公开(公告)号：US4404059A

公开(公告)日：1983-09-13

申请号：US382407

申请日：1982-05-26

申请人： Vladimir I. Livshits ,  Vladimir I. Golovin ,  Vladimir I. Meshkov

发明人： Vladimir I. Livshits ,  Vladimir I. Golovin ,  Vladimir I. Meshkov

IPC分类号： H05K3/40 ,  H05K3/46 ,  C23F1/02 ,  B44C1/22 ,  C03C15/00 ,  C03C25/06

CPC分类号： H05K3/4092 ,  H05K3/4685 ,  H05K2201/0361 ,  H05K2203/0152 ,  H05K2203/0369 ,  H05K2203/0376 ,  H05K2203/0726 ,  Y10T29/49155

摘要： The herein disclosed process comprises forming conductors of desired shape on a substrate comprised of a metal that is selectively etchable with respect to the metal of conductors, such that the conductors are formed on both sides of the substrate and that the conductors have at least one constricted portion at the substrate side opposite to that on which a base will be laminated. Then, the panel base is laminated onto the appropriate side of the substrate, and the substrate metal is etched selectively with respect to the conductor metal through the entire thickness of the substrate until the metal of the latter is fully removed from under the constricted portions only.

摘要翻译： 本文公开的方法包括在由相对于导体金属可选择性地蚀刻的金属构成的衬底上形成所需形状的导体，使得导体形成在衬底的两侧上，并且导体具有至少一个收缩的 在与基底层叠相反的基底侧的部分。 然后，将面板基板层叠到基板的适当侧上，并且通过基板的整个厚度相对于导体金属选择性地蚀刻基板金属，直到基板金属仅在缩小部分下完全去除 。