公开(公告)号：US07401725B2

公开(公告)日：2008-07-22

申请号：US10741139

申请日：2003-12-19

申请人： Yiu Sing Ho ,  Guo Hong Lu ,  Can Hua Chen ,  Yuan Neng Luo ,  Jeffrey L. Wang ,  Liu Jun Zhang

发明人： Yiu Sing Ho ,  Guo Hong Lu ,  Can Hua Chen ,  Yuan Neng Luo ,  Jeffrey L. Wang ,  Liu Jun Zhang

IPC分类号： B23K31/00

CPC分类号： B23K20/023 ,  B23K2101/40 ,  G11B5/4846 ,  H05K1/189 ,  H05K3/323 ,  H05K3/3447 ,  H05K3/361 ,  H05K2201/10356 ,  Y10T29/49025

摘要： A system and method are disclosed for improving hard drive actuator lead attachment. In one embodiment, an actuator board is coupled to an actuator flexible cable by a bonding agent, such as an anisotropic conductive film (ACF). In one embodiment, an actuator flexible cable is coupled to one or more actuator coil leads, such as by solder bump bonding, and the flexible cable/actuator coil coupling is embedded in an actuator frame, such as by polymer injection molding.

摘要翻译： 公开了用于改善硬盘驱动器致动器引线附件的系统和方法。 在一个实施例中，致动器板通过诸如各向异性导电膜（ACF）之类的粘结剂耦合到致动器柔性电缆。 在一个实施例中，致动器柔性电缆例如通过焊料凸块接合而耦合到一个或多个致动器线圈引线，并且柔性电缆/致动器线圈联接器例如通过聚合物注射成型嵌入到致动器框架中。

公开(公告)号：US20060168796A1

公开(公告)日：2006-08-03

申请号：US11397162

申请日：2006-04-04

申请人： Liu Jun Zhang ,  Guo Hong Lu ,  Can Hua Chen ,  Yiu Sing Ho ,  Jeffery Wang

发明人： Liu Jun Zhang ,  Guo Hong Lu ,  Can Hua Chen ,  Yiu Sing Ho ,  Jeffery Wang

IPC分类号： G11B5/127 ,  B23P19/00

CPC分类号： G11B5/486 ,  G11B5/4846 ,  Y10T29/49025 ,  Y10T29/4903 ,  Y10T29/49032 ,  Y10T29/53165

摘要： A system and method are disclosed for improving the electrical connection of a hard drive relay flexible circuit assembly to a head-gimbal assembly (HGA) flexure cable. In one embodiment, a flexible circuit assembly is attached to a hard drive coil carriage via a U-shaped connector and is electrically coupled to the HGA flexure cable by a bonding agent, such as an Anisotropic Conductive Film (ACF).

摘要翻译： 公开了一种用于改进硬驱动继电器柔性电路组件到头部万向节组件（HGA）挠曲电缆的电连接的系统和方法。 在一个实施例中，柔性电路组件经由U形连接器连接到硬盘驱动器线圈架上，并且通过诸如各向异性导电膜（ACF）之类的粘结剂与HGA挠曲电缆电耦合。

公开(公告)号：US07245458B2

公开(公告)日：2007-07-17

申请号：US10767029

申请日：2004-01-28

申请人： Liu Jun Zhang ,  Guo Hong Lu ,  Can Hua Chen ,  Yiu Sing Ho ,  Jeffery L. Wang

发明人： Liu Jun Zhang ,  Guo Hong Lu ,  Can Hua Chen ,  Yiu Sing Ho ,  Jeffery L. Wang

IPC分类号： G11B5/55

CPC分类号： G11B5/486 ,  G11B5/4846 ,  Y10T29/49025 ,  Y10T29/4903 ,  Y10T29/49032 ,  Y10T29/53165

摘要： A system and method are disclosed for improving the electrical connection of a hard drive relay flexible circuit assembly to a head-gimbal assembly (HGA) flexure cable. In one embodiment, a flexible circuit assembly is attached to a hard drive coil carriage via a U-shaped connector and is electrically coupled to the HGA flexure cable by a bonding agent, such as an Anisotropic Conductive Film (ACF).

摘要翻译： 公开了一种用于改进硬驱动继电器柔性电路组件到头部万向节组件（HGA）挠曲电缆的电连接的系统和方法。 在一个实施例中，柔性电路组件经由U形连接器连接到硬盘驱动器线圈架上，并且通过诸如各向异性导电膜（ACF）之类的粘结剂与HGA挠曲电缆电耦合。

公开(公告)号：US07600310B2

公开(公告)日：2009-10-13

申请号：US11454599

申请日：2006-06-16

申请人： Yiu Sing Ho ,  Hiroshi Fukaya ,  Kam Fung Yip ,  Satoshi Yamaguchi ,  Jeffery L. Wang ,  Can Hua Chen

发明人： Yiu Sing Ho ,  Hiroshi Fukaya ,  Kam Fung Yip ,  Satoshi Yamaguchi ,  Jeffery L. Wang ,  Can Hua Chen

IPC分类号： H05K1/00 ,  G11B21/00

CPC分类号： G11B5/4853 ,  G11B5/4846 ,  G11B5/486 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/328 ,  H05K3/3447 ,  H05K2201/10303 ,  Y10T29/49025

摘要： A method for mounting a head stack assembly (HSA) circuit assembly is disclosed. A flexible circuit substrate may be coupled to a stiffener. The stiffener may be a metal, such as aluminum, or some other stiff and durable material. The flexible circuit substrate may be made of an organic material and may have a series of electronic leads embedded in the flexible circuit substrate. The flexible substrate may be coupled to the stiffener by an adhesive or laminated onto the stiffener. The stiffener may be mounted onto the actuator arm by soldering or by laser welding.

