公开(公告)号：US20180043508A1

公开(公告)日：2018-02-15

申请号：US15724546

申请日：2017-10-04

Applicant: US SYNTHETIC CORPORATION

Inventor： Mark P. Chapman ,  Ronald W. Ward ,  Nicholas Christensen ,  Damon B. Crockett

IPC: B24D18/00 ,  E21B10/567 ,  E21B10/46 ,  B24D3/04 ,  B23K26/364

CPC classification number: B24D18/00 ,  B23K26/364 ,  B24D3/04 ,  E21B10/46 ,  E21B10/567 ,  E21B10/5673 ,  E21B10/5676

Abstract: Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (“EDM”), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.

公开(公告)号：US12042906B2

公开(公告)日：2024-07-23

申请号：US17172682

申请日：2021-02-10

Applicant: US SYNTHETIC CORPORATION

Inventor： Mark P. Chapman ,  Ronald W. Ward ,  Nicholas Christensen ,  Damon B. Crockett

IPC: B24D18/00 ,  B23K26/364 ,  B24D3/04 ,  E21B10/46 ,  E21B10/567

CPC classification number: B24D18/00 ,  B23K26/364 ,  B24D3/04 ,  E21B10/46 ,  E21B10/5673 ,  E21B10/5676

Abstract: Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (“EDM”), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.

公开(公告)号：US20210162566A1

公开(公告)日：2021-06-03

申请号：US17172682

申请日：2021-02-10

Applicant: US SYNTHETIC CORPORATION

Inventor： Mark P. Chapman ,  Ronald W. Ward ,  Nicholas Christensen ,  Damon B. Crockett

IPC: B24D18/00 ,  E21B10/567 ,  B23K26/364 ,  E21B10/46 ,  B24D3/04

Abstract: Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (“EDM”), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.

公开(公告)号：US10946500B2

公开(公告)日：2021-03-16

申请号：US15724546

申请日：2017-10-04

Applicant: US SYNTHETIC CORPORATION

Inventor： Mark P. Chapman ,  Ronald W. Ward ,  Nicholas Christensen ,  Damon B. Crockett

IPC: E21B10/567 ,  E21B10/46 ,  B24D18/00 ,  B23K26/364 ,  B24D3/04

Abstract: Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (“EDM”), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.

公开(公告)号：US09334694B2

公开(公告)日：2016-05-10

申请号：US14452206

申请日：2014-08-05

Applicant: US SYNTHETIC CORPORATION

Inventor： Jair J. Gonzalez ,  Kenneth E. Bertagnolli ,  Debkumar Mukhopadhyay ,  David P. Miess ,  Mark P. Chapman ,  Ronald W. Ward ,  Nicholas Christensen ,  Damon B. Crockett ,  Mohammad N. Sani

IPC: E21B10/56 ,  F16C33/04 ,  E21B10/567 ,  E21B10/55

CPC classification number: E21B10/567 ,  B24D18/00 ,  E21B4/003 ,  E21B10/55 ,  E21B10/5673 ,  E21B10/5676 ,  E21B10/5735 ,  F16C33/04 ,  F16C33/043 ,  F16C2206/04 ,  F16C2352/00

Abstract: Methods for at least partially relieving stress within a polycrystalline diamond (“PCD”) table of a polycrystalline diamond compact (“PDC”) include partitioning the substrate of the PDC, the PCD table of the PDC, or both. Partitioning may be achieved through grinding, machining, laser cutting, electro-discharge machining, or combinations thereof. PDCs may include at least one stress relieving partition.

Abstract translation: 在多晶金刚石（“PDC”）的多晶金刚石（“PCD”）表中至少部分减轻应力的方法包括分割PDC的基底，PDC的PCD表或两者。 分割可以通过研磨，机加工，激光切割，放电加工或其组合来实现。 PDC可以包括至少一个应力消除分隔。

公开(公告)号：US20240399540A1

公开(公告)日：2024-12-05

申请号：US18741013

申请日：2024-06-12

Applicant: US Synthetic Corporation

Inventor： Mark P. Chapman ,  Ronald W. Ward ,  Nicholas Christensen ,  Damon B. Crockett

IPC: B24D18/00 ,  B23K26/364 ,  B24D3/04 ,  E21B10/46 ,  E21B10/567

Abstract: Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (“EDM”), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.

公开(公告)号：US09999962B2

公开(公告)日：2018-06-19

申请号：US14703741

申请日：2015-05-04

Applicant: US SYNTHETIC CORPORATION

Inventor： Mark P. Chapman ,  Ronald W. Ward ,  Nicholas Christensen ,  Damon B. Crockett

IPC: E21B10/46 ,  B24D18/00 ,  E21B10/567 ,  B24D3/04 ,  B23K26/364

CPC classification number: B24D18/00 ,  B23K26/364 ,  B24D3/04 ,  E21B10/46 ,  E21B10/567 ,  E21B10/5673 ,  E21B10/5676

Abstract: Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (“EDM”), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.

