公开(公告)号：US20190234921A1

公开(公告)日：2019-08-01

申请号：US16258453

申请日：2019-01-25

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: G01N33/00

CPC classification number: G01N33/0016 ,  G01N21/88 ,  G01N33/0031

Abstract: The present invention relates to an air quality measuring apparatus, which has a structure for minimizing interference between a particulate matter sensor, a gas sensor, and a humidity sensor and measures air quality by generating air flow therein by using a pumping part capable of pumping restoration.

公开(公告)号：US20190214537A1

公开(公告)日：2019-07-11

申请号：US16235706

申请日：2018-12-28

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: H01L33/62 ,  H01L25/075 ,  H01L27/12 ,  H01L23/00

Abstract: The present invention relates to a micro LED structure and a method of manufacturing the same. More particularly, the present invention relates to a micro LED structure and a method of manufacturing the same, the micro LED structure including: a micro LED; a circuit board driving the micro LED; and an anisotropic conductive anodic oxide film provided between the micro LED and the circuit board to electrically connect the circuit board and the micro LED. According to the present invention, without applying an external force (thermocompression bonding) to the anisotropic conductive anodic oxide film, it is possible to electrically connect the circuit board and the micro LED. In addition, it is possible to obtain characteristics such as uniform conductivity in a vertical direction and heat dissipation.

公开(公告)号：US20160379957A1

公开(公告)日：2016-12-29

申请号：US14753807

申请日：2015-06-29

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Ki Myung NAM ,  Seung Ho PARK

IPC: H01L25/065 ,  H01L23/498

CPC classification number: H01L25/065 ,  H01L23/49811 ,  H01L23/49838 ,  H01L25/18 ,  H01L2225/06517 ,  H01L2225/06524

Abstract: Disclosed is a chip-mounting substrate. The chip-mounting substrate includes a plurality of conductive portions configured to apply voltages to at least two or more chips to be mounted, a plurality of insulation portions formed between the conductive portions and configured to electrically isolate the conductive portions, and a cavity formed in a region which includes at least three or more of the conductive portions and at least two or more of the insulation portions and depressed inward to form a space in which the chips are mounted.

Abstract translation: 公开了一种芯片安装基板。 芯片安装基板包括多个导电部分，其被配置为向要安装的至少两个或更多个芯片施加电压;多个绝缘部分，形成在导电部分之间并被构造成电绝缘导电部分;以及形成在 包括至少三个或更多个导电部分和至少两个或更多个绝缘部分并向内凹陷以形成其中安装芯片的空间的区域。

公开(公告)号：US20160064146A1

公开(公告)日：2016-03-03

申请号：US14831964

申请日：2015-08-21

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: H01G4/30 ,  H01G4/005 ,  H01G4/228 ,  H01G4/12 ,  H01G4/38

CPC classification number: H01G4/30 ,  H01G4/005 ,  H01G4/012 ,  H01G4/12 ,  H01G4/228 ,  H01G4/38

Abstract: The present invention relates to a capacitor. The capacitor includes a substrate; a dielectric layer formed on the substrate; and an electrode layer comprising a first electrode layer and a second electrode layer formed on the dielectric layer, wherein the first electrode layer and the second electrode layer are separated from each other, and at least a portion of the first electrode layer and at least a portion of the second electrode layer are disposed on a same surface. With this configuration, applying the electricity becomes easy, and since the first and the second electrode layers function as the electrodes being charged with different polarity electrical charges respectively, manufacturing thereof becomes easy, and the structure thereof is simple.

Abstract translation: 本发明涉及一种电容器。 电容器包括基板; 形成在基板上的电介质层; 以及电极层，其包括形成在所述电介质层上的第一电极层和第二电极层，其中所述第一电极层和所述第二电极层彼此分离，并且所述第一电极层的至少一部分和至少一个 第二电极层的一部分设置在相同的表面上。 利用这种结构，施加电力变得容易，并且由于第一和第二电极层分别用作带有不同极性电荷的电极，因此其制造变得容易，其结构简单。