Abstract:
Some examples described herein relate to protecting an integrated circuit (IC) structure from imaging or access. In an example, an IC structure includes a semiconductor substrate, an electromagnetic radiation blocking layer, and a support substrate. The semiconductor substrate has a circuit disposed on a front side of the semiconductor substrate. The electromagnetic radiation blocking layer is disposed on a backside of the semiconductor substrate opposite from the front side of the semiconductor substrate. The support substrate is bonded to the semiconductor substrate. The electromagnetic radiation blocking layer is disposed between the semiconductor substrate and the support substrate.
Abstract:
An inverter includes: a PMOS comprising: a p-type source region, a p-type drain region, a p-channel region between the p-type source region and the p-type drain region, and a PMOS metal gate region; a NMOS, comprising: an n-type source region, an n-type drain region, an n-channel region between the n-type source region and the n-type drain region, and a NMOS metal gate region; an insulating layer above the p-channel region and the n-channel region, wherein the PMOS metal gate region and the NMOS metal gate region are above the insulating layer; and a gate contact between the NMOS metal gate region and the PMOS metal gate region.
Abstract:
An inverter includes: a PMOS comprising: a p-type source region, a p-type drain region, a p-channel region between the p-type source region and the p-type drain region, and a PMOS metal gate region; a NMOS, comprising: an n-type source region, an n-type drain region, an n-channel region between the n-type source region and the n-type drain region, and a NMOS metal gate region; an insulating layer above the p-channel region and the n-channel region, wherein the PMOS metal gate region and the NMOS metal gate region are above the insulating layer; and a gate contact between the NMOS metal gate region and the PMOS metal gate region.