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公开(公告)号：US07457128B2
公开(公告)日：2008-11-25
申请号：US11187302
申请日：2005-07-22
申请人： Eric C. Peterson
发明人： Eric C. Peterson
IPC分类号： H05K7/00
摘要： A cell configuration for a multi-processor system comprises: a first circuit board comprising: a single processor; a single processor agent coupled electrically to the single processor; and a plurality of memory modules coupled electrically to the single processor agent; a second circuit board comprising: a single processor; a single processor agent coupled electrically to the single processor; and a plurality of memory modules coupled electrically to the single processor agent; and wherein the first and second circuit boards are inter-connected in such a manner to form an electrical connection between the single processor of the first circuit board and the single processor agent of the second circuit board and an electrical connection between the single processor of the second circuit board and the single processor agent of the first circuit board.
摘要翻译： 一种用于多处理器系统的单元配置包括：第一电路板，包括：单个处理器; 与单个处理器电耦合的单个处理器; 以及多个存储器模块，其电耦合到所述单个处理器代理; 第二电路板，包括：单个处理器; 与单个处理器电耦合的单个处理器; 以及多个存储器模块，其电耦合到所述单个处理器代理; 并且其中所述第一和第二电路板以这样的方式相互连接，以在所述第一电路板的单个处理器和所述第二电路板的所述单个处理器代理之间形成电连接，以及所述第一电路板的所述单个处理器之间的电连接 第二电路板和第一电路板的单处理器。
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公开(公告)号：US07447043B2
公开(公告)日：2008-11-04
申请号：US10743611
申请日：2003-12-22
CPC分类号： H05K5/0247 , H01R13/68 , H01R24/76 , H01R2103/00
摘要： A fused power cable assembly and method of integrating a protective device with a power source connector retaining bracket. A bracket assembly having a bulkhead retaining element, a protective device element, and a retaining element operable to couple the protective device to the bracket allows for mounting of protective device(s) to the bracket instead of the bulkhead, thereby saving space. A power cabling assembly having a bracket assembly, a power connector, and a fastening element operable to couple the power connector to the bulkhead and the bulkhead to the bracket assembly, allowing assembly of the power cabling assembly prior to installation into target equipment.
摘要翻译： 熔接电力电缆组件和将保护装置与电源连接器固定支架集成的方法。 具有隔板保持元件，保护装置元件和可操作以将保护装置联接到支架的保持元件的支架组件允许将保护装置安装到支架而不是隔板，从而节省空间。 一种电力布线组件，其具有支架组件，电源连接器和可操作以将电源连接器耦合到隔板和隔板到支架组件的紧固元件，允许在安装到目标设备之前组装电力电缆组件。
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93.发明授权公开(公告)号：US07403396B2
公开(公告)日：2008-07-22
申请号：US11039042
申请日：2005-01-20
CPC分类号： H05K7/1492 , H05K7/1498
摘要： A system comprises an electronic module slidably mounted in the system, a first assembly including at least one wireless transceiver mounted in the system, and a second assembly including at least one wireless transceiver to communicate wirelessly with the wireless transceiver of the first assembly. The second assembly is attached to the electronic module, and the wireless transceivers of the first and second assemblies continue communicating as the electronic module is slidably moved in the system.
摘要翻译： 系统包括可滑动地安装在系统中的电子模块，包括安装在系统中的至少一个无线收发器的第一组件和包括至少一个无线收发器的第二组件，以与第一组件的无线收发器进行无线通信。 第二组件附接到电子模块，并且随着电子模块在系统中可滑动地移动，第一组件和第二组件的无线收发器继续通信。
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公开(公告)号：US07379297B2
公开(公告)日：2008-05-27
申请号：US11586300
申请日：2006-10-25
IPC分类号： H05K7/20
CPC分类号： G06F1/206 , H01L23/467 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： In one embodiment, an airflow regulation device comprises a at least one base member configured to couple to a connector on a circuit board, a first segment connected to the at least one base member and extending a first height from the at least one base member, and a second segment removably connected to the first segment and extending a second height from the at least one base member, wherein the second height is different than the first height.
摘要翻译： 在一个实施例中，气流调节装置包括配置成耦合到电路板上的连接器的至少一个基座构件，连接到所述至少一个基座构件并且从所述至少一个基座构件延伸第一高度的第一段， 以及第二段，其可移除地连接到所述第一段并且从所述至少一个基座构件延伸第二高度，其中所述第二高度不同于所述第一高度。
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公开(公告)号：US20080055868A1
公开(公告)日：2008-03-06
申请号：US11511602
申请日：2006-08-29
申请人： Eric C. Peterson , Mark Edward Shaw
发明人： Eric C. Peterson , Mark Edward Shaw
IPC分类号： H05K5/00
CPC分类号： H05K7/20727
摘要： A multi-processor system architecture comprises: a cabinet; a plurality of processor cell modules disposed within the cabinet; a plurality of link router modules disposed within the cabinet; and a plurality of cables connecting the plurality of processor cell modules through the plurality of link router modules.
