Integrated circuit (IC) structure protection scheme

    公开(公告)号:US12068257B1

    公开(公告)日:2024-08-20

    申请号:US17136721

    申请日:2020-12-29

    Applicant: XILINX, INC.

    CPC classification number: H01L23/552 H01L21/50 H01L23/528

    Abstract: Some examples described herein relate to protecting an integrated circuit (IC) structure from imaging or access. In an example, an IC structure includes a semiconductor substrate, an electromagnetic radiation blocking layer, and a support substrate. The semiconductor substrate has a circuit disposed on a front side of the semiconductor substrate. The electromagnetic radiation blocking layer is disposed on a backside of the semiconductor substrate opposite from the front side of the semiconductor substrate. The support substrate is bonded to the semiconductor substrate. The electromagnetic radiation blocking layer is disposed between the semiconductor substrate and the support substrate.

    Method and apparatus for suppressing metal-gate cross-diffusion in semiconductor technology
    2.
    发明授权
    Method and apparatus for suppressing metal-gate cross-diffusion in semiconductor technology 有权
    用于抑制半导体技术中金属栅极交叉扩散的方法和装置

    公开(公告)号:US09385127B2

    公开(公告)日:2016-07-05

    申请号:US13973616

    申请日:2013-08-22

    Applicant: Xilinx, Inc.

    Abstract: An inverter includes: a PMOS comprising: a p-type source region, a p-type drain region, a p-channel region between the p-type source region and the p-type drain region, and a PMOS metal gate region; a NMOS, comprising: an n-type source region, an n-type drain region, an n-channel region between the n-type source region and the n-type drain region, and a NMOS metal gate region; an insulating layer above the p-channel region and the n-channel region, wherein the PMOS metal gate region and the NMOS metal gate region are above the insulating layer; and a gate contact between the NMOS metal gate region and the PMOS metal gate region.

    Abstract translation: 反相器包括:PMOS,包括:p型源极区域,p型漏极区域,p型源极区域和p型漏极区域之间的p沟道区域以及PMOS金属栅极区域; NMOS,包括:n型源极区域,n型漏极区域,n型源极区域和n型漏极区域之间的n沟道区域以及NMOS金属栅极区域; 在p沟道区域和n沟道区域上方的绝缘层,其中PMOS金属栅极区域和NMOS金属栅极区域在绝缘层之上; 以及NMOS金属栅极区域和PMOS金属栅极区域之间的栅极接触。

    METHOD AND APPARATUS FOR SUPPRESSING METAL-GATE CROSS-DIFFUSION IN SEMICONDUCTOR TECHNOLOGY
    3.
    发明申请
    METHOD AND APPARATUS FOR SUPPRESSING METAL-GATE CROSS-DIFFUSION IN SEMICONDUCTOR TECHNOLOGY 有权
    用于在半导体技术中抑制金属栅极交叉扩散的方法和装置

    公开(公告)号:US20150054085A1

    公开(公告)日:2015-02-26

    申请号:US13973616

    申请日:2013-08-22

    Applicant: Xilinx, Inc.

    Abstract: An inverter includes: a PMOS comprising: a p-type source region, a p-type drain region, a p-channel region between the p-type source region and the p-type drain region, and a PMOS metal gate region; a NMOS, comprising: an n-type source region, an n-type drain region, an n-channel region between the n-type source region and the n-type drain region, and a NMOS metal gate region; an insulating layer above the p-channel region and the n-channel region, wherein the PMOS metal gate region and the NMOS metal gate region are above the insulating layer; and a gate contact between the NMOS metal gate region and the PMOS metal gate region.

    Abstract translation: 反相器包括:PMOS,包括:p型源极区域,p型漏极区域,p型源极区域和p型漏极区域之间的p沟道区域以及PMOS金属栅极区域; NMOS,包括:n型源极区域,n型漏极区域,n型源极区域和n型漏极区域之间的n沟道区域以及NMOS金属栅极区域; 在p沟道区域和n沟道区域上方的绝缘层,其中PMOS金属栅极区域和NMOS金属栅极区域在绝缘层之上; 以及NMOS金属栅极区域和PMOS金属栅极区域之间的栅极接触。

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