公开(公告)号：US11482372B2

公开(公告)日：2022-10-25

申请号：US16869934

申请日：2020-05-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ju Hwan Yang ,  Chang Hak Choi ,  Byeong Cheol Moon ,  Yong Hui Li ,  Byung Soo Kang

IPC: H01F27/28 ,  H01F41/04 ,  H01F27/24 ,  H01F27/29

Abstract: A coil component includes a body embedding a support substrate, an external electrode disposed on one surface of the body, and a coil portion disposed on the support substrate and including a lead-out pattern having one surface exposed to one end surface of the body abutting the one surface of the body. A connection electrode penetrates the lead-out pattern, extends to the external electrode, and has one surface exposed to the one end surface of the body. An intermetallic compound is disposed between the connection electrode and the lead-out pattern. The connection electrode includes a base resin, a plurality of metal particles disposed in the base resin, and a conductive connection portion surrounding the plurality of metal particles and in contact with the intermetallic compound.

公开(公告)号：US11469444B2

公开(公告)日：2022-10-11

申请号：US16820155

申请日：2020-03-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chang Ryul Jung ,  Kyung Lock Kim ,  Jong Sik Yoon ,  Chang Hak Choi ,  Byeong Cheol Moon

IPC: H01M10/0562 ,  H01M10/0525 ,  H01M10/04

Abstract: An all-solid-state battery includes a body including a solid electrolyte layer, and an anode layer and a cathode layer alternately stacked with the solid electrolyte layer interposed therebetween. A first external electrode is disposed on one side of the body and includes a first electrode layer and a first conductive resin layer disposed on the first electrode layer, and a second external electrode is disposed on another side of the body and includes a second electrode layer and a second conductive resin layer disposed on the second electrode layer. A protective layer is disposed on an entirety of an external surface of the body free of the first and second electrode layers and on the first and second electrode layers, and at least one opening is included in a region of the protective layer disposed on at least one of the first electrode layer and the second electrode layer.

公开(公告)号：US11450474B2

公开(公告)日：2022-09-20

申请号：US16547023

申请日：2019-08-21

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Seung Mo Lim ,  Byeong Cheol Moon ,  Dong Sik Yoo ,  Doo Ho Park ,  Tae Jun Choi ,  Jeong Hoon Ryou ,  No Il Park ,  Tai Yon Cho

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/24 ,  H01F41/04 ,  H01F41/12 ,  H01F27/32

Abstract: A coil component includes a body having one surface and another surface opposing each other, opposing end surfaces each connecting the one surface and the other surface to each other, and opposing side surfaces each connecting the end surfaces to each other. An internal insulating layer is embedded in the body, and a coil portion is disposed on at least one surface of the internal insulating layer and includes the first and second lead-out portions. The body has a recess disposed in each end surface of the body to expose the first and second lead-out portions. First and second external electrodes each include a connection portion disposed in the recess to be connected to a respective one of the first and second lead-out portions, and each include a pad portion disposed on the one surface of the body. A filling portion fills the recess and covers the connection portion.

公开(公告)号：US20220102061A1

公开(公告)日：2022-03-31

申请号：US17114987

申请日：2020-12-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： No Il Park ,  Byung Soo Kang ,  Seung Mo Lim ,  Byeong Cheol Moon ,  Boum Seock Kim ,  Yong Hui Li ,  Seung Min Lee

IPC: H01F27/29 ,  H01F27/28 ,  H01F41/04 ,  H01F41/12 ,  H01F27/32

Abstract: A coil component includes a body having a first surface, and a first end surface and a second end surface connected to the first surface and opposing each other in a length direction; a support substrate disposed inside the body; a coil portion comprising a first coil pattern and first and second lead-out patterns, each disposed on a first surface of the support substrate; first and second slit portions, respectively defined on edge portions of the first surface of the body to expose the first and second lead-out patterns; and first and second external electrodes disposed on the first and second slit portions to be connected to the first and second lead-out patterns. At least one of the first and second lead-out patterns has a thickness greater than a thickness of each of the first coil pattern and the first dummy lead-out pattern.

公开(公告)号：US11270835B2

公开(公告)日：2022-03-08

申请号：US16282706

申请日：2019-02-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ju Hwan Yang ,  Byung Soo Kang ,  Byeong Cheol Moon

IPC: H01F27/28 ,  H01F27/02 ,  H01F27/29 ,  H01F27/34

Abstract: A coil component includes a body having a bottom surface and a top surface opposing each other in one direction, and a plurality of walls each connecting the bottom surface to the top surface of the body; a coil portion buried in the body, and having first and second lead-out portions; first and second external electrodes disposed on the bottom surface of the body and spaced apart from each other; via electrodes penetrating through the body and connecting the first and second lead-out portions and the first and second external electrodes to each other; a third external electrode including a pad portion disposed on the bottom surface of the body, and a connection portion extending to portions of the plurality of walls of the body, and spaced apart from the first and second external electrodes; a shielding layer including a cap portion disposed on the other surface of the body, and side wall portions respectively disposed on the plurality of walls of the body, and connected to the third external electrode; and an insulating layer disposed between the shielding layer and the body, and between the first to third external electrodes and the body.

