公开(公告)号：US08233192B2

公开(公告)日：2012-07-31

申请号：US12383414

申请日：2009-03-24

申请人： Kenji Kobayashi

发明人： Kenji Kobayashi

IPC分类号： H04N1/40

CPC分类号： H04N1/60 ,  H04N1/603

摘要： A control circuit of an image reader having at least one light source includes: a light source control portion that controls ON and OFF of the light source by performing current switching for adjusting a value of a current supplied to the light source; a black reference data creating portion that creates black reference data used for shading correction under control of the light source control portion; an image reading portion that reads image data under control of the light source control portion; and a shading correction portion that performs shading correction of the image data using the black reference data. The black reference data creating portion adds a noise, which is equivalent to a noise added to the image data by the current switching, to the black reference data, and the shading correction portion removes the noise added to the image data by performing the shading correction.

摘要翻译： 具有至少一个光源的图像读取器的控制电路包括：光源控制部分，通过执行电流切换来控制光源的导通和截止，以调节提供给光源的电流的值; 黑色基准数据生成部，其在光源控制部的控制下，生成用于阴影校正的黑色基准数据; 图像读取部，其在所述光源控制部的控制下读取图像数据; 以及阴影校正部分，其使用黑色参考数据执行图像数据的阴影校正。 黑参考数据创建部分将通过当前切换添加到图像数据的噪声等效的噪声添加到黑参考数据，并且阴影校正部分通过执行阴影校正来去除添加到图像数据的噪声 。

公开(公告)号：US08222620B2

公开(公告)日：2012-07-17

申请号：US12993682

申请日：2009-05-22

申请人： Kenji Kobayashi

发明人： Kenji Kobayashi

IPC分类号： A61N5/00

CPC分类号： H01L21/68707 ,  H01L21/67115 ,  H01L21/67132

摘要： A light irradiation apparatus 10 is configured to comprise: a supporting means 11 for supporting a semiconductor wafer W as an irradiated object, the semiconductor wafer W being stuck with an adhesive sheet S having an ultraviolet curable adhesive on a circuit formation surface; and a light irradiating means 13 having a focus axis P at a location spaced by a predetermined distance, and being provided so as to enable head-swinging motion thereof. The supporting means 11 is supported by a multi-joint robot 12, and relatively displaces the wafer W so as to prevent an adhesive layer surface SA of the adhesive sheet S from deviating from a position of the focus axis P, when the ultraviolet ray irradiating means 13 performs the head-swinging motion.

摘要翻译： 光照射装置10被构造为包括：用于支撑半导体晶片W作为被照射物体的支撑装置11，半导体晶片W在电路形成表面上粘附有具有紫外线固化粘合剂的粘合片S; 以及具有聚焦轴P位于间隔预定距离的位置处的光照射装置13，并且被设置成能够进行头摆动作。 支撑装置11由多关节机器人12支撑，并且当紫外线照射时，相对移动晶片W以防止粘合片S的粘合剂层表面SA偏离聚焦轴P的位置 装置13执行头摆动作。

公开(公告)号：US20110155314A1

公开(公告)日：2011-06-30

申请号：US13060921

申请日：2009-08-27

申请人： Kenji Kobayashi

发明人： Kenji Kobayashi

IPC分类号： B32B37/12 ,  B32B37/16

CPC分类号： H01L21/67132 ,  Y10T156/11 ,  Y10T156/1168 ,  Y10T156/1174 ,  Y10T156/19

摘要： To provide a mounting apparatus for uniting a semiconductor wafer with a ring frame, the wafer having an adhesive sheet stuck on one surface thereof. In the mounting apparatus, a portion of the adhesive sheet is preliminarily peeled off through a preliminary peeling means, the wafer is disposed inside the ring frame after a preliminarily peeled portion is formed, and a mounting tape is stuck to the ring frame and the wafer through a sticking means. The mounted wafer is fully peeled off by holding the preliminarily peeled portion.

摘要翻译： 为了提供一种用于将半导体晶片与环形框架结合的安装装置，所述晶片具有粘附在其一个表面上的粘合片。 在安装装置中，粘合片的一部分通过预先剥离装置预先剥离，在形成预先剥离的部分之后，将晶片配置在环形框架的内侧，将安装带粘贴在环形框架和晶片上 通过粘贴手段。 通过保持预先剥离的部分将安装的晶片完全剥离。

