公开(公告)号：US5439158A

公开(公告)日：1995-08-08

申请号：US199953

申请日：1994-02-22

Applicant: William Sund

Inventor： William Sund

IPC: B23K1/008 ,  B23K3/08 ,  B23K1/00

CPC classification number: B23K3/08 ,  B23K1/008

Abstract: An improved wave soldering apparatus that protects the molten solder and the components being soldered from exposure to ambient air while the solder is in a liquid condition. At the soldering station, which is enclosed in a controlled atmosphere chamber, all the liquid solder, pumps and other elements exposed to liquid solder are enclosed within the chamber. This eliminates the formation of dross which interferes with the soldering process and also with the operation of the solder pumps. The inlet and outlet paths from the chamber, through which the components pass, are extended both to exclude ambient air and to permit the components to cool in a controlled atmosphere.

Abstract translation: 一种改进的波峰焊装置，其在焊料处于液态的同时保护熔融焊料和焊接的部件免于暴露于环境空气。 在封闭在受控气氛室内的焊接站中，暴露于液体焊料的所有液体焊料，泵和其他元件都封闭在室内。 这消除了干扰焊接工艺以及焊料泵的操​​作的渣滓的形成。 来自腔室的入口和出口路径通过部件通过，以排除环境空气并允许部件在可控气氛中冷却。

公开(公告)号：US06705506B1

公开(公告)日：2004-03-16

申请号：US09567086

申请日：2000-05-08

Applicant: William Sund

Inventor： William Sund

IPC: B23K100

CPC classification number: B23K3/0669 ,  B23K1/08 ,  H05K3/3447 ,  H05K3/3468

Abstract: A printed circuit board soldering process where a number of pockets containing solder are filled to overflowing with solder and then raised to immerse the terminals to be soldered. The solder pot and the pockets are protected by an atmosphere of hot inert gas introduced under a cover plate which has openings, corresponding to the location of the terminals, through which the pockets pass.

Abstract translation: 一种印刷电路板焊接工艺，其中包含焊料的多个袋被填充以用焊料溢出，然后升高以浸没待焊接的端子。 焊料罐和口袋由引入到盖板下面的热惰性气体的气氛保护，盖板具有开口，对应于端子的位置，袋通过该位置。

公开(公告)号：US5860582A

公开(公告)日：1999-01-19

申请号：US762723

申请日：1996-12-10

Applicant: William Sund

Inventor： William Sund

IPC: B23K1/012 ,  B23K1/08 ,  B23K3/06 ,  H05K3/34

CPC classification number: H05K3/3468 ,  B23K1/012 ,  B23K1/08 ,  B23K3/0669 ,  B23K2201/36 ,  H05K2203/0763 ,  H05K2203/086 ,  H05K3/3447

Abstract: An inert atmosphere spot soldering process and apparatus uses pockets arranged to match the arrangement of the terminals to be soldered. The pockets are filled to over flowing with liquid solder by lowering the pockets below the surface of the molten solder in a solder pot. A flow of hot inert gas is provided through orifices adjacent the pockets. The terminals and their surrounding area are exposed to the hot inert gas for a period sufficient to drive off substantially all volatile liquids and the terminals are then immersed in the solder to a depth determined by the menicus of the solder in the pockets. After immersion, the terminals are seperated from the solder surface and the flow of inert gas is terminated after permitting the solder to solidify. The inert gas may be heated by thermal conduction from the liquid solder.

Abstract translation: 惰性气氛点焊方法和装置使用排列成匹配要焊接的端子的布置的凹穴。 通过在焊料罐中降低熔融焊料表面下方的口袋，将袋子充满液体焊料过度流动。 通过邻近口袋的孔提供热惰性气体流。 端子及其周围区域暴露于热惰性气体中足以驱除基本上所有挥发性液体的时间，然后将端子浸入焊料中至由凹穴中的焊料的多孔确定的深度。 浸渍后，端子与焊料表面分离，惰性气体的流动在允许焊料固化后终止。 可以通过来自液体焊料的热传导来加热惰性气体。

公开(公告)号：US5711473A

公开(公告)日：1998-01-27

申请号：US577308

申请日：1995-12-22

Applicant: William Sund

Inventor： William Sund

IPC: B23K1/012 ,  B23K1/08 ,  B23K3/06 ,  H05K3/34

CPC classification number: H05K3/3468 ,  B23K1/012 ,  B23K1/08 ,  B23K3/0669 ,  B23K2201/36 ,  H05K2203/0763 ,  H05K2203/086 ,  H05K3/3447

Abstract: An inert atmosphere spot soldering process and apparatus uses cups arranged to match the arrangement of the terminals to be soldered. The cups are filled to over flowing with liquid solder and provided with a enveloping flow of hot inert gas. The terminals and their surrounding area are exposed to the hot inert gas for a period sufficient to drive off substantially all volatile liquids and the terminals are then immersed in the solder. After immersion, the terminals are raised gently non parallel to the solder surface until they are above the solder and then the flow of inert gas is terminated permitting the solder to solidify. The inert gas may be heated by thermal conduction from the liquid solder.

Abstract translation: 惰性气氛点焊方法和装置使用配置成匹配要焊接的端子的布置的杯。 杯子充满液体焊料过度流动，并提供热惰性气体的包络流。 端子及其周围区域暴露于热惰性气体中足以驱除基本上所有挥发性液体的时间，然后将端子浸入焊料中。 浸渍后，将端子轻轻地不平行于焊料表面升高，直到它们在焊料上方，然后终止惰性气体流动，使焊料固化。 可以通过来自液体焊料的热传导来加热惰性气体。

公开(公告)号：US5335843A

公开(公告)日：1994-08-09

申请号：US135592

申请日：1993-10-13

Applicant: William Sund

Inventor： William Sund

IPC: B23K1/08 ,  H05K3/34 ,  B23K1/00 ,  B23K3/00

CPC classification number: B23K1/085 ,  B23K2201/36 ,  H05K3/3447 ,  H05K3/3468

Abstract: A soldering process and apparatus for soldering difficult to reach junctions. Small containers, just large enough to accommodate the junctions are filled to overflowing from a pot of liquid solder. Once filled the flow of solder is terminated and the junction dipped into the container. The meniscus on the liquid solder in the container establishes a consistent level enabling a mechanized process to dip the junctions the same depth each time. Between dips the container is refilled. The size of the container limits the exposure of other adjacent devices to the heat of the solder and also provides a limited quantity of solder to the junction thus providing a consistent soldered connection.

Abstract translation: 用于焊接难以到达结的焊接工艺和设备。 刚刚足够大以容纳接头的小容器被填充以从一盆液体焊料溢出。 一旦填充，焊料的流动被终止，并且连接处浸入容器中。 容器中液体焊料上的弯月面建立了一致的水平，使得机械化过程能够每次将接合点浸入相同的深度。 在蘸水之间，容器被再填充。 容器的尺寸限制了其他相邻装置暴露于焊料的热量，并且还将一定量的焊料提供给结，从而提供一致的焊接连接。