Process control using physical modules and virtual modules
    93.
    发明授权
    Process control using physical modules and virtual modules 有权
    使用物理模块和虚拟模块进行过程控制

    公开(公告)号:US07451011B2

    公开(公告)日:2008-11-11

    申请号:US10927514

    申请日:2004-08-27

    CPC classification number: H01L22/20 G05B2219/45031

    Abstract: The invention relates to controlling a semiconductor processing system. Among other things, the invention relates to a run-to-run controller to create virtual modules to control a multi-pass process performed by a multi-chamber tool during the processing of a semiconductor wafer.

    Abstract translation: 本发明涉及控制半导体处理系统。 其中,本发明涉及一种运行到运行的控制器,用于创建虚拟模块以控制在半导体晶片的处理期间由多室工具执行的多遍处理。

    Dynamic metrology sampling with wafer uniformity control
    95.
    发明申请
    Dynamic metrology sampling with wafer uniformity control 审中-公开
    具有晶圆均匀性控制的动态计量采样

    公开(公告)号:US20070238201A1

    公开(公告)日:2007-10-11

    申请号:US11390415

    申请日:2006-03-28

    CPC classification number: H01L22/12

    Abstract: A method of processing a wafer is presented that includes creating a pre-processing measurement map using measured metrology data for the wafer including metrology data for at least one isolated structure on the wafer, metrology data for at least one nested structure on the wafer, bi-layer mask data, and BARC layer data. At least one pre-processing prediction map is calculated for the wafer. A pre-processing confidence map is calculated for the wafer. The pre-processing confidence map includes a set of confidence data for the plurality of dies on the wafer. A prioritized measurement site is determined when the confidence data for one or more dies is not within the confidence limits. A new measurement recipe that includes the prioritized measurement site is then created.

    Abstract translation: 提出了一种处理晶片的方法,其包括使用测量的晶片的测量数据创建预处理测量图,包括晶片上的至少一个隔离结构的测量数据,晶片上的至少一个嵌套结构的度量数据,bi 层掩模数据和BARC层数据。 为晶片计算至少一个预处理预测图。 计算晶片的预处理置信图。 预处理置信图包括晶片上的多个管芯的一组置信数据。 当一个或多个管芯的置信度数据不在置信限度内时,确定优先测量点。 然后创建包含优先测量站点的新测量配方。

    Wafer-to-wafer control using virtual modules
    96.
    发明授权
    Wafer-to-wafer control using virtual modules 有权
    使用虚拟模块进行晶圆到晶片控制

    公开(公告)号:US07212878B2

    公开(公告)日:2007-05-01

    申请号:US10927500

    申请日:2004-08-27

    Abstract: The invention relates to controlling a semiconductor processing system. Among other things, the invention relates to a run-to-run controller to create virtual modules to control a multi-pass process performed by a multi-chamber tool during the processing of a semiconductor wafer.

    Abstract translation: 本发明涉及控制半导体处理系统。 其中,本发明涉及一种运行到运行的控制器,用于创建虚拟模块以控制在半导体晶片的处理期间由多室工具执行的多遍处理。

    Iso/nested cascading trim control with model feedback updates
    97.
    发明申请
    Iso/nested cascading trim control with model feedback updates 有权
    Iso /嵌套级联调整控制与模型反馈更新

    公开(公告)号:US20060064193A1

    公开(公告)日:2006-03-23

    申请号:US10944463

    申请日:2004-09-20

    CPC classification number: H01L22/20 H01L21/32139 H01L2924/0002 H01L2924/00

    Abstract: This method includes a method for etch processing that allows the bias between isolated and nested structures/features to be adjusted, correcting for a process wherein the isolated structures/features need to be smaller than the nested structures/features and wherein the nested structures/features need to be reduced relative to the isolated structures/features, while allowing for the critical control of trimming.

    Abstract translation: 该方法包括用于蚀刻处理的方法,其允许调整隔离结构/嵌套结构/特征之间的偏置,校正其中隔离结构/特征需要小于嵌套结构/特征的过程,并且其中嵌套结构/特征 需要相对于孤立的结构/特征而减少,同时允许对修剪的关键控制。

    Formula-based run-to-run control
    98.
    发明申请
    Formula-based run-to-run control 有权
    基于公式的运行控制

    公开(公告)号:US20060015206A1

    公开(公告)日:2006-01-19

    申请号:US10890410

    申请日:2004-07-14

    Abstract: A dual chamber apparatus including a first chamber and a second chamber which is configured to be coupled to the first chamber at an interface. Each of the first chamber and the second chamber has a transfer opening located at the interface. An insulating plate is located on one of the first chamber and the second chamber at the interface and is configured to have a low thermal conductivity such that the first chamber and the second chamber can be independently controlled at different temperatures when the first chamber and the second chamber are coupled together. Additionally, the apparatus may include an alignment device and/or a fastening device for fastening the first chamber to the second chamber. In embodiments, the insulating plate may be constructed of Teflon. Further, the first chamber may be a chemical oxide removal treatment chamber and the second chamber may be a heat treatment chamber.

    Abstract translation: 一种双室装置,包括第一室和第二室,其构造成在界面处联接到第一室。 第一室和第二室中的每个具有位于界面处的传送开口。 绝缘板位于界面处的第一室和第二室中的一个上,并被构造成具有低导热性,使得当第一室和第二室可以在不同的温度下独立地控制第一室和第二室 腔室耦合在一起。 另外,该装置可以包括用于将第一室紧固到第二室的对准装置和/或紧固装置。 在实施例中,绝缘板可以由特氟隆构成。 此外,第一室可以是化学除氧处理室,第二室可以是热处理室。

    Method and apparatus for simplified system configuration
    100.
    发明申请
    Method and apparatus for simplified system configuration 审中-公开
    用于简化系统配置的方法和装置

    公开(公告)号:US20050065630A1

    公开(公告)日:2005-03-24

    申请号:US10966112

    申请日:2004-10-18

    Abstract: A GUI is presented for configuring and initializing a semiconductor processing system, which includes a number of processing tools, a number of processing modules, a number of sensors, a number of processing models, and an alarm management system. The graphical display is organized so that all significant parameters are clearly and logically displayed so that the user is able to perform the desired configuration, initialization, and troubleshooting tasks with as little input as possible. The GUI is web-based and is viewable by a user using a web browser.

    Abstract translation: 提供了用于配置和初始化半导体处理系统的GUI,其包括多个处理工具,多个处理模块,多个传感器,多个处理模型和警报管理系统。 图形显示被组织,使得所有重要的参数都被清楚和逻辑地显示,使得用户能够以尽可能少的输入执行所需的配置,初始化和故障排除任务。 GUI是基于Web的,并且可以由使用web浏览器的用户查看。

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