公开(公告)号：US20050155629A1

公开(公告)日：2005-07-21

申请号：US10816432

申请日：2004-03-31

申请人： Michael Ravkin ,  John de Larios

发明人： Michael Ravkin ,  John de Larios

IPC分类号： H01L21/00 ,  B08B7/00

CPC分类号： H01L21/67051 ,  H01L21/67028 ,  H01L21/67046 ,  Y10S134/902

摘要： A method for cleaning and drying a front and a back surface of a substrate is provided. The method includes brush scrubbing the back surface of the substrate using a brush scrubbing fluid chemistry. The method further includes applying a front meniscus onto the front surface of the substrate upon completing the brush scrubbing of the back surface. The front meniscus includes a front cleaning chemistry that is chemically compatible with the brush scrubbing fluid chemistry.

摘要翻译： 提供了用于清洁和干燥基板的前表面和后表面的方法。 该方法包括使用刷洗涤流体化学刷刷洗衬底的背面。 该方法进一步包括在完成后表面的刷子洗涤时将前弯月面施加到基底的前表面上。 前弯液面包括与刷洗涤液化学物质化学相容的前清洗化学物质。

公开(公告)号：US06624078B1

公开(公告)日：2003-09-23

申请号：US10196849

申请日：2002-07-15

申请人： Michael Ravkin

发明人： Michael Ravkin

IPC分类号： H01L21461

CPC分类号： H01L22/34

摘要： A method for using a monitor substrate to determine effectiveness of a cleaning operation is provided. The method includes selecting a substrate from a lot of substrates and inspecting a surface of the substrate to determine a roughness profile of the substrate. The monitor substrate is then processed through a cleaning operation, and the monitor substrate is patterned with die regions throughout. Each of the die regions has a plurality of areas defining distinct roughness simulations. The method the proceeds to inspecting the monitor substrate at one die region and at one of the plurality of areas in the one die region that most closely resembles the roughness profile of the substrate. The inspecting of the monitor substrate is configured to yield data regarding cleaning performance of the cleaning operation.

摘要翻译： 提供了一种使用监视器基板来确定清洁操作的有效性的方法。 该方法包括从许多基底中选择基底并检查基底的表面以确定基底的粗糙度轮廓。 然后通过清洁操作处理监视器基板，并且整个监视器基板被图案化。 每个模具区域具有限定不同粗糙度模拟的多个区域。 该方法用于在一个管芯区域和一个管芯区域中与该衬底的粗糙度轮廓最相似的多个区域中的一个区域中检查监测器衬底。 监视器基板的检查被配置为产生关于清洁操作的清洁性能的数据。

公开(公告)号：US06607072B2

公开(公告)日：2003-08-19

申请号：US10193803

申请日：2002-07-11

申请人： Brian M. Bliven ,  Michael Ravkin

发明人： Brian M. Bliven ,  Michael Ravkin

IPC分类号： B65G1312

CPC分类号： H01L21/67706 ,  H01L21/67046 ,  H01L21/6776 ,  Y10S134/902

摘要： A wheel for a conveyor system for transporting semiconductor wafers includes a first section for supporting a semiconductor wafer at a first level and a second section for supporting the wafer at a second level, with the first level being higher than the second level. In one embodiment, each of the first and second sections is semicircular. The first level may be substantially the same as a level at which the wafer is subjected to a wafer cleaning operation, and the distance the second level is below the first level may be in a range from about one sixteenth of an inch to about three sixteenths of an inch. A conveyor system for transporting wafers and a method for transferring wafers from a conveyor system to a wafer processing station also are described.

公开(公告)号：US06425158B2

公开(公告)日：2002-07-30

申请号：US09918667

申请日：2001-07-27

申请人： Michael Ravkin

发明人： Michael Ravkin

IPC分类号： B08B104

CPC分类号： H01L21/67046 ,  Y10S134/902

摘要： A method and apparatus for processing wafer edges is disclosed. Pressure applied to the wafer at one end of A brush/pad assembly is greater than at the opposite end of the brush/pad assembly. The increased pressure causes wafer rotation to slow or to reverse direction as compared to less pressure applied by the brush/pad assembly. In one embodiment slowed rotation causes a difference in tangential velocity between the roller(s) and the wafer edge/bevel that causes pads in the roller(s) to process the edge/bevel of the wafer. In another embodiment, the opposite direction of rotation causes the wafer to rotate counter to rollers otherwise causing the wafer to rotate. Cleaning surfaces in the rollers clean the edges of the wafer whether rotation is slowed or reversed.

摘要翻译： 公开了一种用于处理晶片边缘的方法和装置。 在刷/垫组件的一端施加到晶片的压力大于刷/垫组件的相对端。 与由刷/垫组件施加的较小压力相比，增加的压力导致晶片旋转减慢或反向。 在一个实施例中，减速旋转导致辊和晶片边缘/斜面之间的切向速度的差异导致辊中的垫处理晶片的边缘/斜面。 在另一个实施例中，相反的旋转方向导致晶片相对于辊旋转，否则导致晶片旋转。 滚筒中的清洁表面清洁晶片的边缘，无论旋转是否减速或反转。

公开(公告)号：US06272712B1

公开(公告)日：2001-08-14

申请号：US09612537

申请日：2000-07-07

申请人： Thomas R. Gockel ,  Lorin Olson ,  Lynn Ryle ,  Brett A. Whitelaw ,  Michael Ravkin

发明人： Thomas R. Gockel ,  Lorin Olson ,  Lynn Ryle ,  Brett A. Whitelaw ,  Michael Ravkin

IPC分类号： A46B1302

CPC分类号： H01L21/67046

摘要： A semiconductor processing system, such as a system for scrubbing both sides of a wafer at the same time, that includes a brush box containment apparatus for use with highly-acidic or other volatile chemical solutions, a roller positioning apparatus and a (brush) placement device.

摘要翻译： 半导体处理系统，例如用于同时洗涤晶片的两侧的系统，其包括用于与高酸性或其它挥发性化学溶液一起使用的刷盒容纳装置，辊定位装置和（刷）放置 设备。