公开(公告)号：US20110170989A1

公开(公告)日：2011-07-14

申请号：US13004495

申请日：2011-01-11

申请人： Yukinori ABURATANI ,  Masakazu SHIMADA ,  Osamu MORITA

发明人： Yukinori ABURATANI ,  Masakazu SHIMADA ,  Osamu MORITA

IPC分类号： H01L21/673

CPC分类号： H01L21/67109

摘要： Provided is a substrate processing apparatus suppressing the vibration of a cover in an initial stage of unloading a boat from a process pipe. The substrate processing apparatus comprises: a boat for placing a substrate; a process pipe receiving the boat; a cover on which the boat is placed, the cover opening and closing a furnace port installed on a lower end of the process pipe; an elevation mechanism moving the cover upward and downward; a motor driving the elevation mechanism; a sealing member sealing a space between the cover and a lower end surface of the process pipe; and a controller controlling torque of the motor such that the substrate is maintained a rest position within the boat in a deformation recovery period of the cover occurring when the sealing member is removed from a surface of the cover or the lower end surface of the process pipe.

摘要翻译： 提供一种在从处理管卸载船的初始阶段抑制盖的振动的基板处理装置。 基板处理装置包括：用于放置基板的船; 接收船的加工管; 其上放置船的盖，盖打开和关闭安装在处理管的下端的炉口; 升降机构向上和向下移动盖子; 驱动升降机构的电机; 密封构件，其密封所述盖和所述处理管的下端面之间的空间; 以及控制器，其控制所述马达的扭矩，使得当所述密封构件从所述盖的表面或所述处理管的下端表面移除时，在所述盖的变形恢复期间，所述基板保持在所述船内的静止位置 。

公开(公告)号：US20100229416A1

公开(公告)日：2010-09-16

申请号：US12647952

申请日：2009-12-28

申请人： Yukinori ABURATANI ,  Seiyo NAKASHIMA ,  Masakazu SHIMADA

发明人： Yukinori ABURATANI ,  Seiyo NAKASHIMA ,  Masakazu SHIMADA

IPC分类号： F26B25/08

CPC分类号： H01L21/67757 ,  H01L21/67109 ,  H01L21/67115

摘要： Provided is a substrate processing apparatus that can decrease the time necessary for cooling a processed wafer for improving the throughput. The substrate processing apparatus comprises: a process chamber configured to process a substrate; a substrate supporter configured to support the substrate and load the substrate into the process chamber; a transfer mechanism configured to carry the substrate to the substrate supporter; and a non-sealing type shield part installed between the substrate supporter and the transfer mechanism.

摘要翻译： 提供了一种可以减少冷却处理晶片所需的时间以提高生产量的基板处理装置。 基板处理装置包括：处理室，被配置为处理基板; 衬底支撑件，其构造成支撑所述衬底并将所述衬底加载到所述处理室中; 传送机构，其构造成将所述基板运送到所述基板支撑件; 以及安装在基板支撑件和转印机构之间的非密封型屏蔽部。

公开(公告)号：US20080087218A1

公开(公告)日：2008-04-17

申请号：US11905090

申请日：2007-09-27

申请人： Masakazu SHIMADA ,  Hideyuki TSUKAMOTO

发明人： Masakazu SHIMADA ,  Hideyuki TSUKAMOTO

IPC分类号： H01L21/00 ,  B05C11/00

CPC分类号： H01L21/67253 ,  C23C16/54 ,  H01L21/67109 ,  H01L21/67772 ,  H01L21/67775

摘要： A board processing apparatus and a method of fabricating a semiconductor apparatus for reducing a pressure difference between a preparing chamber and a processing chamber and restraining a rapid flow of a gas caused by the pressure difference to thereby prevent a board from being contaminated by a particle are disclosed.

摘要翻译： 一种板处理装置和制造半导体装置的方法，用于减小制备室和处理室之间的压力差并抑制由压力差引起的气体的快速流动，从而防止板被颗粒污染， 披露