公开(公告)号：US07282930B2

公开(公告)日：2007-10-16

申请号：US11314624

申请日：2005-12-21

申请人： Uwe Beier ,  Dietmar Runge ,  Stefan Kreissig ,  Steffen Grauer ,  Matthias Rottka ,  Botho Hirschfeld ,  Joerg Kiesewetter

发明人： Uwe Beier ,  Dietmar Runge ,  Stefan Kreissig ,  Steffen Grauer ,  Matthias Rottka ,  Botho Hirschfeld ,  Joerg Kiesewetter

IPC分类号： G01R31/302

CPC分类号： G01R31/2831

摘要： A device for testing thin elements, such as wafers or individual substrates, while at the same time offering a facility for inspecting the reverse side of the thin elements is provided in which any deflection of the substrate as a consequence of high contact power of the probe card is avoided and which is also suitable for substrate diameters of 200 mm and above. The device includes a stable plate with a central opening positioned on the basic construction, a frame which can be moved and/or turned on the plate in an x/y direction and, if required, in a theta direction, a highly-rigid substrate support which can be mounted in the frame, and substrates which can be mounted on the substrate support, wherein the mounting is effected through a vacuum, using mechanical elements (clamping ring, clamping foil or other suitable clamping elements), gel pack pads, or adhesive etc.

摘要翻译： 提供了用于测试诸如晶片或单独基板的薄元件的装置，同时提供用于检查薄元件的反面的设备，其中作为探针的高接触功率的结果的基板的任何偏转 避免卡片，也适用于200mm及以上的基材直径。 该装置包括具有位于基本结构上的中心开口的稳定板，可在x / y方向上移动和/或转动板的框架，并且如果需要，在θ方向上可以是高度刚性的基板 可以安装在框架中的支撑件以及可以安装在基板支撑件上的基板，其中通过真空使用机械元件（夹紧环，夹紧箔或其它合适的夹紧元件），凝胶封装垫或 粘合剂等

公开(公告)号：US20070139067A1

公开(公告)日：2007-06-21

申请号：US11314624

申请日：2005-12-21

申请人： Uwe Beier ,  Dietmar Runge ,  Stefan Kreissig ,  Steffen Grauer ,  Matthias Rottka ,  Botho Hirschfeld ,  Joerg Kiesewetter

发明人： Uwe Beier ,  Dietmar Runge ,  Stefan Kreissig ,  Steffen Grauer ,  Matthias Rottka ,  Botho Hirschfeld ,  Joerg Kiesewetter

IPC分类号： G01R31/26

CPC分类号： G01R31/2831

摘要： A device for testing thin elements, such as wafers or individual substrates, while at the same time offering a facility for inspecting the reverse side of the thin elements is provided in which any deflection of the substrate as a consequence of high contact power of the probe card is avoided and which is also suitable for substrate diameters of 200 mm and above. The device includes a stable plate with a central opening positioned on the basic construction, a frame which can be moved and/or turned on the plate in an x/y direction and, if required, in a theta direction, a highly-rigid substrate support which can be mounted in the frame, and substrates which can be mounted on the substrate support, wherein the mounting is effected through a vacuum, using mechanical elements (clamping ring, clamping foil or other suitable clamping elements), gel pack pads, or adhesive etc.)

摘要翻译： 提供了用于测试诸如晶片或单独基板的薄元件的装置，同时提供用于检查薄元件的反面的设备，其中作为探针的高接触功率的结果的基板的任何偏转 避免卡片，也适用于200mm及以上的基材直径。 该装置包括具有位于基本结构上的中心开口的稳定板，可在x / y方向上移动和/或转动板的框架，并且如果需要，在θ方向上可以是高度刚性的基板 可以安装在框架中的支撑件以及可以安装在基板支撑件上的基板，其中通过真空使用机械元件（夹紧环，夹紧箔或其它合适的夹紧元件），凝胶封装垫或 粘合剂等）

公开(公告)号：US11195735B2

公开(公告)日：2021-12-07

申请号：US16967221

申请日：2019-02-06

申请人： Uwe Beier

发明人： Uwe Beier

IPC分类号： H01L21/67 ,  H01L21/677

摘要： A load lock for a substrate container for receiving flat substrates, wherein the load lock has a load chamber for receiving the substrate container that has a bottom, a ceiling, a rear wall, a front wall, a first side wall and a second side wall that connect the rear wall to the front wall, and wherein a carrier unit for receiving the substrate container is arranged in the load chamber. Here, it is provided that the load chamber can be divided into a first part and a second part along a dividing plane to open the load chamber, wherein the dividing plane extends toward the rear wall offset from the front wall through the first side wall, the second side wall, the bottom and the ceiling of the load chamber.