公开(公告)号：US20160230471A1

公开(公告)日：2016-08-11

申请号：US15134158

申请日：2016-04-20

Applicant: US SYNTHETIC CORPORATION

Inventor： Jair J. Gonzalez ,  Kenneth E. Bertagnolli ,  Debkumar Mukhopadhyay ,  David P. Miess ,  Mark P. Chapman ,  Ronald W. Ward ,  Nicholas Christensen ,  Damon B. Crockett ,  Mohammad N. Sani

IPC: E21B10/567 ,  B24D18/00 ,  E21B4/00 ,  F16C33/04 ,  E21B10/55 ,  E21B10/573

CPC classification number: E21B10/567 ,  B24D18/00 ,  E21B4/003 ,  E21B10/55 ,  E21B10/5673 ,  E21B10/5676 ,  E21B10/5735 ,  F16C17/02 ,  F16C17/04 ,  F16C33/04 ,  F16C33/043 ,  F16C33/26 ,  F16C2206/04 ,  F16C2352/00

Abstract: Embodiments of methods for at least partially relieving stress within a polycrystalline diamond (“PCD”) table of a polycrystalline diamond compact (“PDC”) by partitioning the substrate of the PDC, the PCD table of the PDC, or both. Partitioning may be achieved through grinding, machining, laser cutting, electro-discharge machining, or combinations thereof. PDC embodiments including at least one stress relieving partition are also disclosed.

Abstract translation: 通过划分PDC的底物，PDC的PCD表或两者，至少部分地减轻多晶金刚石（“PDC”）的多晶金刚石（“PCD”）表中的应力的方法的实施方案。 分割可以通过研磨，机加工，激光切割，放电加工或其组合来实现。 还公开了包括至少一个应力释放分隔件的PDC实施例。

公开(公告)号：US20150239097A1

公开(公告)日：2015-08-27

申请号：US14703741

申请日：2015-05-04

Applicant: US SYNTHETIC CORPORATION

Inventor： Mark P. Chapman ,  Ronald W. Ward ,  Nicholas Christensen ,  Damon B. Crockett

IPC: B24D18/00 ,  B24D3/04 ,  B23K26/36

CPC classification number: B24D18/00 ,  B23K26/364 ,  B24D3/04 ,  E21B10/46 ,  E21B10/567 ,  E21B10/5673 ,  E21B10/5676

Abstract: Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (“EDM”), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.

Abstract translation: 公开了激光切割多晶金刚石台和多晶金刚石压块的方法。 多晶金刚石台的激光切割提供放电加工（“EDM”），用金刚石砂轮研磨或用金刚石砂轮研磨的替代方案。 用金刚石砂轮磨削或研磨相对较慢且昂贵，因为金刚石用于去除金刚石材料。 多晶金刚石台的电火花切割有时是不实际的或甚至是不可能的，特别是当多晶金刚石台中的钴或其他渗透剂或催化剂浓度非常低时（例如在浸出的多晶金刚石台的情况下）。 因此，激光切割提供了可用于各种工艺（例如激光划线，激光烧蚀和激光研磨）中的有价值的替代加工方法。

公开(公告)号：US20140367177A1

公开(公告)日：2014-12-18

申请号：US14452206

申请日：2014-08-05

Applicant: US SYNTHETIC CORPORATION

Inventor： Jair J. Gonzalez ,  Kenneth E. Bertagnolli ,  Debkumar Mukhopadhyay ,  David P. Miess ,  Mark P. Chapman ,  Ronald W. Ward ,  Nicholas Christensen ,  Damon B. Crockett ,  Mohammad N. Sani

IPC: E21B10/567 ,  B24D18/00 ,  B24D3/06 ,  E21B10/55 ,  F16C33/04

CPC classification number: E21B10/567 ,  B24D18/00 ,  E21B4/003 ,  E21B10/55 ,  E21B10/5673 ,  E21B10/5676 ,  E21B10/5735 ,  F16C33/04 ,  F16C33/043 ,  F16C2206/04 ,  F16C2352/00

Abstract: Embodiments of methods for at least partially relieving stress within a polycrystalline diamond (“PCD”) table of a polycrystalline diamond compact (“PDC”) by partitioning the substrate of the PDC, the PCD table of the PDC, or both. Partitioning may be achieved through grinding, machining, laser cutting, electro-discharge machining, or combinations thereof. PDC embodiments including at least one stress relieving partition are also disclosed.

Abstract translation: 通过划分PDC的底物，PDC的PCD表或两者，至少部分地减轻多晶金刚石（“PDC”）的多晶金刚石（“PCD”）表中的应力的方法的实施方案。 分割可以通过研磨，机加工，激光切割，放电加工或其组合来实现。 还公开了包括至少一个应力释放分隔件的PDC实施例。