公开(公告)号：US10433413B2

公开(公告)日：2019-10-01

申请号：US14460365

申请日：2014-08-15

Applicant: Unimicron Technology Corp.

Inventor： Cheng-Po Yu ,  Ming-Chia Li

IPC: H05K3/30 ,  H05K1/02 ,  H05K3/40 ,  H05K1/18 ,  H05K3/46

Abstract: A manufacturing method of circuit structure embedded with heat-dissipation block including the following steps is provided. A core board including a first dielectric layer and two first conductive layers located on two opposite sides of the first dielectric layer is provided. A through hole penetrated the core board is formed. A heat-dissipation block is disposed into the through hole. Two inner-layer circuits are formed on two opposite sides of the core board. At least one build-up structure is bonded on the core board, wherein the build-up structure includes a second dielectric layer and a second conductive layer, and the second dielectric layer is located between the second conductive layer and the core board. A cavity is formed on a predetermined region of the build-up structure, and the cavity is communicated with the corresponding inner-layer circuit. Another manufacturing method of circuit structure embedded with heat-dissipation block is also provided.

公开(公告)号：US20160050771A1

公开(公告)日：2016-02-18

申请号：US14460365

申请日：2014-08-15

Applicant: Unimicron Technology Corp.

Inventor： Cheng-Po Yu ,  Ming-Chia Li

IPC: H05K3/46 ,  H05K1/02 ,  H05K3/42

CPC classification number: H05K3/4644 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/183 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/066 ,  H05K2201/09845 ,  H05K2201/10416

Abstract: A manufacturing method of circuit structure embedded with heat-dissipation block including the following steps is provided. A core board including a first dielectric layer and two first conductive layers located on two opposite sides of the first dielectric layer is provided. A through hole penetrated the core board is formed. A heat-dissipation block is disposed into the through hole. Two inner-layer circuits are formed on two opposite sides of the core board. At least one build-up structure is bonded on the core board, wherein the build-up structure includes a second dielectric layer and a second conductive layer, and the second dielectric layer is located between the second conductive layer and the core board. A cavity is formed on a predetermined region of the build-up structure, and the cavity is communicated with the corresponding inner-layer circuit. Another manufacturing method of circuit structure embedded with heat-dissipation block is also provided.

Abstract translation: 提供一种嵌入散热块的电路结构的制造方法，包括以下步骤。 提供了包括第一电介质层和位于第一介电层的两个相对侧上的两个第一导电层的芯板。 形成穿过芯板的通孔。 散热块设置在通孔中。 两个内层电路形成在芯板的两个相对的两侧。 至少一个堆积结构结合在芯板上，其中积聚结构包括第二介电层和第二导电层，第二介电层位于第二导电层和芯板之间。 在积聚结构的预定区域上形成空腔，并且空腔与相应的内层电路连通。 还提供了另外一种嵌入散热块的电路结构的制造方法。