公开(公告)号：US06525552B2

公开(公告)日：2003-02-25

申请号：US09854152

申请日：2001-05-11

Applicant: January Kister

Inventor： January Kister

IPC: G01R3102

CPC classification number: G01R1/07378

Abstract: A probe apparatus is provided with a number of space transformer segments that are fixated such that probe offset due to warping is kept to a minimum. In a first embodiment, the space transformer segments are permanently fixated. In a second embodiment the space transformer segments are included together with correspondingly shaped sheath segments in probe modules that may be individually removed from the probe apparatus for a selective maintenance. As a result a large number of chips may be tested simultaneously without reducing the operational cycle interval of the probe apparatus.

公开(公告)号：US5751157A

公开(公告)日：1998-05-12

申请号：US681226

申请日：1996-07-22

Applicant: January Kister

Inventor： January Kister

IPC: G01R1/073 ,  G01R31/02

CPC classification number: G01R1/07342 ,  G01R1/07364

Abstract: This invention presents a method for aligning a set of probes in a circuit testing apparatus with a set of pads of a circuit under test and the apparatus designed according to this method. The alignment includes the steps of selecting a first group G1 of probes from the set, such that all probes in group G1 have the same tip length L1 and the same beam length L2, and mounting each probe of group G1 on a first mounting block which has a first through-hole for each probe and a first removable portion which includes the first through-hole. During the mounting step the tip portion is placed in the through-hole, the mounting portion is attached to the first mounting block and the first removable portion is discarded. Then, a second mounting block is placed on the first mounting block and a second group G2 of probes selected from the set is mounted it in the same manner as group G1 on the first block. The blocks are aligning on top of each other by using guide holes and positioning holes in conjunction with a corresponding vertical fixing pin and a tiltable positioning pin.

Abstract translation: 本发明提出了一种用于将电路测试装置中的一组探针与被测电路的一组焊盘对准的方法，以及根据该方法设计的装置。 该对准包括从组中选择探针的第一组G1的步骤，使得组G1中的所有探针具有相同的尖端长度L1和相同的束长度L2，并将组G1的每个探针安装在第一安装块上， 具有用于每个探针的第一通孔和包括第一通孔的第一可移除部分。 在安装步骤期间，尖端部分放置在通孔中，安装部分附接到第一安装块，并且第一可移除部分被丢弃。 然后，将第二安装块放置在第一安装块上，并且以与组G1在第一块上相同的方式将从组中选择的探针的第二组G2安装在其上。 通过使用导向孔和定位孔与相应的垂直固定销和可倾斜的定位销相结合，块彼此对齐。

公开(公告)号：US5720098A

公开(公告)日：1998-02-24

申请号：US440521

申请日：1995-05-12

Applicant: January Kister

Inventor： January Kister

IPC: G01R1/067 ,  G01R1/073 ,  H01R13/24 ,  H01R43/16 ,  G01R1/02 ,  G01R3/00

CPC classification number: H01R13/2464 ,  G01R1/06738 ,  H01R12/714 ,  Y10T29/49 ,  Y10T29/49117 ,  Y10T29/49204

Abstract: The invention presents a method and a correspondingly designed probe for achieving uniform stress distribution when experiencing deflection. The probe has a top edge, a bottom edge, a tip, and a beam portion defined by selecting an inflection point along the top edge, such that the beam portion is contained between the tip and the inflection point, and the bottom edge below the beam portion is approximately straight, while the curvature of the top edge of the beam portion is fitted to a parabola. The tip has an outer edge, an inner edge, and a point of contact at the location where the outer and inner edges join. The inner edge is approximately straight while the curvature of the outer edge is fitted to a second parabola. The probe is preferably mounted in a support structure having a groove for receiving the probe such that the beam portion is free to move vertically in the groove and constrained laterally to prevent side-buckling.

Abstract translation: 本发明提出了一种方法和相应设计的探针，用于在经历偏转时实现均匀的应力分布。 探头具有顶边缘，底边缘，尖端以及沿着顶边缘选择拐点而限定的梁部分，使得梁部分包含在尖端和拐点之间，并且底部边缘在 梁部分近似直线，而梁部分的顶部边缘的曲率拟合成抛物线。 尖端在外边缘和内边缘连接的位置处具有外边缘，内边缘和接触点。 内边缘大致直线，而外边缘的曲率适合于第二抛物线。 探针优选地安装在具有用于接收探针的凹槽的支撑结构中，使得梁部分在凹槽中自由地垂直移动并且侧向约束以防止侧向屈曲。

公开(公告)号：US5422574A

公开(公告)日：1995-06-06

申请号：US4447

申请日：1993-01-14

Applicant: January Kister

Inventor： January Kister

IPC: G01R1/073 ,  G01R1/06

CPC classification number: G01R1/0735

Abstract: An embodiment of the present invention is a probe membrane with a center contact bump area and a plurality of signal connection sections separated by triangular reliefs in the membrane and terminating in a tangential row of contacts for wire bonding to a probe card. The system of triangular reliefs in the membrane allows the membrane to be puckered up such that the center contact bump area is raised approximately ninety mils above the general plane of the probe card. When the membrane has been fixed in its puckered up position, the triangular reliefs in the membrane form several radial rectangular slits. A translator gimbal attached to the center of the membrane provides stability and contact force for the contact bumps to a DUT. Areas of transparency in the vicinity of the contact bump area allows a user to view the I/O pads of a DUT for alignment with the contact bumps in the membrane.

Abstract translation: 本发明的一个实施例是具有中心接触凸块区域和多个信号连接部分的探针膜片，多个信号连接部分被隔膜中的三角形浮雕分开，并且终止于用于引线接合到探针卡的切线触点。 膜中的三角形浮雕的系统允许膜被折起，使得中心接触凸起区域在探针卡的总平面之上大约九十密耳升高。 当膜已经固定在其褶皱的位置时，膜中的三角形浮雕形成几个径向矩形狭缝。 连接到膜的中心的平移万向架提供了接触凸块到DUT的稳定性和接触力。 在接触凸块区域附近的透明区域允许用户观察DUT的I / O焊盘以与膜中的接触凸块对准。