摘要翻译： 多处理器系统架构包括：机柜; 设置在机柜内的多个处理器单元模块; 设置在机柜内的多个链路路由器模块; 以及通过所述多个链路路由器模块连接所述多个处理器单元模块的多条电缆。
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公开(公告)号：US07280365B2
公开(公告)日：2007-10-09
申请号：US11061156
申请日：2005-02-18
申请人： Steven A. Belson , Shaun L. Harris , Eric C. Peterson , Gary W. Williams , Christian L. Belady , Jeffrey P. Christenson
发明人： Steven A. Belson , Shaun L. Harris , Eric C. Peterson , Gary W. Williams , Christian L. Belady , Jeffrey P. Christenson
IPC分类号： H05K7/20
CPC分类号： H05K1/141 , H05K1/0203 , H05K1/0263 , H05K2201/066 , H05K2201/0979 , H05K2201/10189
摘要： One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB having at least two processors. The second PCB is coupled to and disposed above the first PCB. A thermal dissipation device dissipates heat away from the processors. First and second power modules supply power to the second PCB and are separated and redundant power supplies such that upon failure of the first power module, the second power module can provide power for both power modules to the second PCB.
摘要翻译： 一个实施例包括具有第一印刷电路板（PCB）和具有至少两个处理器的第二PCB的电子组件。 第二PCB耦合到并设置在第一PCB上方。 散热装置将散热物从处理器中散出。 第一和第二电源模块向第二PCB提供电源，并且是分离的和冗余的电源，使得在第一电源模块故障时，第二电源模块可为两个电源模块向第二个PCB提供电力。
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公开(公告)号：US07096926B2
公开(公告)日：2006-08-29
申请号：US10831059
申请日：2004-04-22
IPC分类号： F28F7/00
CPC分类号： F28F23/00 , H01L23/433 , H01L2924/0002 , H01L2924/3011 , H05K3/0058 , H01L2924/00
摘要： A sealed pouch constructed of thermally conductive flexible material containing a low melting point, thermally conductive material is placed between two components that require thermal continuity. This assembly is then loaded in compression and heated to the melting point of the low melting point, thermally conductive material, which then melts within the sealed pouch, and conforms to the shape of the two components. The sealed pouch also may contain a springy material made of a metal, or a solder compatible plastic or organic to help maintain shape of the pouch in some applications.
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公开(公告)号：US07064955B2
公开(公告)日：2006-06-20
申请号：US10996477
申请日：2004-11-24
申请人： Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady , Jeffrey P. Christenson
发明人： Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady , Jeffrey P. Christenson
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , G06F1/184 , G06F1/185 , G06F1/20 , G06F1/263 , H01L2924/0002 , H05K1/0203 , H05K1/0263 , H05K1/141 , H05K2201/0979 , H05K2201/10189 , H05K2201/1056 , Y10T307/505 , H01L2924/00
摘要： One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB. The second PCB has at least one processor coupled to and disposed above the first PCB. A thermal dissipation device is disposed above the second PCB, dissipates heat away from the processor, and provides an airflow path. First and second power systems are coupled to the second PCB and in a pathway of the airflow path. The first and second power systems are redundant such that upon failure of the first power system, the second power system can provide power for both power systems.
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公开(公告)号：US07047603B2
公开(公告)日：2006-05-23
申请号：US10700010
申请日：2003-11-03
IPC分类号： A44B21/00
CPC分类号： B65D67/02 , Y10T24/44641 , Y10T24/44684 , Y10T24/44778
摘要： A flexible wirelike retainer clip is adapted to hold a plurality of disc-like rings in a stacked assembly. The retainer clip is resilient and can be selectively actuated to hold the rings in a stacked position to facilitate handling for various purposes such as processing the rings while stacked, shipping the rings while stacked and to facilitate release of the rings for assembly to other components. The resilience of the retainer clip facilitates accommodating stacks of rings within a range of varying lengths.
摘要翻译： 柔性线状保持夹适于将多个盘状环保持在堆叠组件中。 保持夹是弹性的并且可以选择性地致动以将环保持在堆叠位置，以便于各种目的的操作，例如堆叠时处理环，在堆叠时运送环，并且有助于环的释放以组装到其他部件。 保持夹的弹性有助于在不同长度的范围内容纳环的堆叠。
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公开(公告)号：US06695042B1
公开(公告)日：2004-02-24
申请号：US10209981
申请日：2002-07-31
IPC分类号： F28D1500
CPC分类号： F28F13/00 , F28F2013/006 , H01L21/4882 , H01L23/4338 , H01L2924/0002 , H01L2924/3011 , Y10T29/49353 , H01L2924/00
摘要： A heat sink is constructed including at least one thermally conductive pedestal, allowing configuration of the heat sink to make contact with a plurality of heat-generating electronic devices where the devices may not be co-planar due to tolerance stack-up. The pedestals may be raised and lowered and tilted as needed to match the heights and tilts of the electronic devices. Within the heat sink is a cavity above the pedestal that may be filled with a thermally conductive material, such as solder, or a thermally conductive liquid, during construction to create a low thermal resistance contact between the pedestal and the heat sink fins. Also, thermally conductive material, such as thermal paste or a thermal pad, may be used between the heat generating device and the pedestal to create a low thermal resistance contact.
摘要翻译： 构造了散热器，其包括至少一个导热基座，允许散热器的配置与多个发热电子器件接触，其中由于公差叠加，器件可能不是共面的。 基座可以根据需要升高和降低并倾斜以匹配电子设备的高度和倾斜度。 在散热器内部是在基座上方的空腔，其可以在构造期间填充有导热材料，例如焊料或导热液体，以在基座和散热鳍片之间产生低热阻接触。 此外，可以在发热装置和基座之间使用导热材料，例如热膏或热垫，以产生低热阻接触。
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