecting light on the light receiving elements. The color filter segments are mutually separated by interstices. The interstices contain a gas.
摘要:
A solid state imaging device of the present invention comprises: a semiconductor substrate; a plurality of light receiving elements arranged in a matrix configuration on the semiconductor substrate; a plurality of color filter segments provided above the light receiving elements; and a light collector provided above the color filter segments for collecting light on the light receiving elements. The color filter segments are mutually separated by interstices. The interstices contain a gas.
摘要:
A pattern (6B) is formed by performing selective exposure and development on a photosensitive resist (6A), and then the pattern (6B) is decolorized by irradiating the pattern with ultraviolet or visible light. Then, a microlens (6) is formed by deforming the shape of the pattern (6B) into a microlens shape by heating. An inequality of h/a≧1 is satisfied, where, (h) is the height of the microlens (6), and (2a) is the length of the bottom plane of the microlens (6) in a short side direction when viewed from the upper plane.
摘要翻译:通过对光敏抗蚀剂(6A)进行选择性曝光和显影来形成图案(6B),然后通过用紫外线或可见光照射图案来使图案(6B)脱色。 然后,通过加热将图案(6B)的形状变形为微透镜形状来形成微透镜(6)。 满足h / a> = 1的不等式,其中,(h)是微透镜(6)的高度,(2a)是微透镜(6)在短边方向上的底面的长度, 从上层飞机观察。
摘要:
A card connector includes a base member and two sets of contact members which are provided on the base member. One ends of the contact members serve as joining portions with respect to a circuit board of a portable telephone. The other ends of the contact members serve as contact portions with respect to a card. The joining portions are respectively disposed at mutually opposite ends of the base member. The contact portions are bent in a chevron shape and have terminations in a card fitting direction.
摘要:
In order to enable both a back lid and a battery of a mobile electronic apparatus to be locked and unlocked with a single motion, the mobile electronic apparatus (10) in which the battery (11) is housed by opening the back lid (13) has such a structure that when a lock member (21) which is provided in a body of the mobile electronic apparatus so as to slide is slid to a locked position, the lock member (21) simultaneously locks both an engaging part (11a) provided in the battery (11) and an engaging part (13b) provided in the back lid (13), and when the lock member (21) is slid to an unlocked position, the lock member (21) simultaneously unlocks both the engaging parts (11a, 13b).