公开(公告)号：US06682657B2

公开(公告)日：2004-01-27

申请号：US09101306

申请日：1998-07-07

申请人： David T Dutton ,  Anthony B Dean

发明人： David T Dutton ,  Anthony B Dean

IPC分类号： B81B704

CPC分类号： H01L21/0337 ,  G02B3/0012 ,  G02B3/0018 ,  G02B3/0056 ,  G03F7/001 ,  G03F7/40

摘要： A method of forming three-dimensional structures on a substrate by a single reactive ion each run whereby a mask is formed on said substrate before a series of iterations are carried out, each iteration including a mask etch and a substrate etch, so that successive iterations give life to reduction in the mask area and exposure of further areas of substrate.

摘要翻译： 通过单个反应离子在衬底上形成三维结构的方法每次运行，由此在进行一系列迭代之前在所述衬底上形成掩模，每次迭代包括掩模蚀刻和衬底蚀刻，使得连续迭代 使生命减少面罩区域和曝光更多的底物。

公开(公告)号：US06583374B2

公开(公告)日：2003-06-24

申请号：US09788928

申请日：2001-02-20

申请人： Michael J. Knieser ,  Richard D. Harris ,  Robert J. Kretschmann ,  Ernst H. Dummermuth ,  Patrick C. Herbert

发明人： Michael J. Knieser ,  Richard D. Harris ,  Robert J. Kretschmann ,  Ernst H. Dummermuth ,  Patrick C. Herbert

IPC分类号： B81B704

CPC分类号： H02N1/008

摘要： A microelectricalmechanical system (MEMS) digital isolator may be created in which an actuator such as an electrostatic motor drives a beam against a predefined force set, for example, by another electrostatic motor. When the threshold of the opposing force is overcome, motion of the beam may be sensed by a sensor also attached to the beam. The beam itself is electrically isolated between the locations of the actuator and the sensor. The structure may be incorporated into integrated circuits to provide on-chip isolation.

公开(公告)号：US06309554B1

公开(公告)日：2001-10-30

申请号：US09276908

申请日：1999-03-26

申请人： Akira Fujishima ,  Hideki Masuda

发明人： Akira Fujishima ,  Hideki Masuda

IPC分类号： B81B704

CPC分类号： H01J9/025 ,  H01J2201/30457

摘要： A method of producing a needle-like diamond structure including the steps of forming a layer of anodized alumina on a diamond substrate, the anodized alumina having a plurality of through holes; vapor-depositing a substance resistant to plasma etching by a vacuum vapor-depositing method to form dots on said diamond substrate, wherein the layer of anodized alumina acts as a mask for the vapor deposition; removing the anodized alumina; and performing a plasma etching treatment while using the dots as a mask, thereby forming regularly-arranged, needle-like diamond columns.

摘要翻译： 一种制造针状金刚石结构的方法，包括以下步骤：在金刚石基底上形成阳极化氧化铝层，所述阳极化氧化铝具有多个通孔; 通过真空气相沉积方法气相沉积耐等离子体蚀刻的物质，以在所述金刚石基底上形成点，其中阳极氧化的氧化铝层用作气相沉积的掩模; 去除阳极氧化的氧化铝; 并且在使用点作为掩模的同时进行等离子体蚀刻处理，从而形成规则排列的针状菱形柱。

公开(公告)号：US06607673B2

公开(公告)日：2003-08-19

申请号：US09932833

申请日：2001-08-17

申请人： Akira Fujishima ,  Hideki Masuda

发明人： Akira Fujishima ,  Hideki Masuda

IPC分类号： B81B704

CPC分类号： C23C16/56 ,  C23C16/045 ,  C23C16/27 ,  H01J9/025 ,  H01J2201/30457

摘要： A cylinder array of diamond having a dent in its cylinder top face is manufactured by subjecting a cylinder array of diamond to a plasma etching.

公开(公告)号：US06533947B2

公开(公告)日：2003-03-18

申请号：US09894021

申请日：2001-06-27

申请人： Steven Nasiri ,  James H. Smith ,  David Lambe Marx ,  Mitchell Joseph Novack

发明人： Steven Nasiri ,  James H. Smith ,  David Lambe Marx ,  Mitchell Joseph Novack

IPC分类号： B81B704

CPC分类号： G02B26/0841 ,  B81B3/0062

摘要： Method for manufacturing microelectromechanical mirror and mirror array. Control electrodes and addressing circuitry are etched from a metallic layer deposited onto a reference layer substrate. Standoff-posts are etched from a subsequently deposited polyimide layer. A freely movable plate flexibly suspended from a plurality of electrostatic actuators that are flexibly suspended from a support frame is etched from an actuation layer substrate using a high aspect ratio etch. A mirror support post and surface are etched from a mirror substrate using a high aspect ratio etch. The mirror and actuation layer substrates are fusion bonded together. The reference and actuation layer substrates are bonded together and held apart by the standoff posts. A reflective metallic layer is deposited onto the mirror surface and polished. The mirror is etched from the mirror surface to free the microelectromechanical mirror. Mirror arrays are made by performing the aforementioned steps using standard IC processing techniques.