摘要翻译： 公开了一种用于安装磁头堆叠组件（HSA）电路组件的方法。 柔性电路基板可以耦合到加强件。 加强件可以是金属，例如铝，或一些其它刚性耐用的材料。 柔性电路基板可以由有机材料制成，并且可以具有嵌入柔性电路基板中的一系列电子引线。 柔性基底可以通过粘合剂耦合到加强件或层压到加强件上。 加强件可以通过焊接或通过激光焊接安装在致动器臂上。

公开(公告)号：US07522384B2

公开(公告)日：2009-04-21

申请号：US10753911

申请日：2004-01-07

申请人： Yiu Sing Ho ,  Hiroshi Fukaya ,  Kam Fung Yip ,  Satoshi Yamaguchi ,  Jeffery L. Wang ,  Can Hua Chen

发明人： Yiu Sing Ho ,  Hiroshi Fukaya ,  Kam Fung Yip ,  Satoshi Yamaguchi ,  Jeffery L. Wang ,  Can Hua Chen

IPC分类号： G11B5/55

CPC分类号： G11B5/4853 ,  G11B5/4846 ,  G11B5/486 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/328 ,  H05K3/3447 ,  H05K2201/10303 ,  Y10T29/49025

摘要： A method for mounting a head stack assembly (HSA) circuit assembly is disclosed. A flexible circuit substrate may be coupled to a stiffener. The stiffener may be a metal, such as aluminum, or some other stiff and durable material. The flexible circuit substrate may be made of an organic material and may have a series of electronic leads embedded in the flexible circuit substrate. The flexible substrate may be coupled to the stiffener by an adhesive or laminated onto the stiffener. The stiffener may be mounted onto the actuator arm by soldering or by laser welding.

公开(公告)号：US20050013055A1

公开(公告)日：2005-01-20

申请号：US10753911

申请日：2004-01-07

申请人： Yiu Sing Ho ,  Hiroshi Fukaya ,  Kam Fung Yip ,  Satoshi Yamaguchi ,  Jeffery Wang ,  Can Hua Chen

发明人： Yiu Sing Ho ,  Hiroshi Fukaya ,  Kam Fung Yip ,  Satoshi Yamaguchi ,  Jeffery Wang ,  Can Hua Chen

IPC分类号： G11B5/48 ,  G11B5/55 ,  G11B21/00 ,  H05K1/18 ,  H05K3/00 ,  H05K3/32 ,  H05K3/34

CPC分类号： G11B5/4853 ,  G11B5/4846 ,  G11B5/486 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/328 ,  H05K3/3447 ,  H05K2201/10303 ,  Y10T29/49025

摘要： A method for mounting a head stack assembly (HSA) circuit assembly is disclosed. A flexible circuit substrate may be coupled to a stiffener. The stiffener may be a metal, such as aluminum, or some other stiff and durable material. The flexible circuit substrate may be made of an organic material and may have a series of electronic leads embedded in the flexible circuit substrate. The flexible substrate may be coupled to the stiffener by an adhesive or laminated onto the stiffener. The stiffener may be mounted onto the actuator arm by soldering or by laser welding.

摘要翻译： 公开了一种用于安装磁头堆叠组件（HSA）电路组件的方法。 柔性电路基板可以耦合到加强件。 加强件可以是金属，例如铝，或一些其它刚性耐用的材料。 柔性电路基板可以由有机材料制成，并且可以具有嵌入柔性电路基板中的一系列电子引线。 柔性基底可以通过粘合剂耦合到加强件或层压到加强件上。 加强件可以通过焊接或通过激光焊接安装在致动器臂上。

公开(公告)号：US20060232890A1

公开(公告)日：2006-10-19

申请号：US11454599

申请日：2006-06-16

申请人： Yiu Sing Ho ,  Hiroshi Fukaya ,  Kam Fung Yip ,  Satoshi Yamaguchi ,  Jeffery Wang ,  Can Hua Chen

发明人： Yiu Sing Ho ,  Hiroshi Fukaya ,  Kam Fung Yip ,  Satoshi Yamaguchi ,  Jeffery Wang ,  Can Hua Chen

IPC分类号： H05K1/00

CPC分类号： G11B5/4853 ,  G11B5/4846 ,  G11B5/486 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/328 ,  H05K3/3447 ,  H05K2201/10303 ,  Y10T29/49025

摘要： A method for mounting a head stack assembly (HSA) circuit assembly is disclosed. A flexible circuit substrate may be coupled to a stiffener. The stiffener may be a metal, such as aluminum, or some other stiff and durable material. The flexible circuit substrate may be made of an organic material and may have a series of electronic leads embedded in the flexible circuit substrate. The flexible substrate may be coupled to the stiffener by an adhesive or laminated onto the stiffener. The stiffener may be mounted onto the actuator arm by soldering or by laser welding.