公开(公告)号：US11195652B2

公开(公告)日：2021-12-07

申请号：US16188842

申请日：2018-11-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tai Yon Cho ,  Tae Jun Choi ,  Jung Young Cho ,  Chang Hak Choi ,  Byeong Cheol Moon ,  Seung Hee Oh

IPC: H01F27/36 ,  H01F27/28 ,  H01F27/29 ,  H01F27/32 ,  H01F17/00 ,  H01F17/04

Abstract: A coil component includes: a body having one surface and the other surface opposing each other in one direction; a coil portion including a coil pattern having at least one turn around the one direction, and embedded in the body; an external electrode disposed on the one surface of the body and connected to the coil portion; a shielding layer disposed on the other surface of the body; and an insulating layer disposed between the body and the shielding layer.

公开(公告)号：US20210335532A1

公开(公告)日：2021-10-28

申请号：US16990218

申请日：2020-08-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ju Hwan Yang ,  Joung Gul Ryu ,  Ji Man Ryu ,  Byung Soo Kang ,  Byeong Cheol Moon

IPC: H01F27/28 ,  H01F27/29 ,  H01F41/04

Abstract: A coil component includes a body, a support substrate disposed in the body, and a coil portion including a first coil pattern on one surface of the support substrate, a first lead-out pattern extending from the first coil pattern to an end surface of the body, and a second lead-out pattern disposed on the one surface of the support substrate to be spaced apart from the first coil pattern and extending to another end surface of the body. A reinforcing pattern portion is disposed between each lead-out pattern and the one surface of the support substrate, first and second slit portions are disposed in edge portions of the body and respectively expose the first and second lead-out patterns, and first and second external electrodes are respectively disposed on the inner surfaces of the first and second slit portions and respectively connected to the first and second lead-out patterns.

公开(公告)号：US11127523B2

公开(公告)日：2021-09-21

申请号：US16178437

申请日：2018-11-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Mi Geum Kim ,  Byeong Cheol Moon ,  Joung Gul Ryu

IPC: H01F5/00 ,  H01F27/28 ,  H01F27/29 ,  H01F27/32 ,  H01F17/00 ,  H01F41/12 ,  H01F41/04

Abstract: An inductor includes a body including a support member, a coil, and an encapsulant encapsulating the support member and the coil and external electrodes disposed on an external surface of the body and connected to the coil, wherein the support member includes a through-hole and a via hole spaced apart from the through-hole, the coil includes a first coil disposed on one surface of the support member and a second coil disposed on the other surface of the support member opposing the one surface, the first and second coils are connected to each other by a via filling the via hole, and the via continuously covers an end surface of the first coil and an upper surface of the second coil.

公开(公告)号：US11031174B2

公开(公告)日：2021-06-08

申请号：US15985081

申请日：2018-05-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Hun Kim ,  Boum Seock Kim ,  Byeong Cheol Moon

IPC: H01F27/29 ,  H01F27/28 ,  H01F41/04 ,  H01F27/32 ,  H01F17/00 ,  H01F17/04

Abstract: A thin film type inductor includes: a body including a support member including a through hole, upper and lower coils disposed on upper and lower surfaces of the support member, respectively, and a via penetrating through the support member while connecting the upper and lower coils to each other; and external electrodes disposed on an external surface of the body. A coil pattern directly connected to the via may include an inclined surface.

公开(公告)号：US11018418B2

公开(公告)日：2021-05-25

申请号：US16185118

申请日：2018-11-09

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Yeong Kim ,  Sung Yong An ,  Sang Jong Lee ,  Seong Hee Choi ,  Kyu Bum Han ,  Jeong Ki Ryoo ,  Byeong Cheol Moon ,  Chang Hak Choi

IPC: H01Q1/38 ,  H01Q15/14 ,  H01Q9/04 ,  H01Q1/48 ,  H01Q1/22 ,  H01Q19/30 ,  H01Q11/02 ,  H01Q1/24 ,  H01Q19/00

Abstract: A chip antenna includes a radiation portion having a block shape and a first surface and a second surface opposing each other, and configured to receive and radiate a feed signal as an electromagnetic wave; a first block made of a dielectric material and coupled to the first surface of the radiation portion; a second block made of a dielectric material and coupled to the second surface of the radiation portion; a ground portion having a block shape and coupled to the first block, and configured to reflect the electromagnetic wave radiated by the radiation portion back toward the radiation portion; and a director having a block shape and coupled to the second block, wherein an overall width of the ground portion, the first block, and the radiation portion is 2 mm or less, and the first block has a dielectric constant of 3.5 or more to 25 or less.