公开(公告)号：US07963710B2

公开(公告)日：2011-06-21

申请号：US11909230

申请日：2006-03-14

申请人： Kenji Kobayashi ,  Akira Dangami

发明人： Kenji Kobayashi ,  Akira Dangami

IPC分类号： B41J15/00

CPC分类号： B41J15/22 ,  B41J3/4075 ,  B65C9/0015 ,  B65C9/1803 ,  B65C9/1884

摘要： The printer includes a printing unit 12 that performs printing on each of a label L1 and a second raw sheet M2 on the way of feeding out a first raw sheet M1, which is temporarily stuck with labels L1 on a release liner S, and a second raw sheet M2 having no adhesive layer; a peeling unit 13 that peels off the label L1 from the release liner S; first and second holding units 15, 16 that hold a label sheet L2 formed via a cutting unit 14; and a laminating unit 17 that laminates the label L1 and the label sheet L2 with each other so that the reverse surface of the printed surface of the label sheet L2 faces the adhesive layer side of the label L1 are provided. The label L1 laminated with the label sheet L2 is stuck onto an adherend W in a state that the adhesive layer is exposed in a closed loop state in an entire area of the periphery of the label sheet L2.

摘要翻译： 该打印机包括一个打印单元12，该打印单元12在将标签L1临时粘贴在释放衬垫S上的第一原纸M1的供给路径上进行标签L1和第二原纸M2各自的打印， 没有粘合剂层的原料薄片M2; 从剥离衬垫S剥离标签L1的剥离单元13; 保持经由切割单元14形成的标签纸L2的第一保持单元15和第二保持单元16; 以及层叠单元17，其将标签L1和标签片L2彼此层叠，使得标签片材L2的印刷表面的背面面向标签L1的粘合剂层侧。 在标签片L2的周围的整个区域中，粘合剂层以闭环状态露出的状态下，贴合标签片L2的标签L1被粘贴在被粘物W上。

公开(公告)号：US07954533B2

公开(公告)日：2011-06-07

申请号：US12067280

申请日：2006-10-05

申请人： Hideaki Nonaka ,  Kenji Kobayashi ,  Yoshiaki Sugishita

发明人： Hideaki Nonaka ,  Kenji Kobayashi ,  Yoshiaki Sugishita

IPC分类号： B29C65/00 ,  B29C65/10 ,  B32B37/00 ,  B32B38/04 ,  B32B38/10 ,  B32B41/00 ,  B31F5/00 ,  G03D15/04 ,  B26D5/00 ,  B26D1/14 ,  B26D1/18 ,  B65C9/40 ,  G05G15/00 ,  B23D33/02 ,  B27B5/00 ,  B27B5/18 ,  B27B27/06 ,  B27B5/34 ,  B27B3/28 ,  B27B27/04 ,  A47G29/00 ,  F16M11/00

CPC分类号： B26D3/10 ,  B26F1/3846 ,  H01L21/67132 ,  Y10T83/7684 ,  Y10T83/7688 ,  Y10T83/7693 ,  Y10T83/7697 ,  Y10T83/7701 ,  Y10T83/7705 ,  Y10T83/7709 ,  Y10T83/7713 ,  Y10T83/7718 ,  Y10T83/7722 ,  Y10T83/7726 ,  Y10T83/773 ,  Y10T156/1052 ,  Y10T156/12

摘要： A sheet cutting table 13, after sticking an adhesive sheet S to a semiconductor wafer W, for cutting the area outside the semiconductor wafer W as an unnecessary adhesive sheet S1 with a cutting device 15. The table 13 includes an inner table 52 which supports the semiconductor wafer W, and an outer table 51 corresponding to the unnecessary adhesive sheet S1 outside the semiconductor wafer W. The upper surface of the outer table 51 is provided with a non-adherable treatment surface 51A, and an adherable member formed with a ring member 53 or a plate member 63 for sticking the adhesive sheet S thereto.

摘要翻译： 在将切割装置15作为不需要的粘合片S1切断半导体晶片W外侧的区域之后，将粘合片S粘贴到半导体晶片W之后的片材切割台13.台13包括内台52， 半导体晶片W和与半导体晶片W外侧的不需要的粘合片S1对应的外台51.外台51的上表面设置有不可粘接的处理面51A，形成有环状部件 53或用于将粘合片S粘贴的板构件63。

公开(公告)号：US20110116819A1

公开(公告)日：2011-05-19

申请号：US13013703

申请日：2011-01-25

申请人： Yoshiyuki MATSUOKA ,  Isao Ebisawa ,  Kenji Kobayashi

发明人： Yoshiyuki MATSUOKA ,  Isao Ebisawa ,  Kenji Kobayashi

IPC分类号： G03G15/043

CPC分类号： G03G15/0409 ,  B41J2/451 ,  G02B19/0014 ,  G02B19/0057 ,  G02B19/0061 ,  G02B27/0961 ,  G03G15/04072 ,  G03G15/043 ,  G03G15/0435 ,  G03G2215/0409

摘要： An exposing device which radiates light on a photoconductor drum which rotates, thereby executing exposure, includes a light-emitting element unit including light-emitting element having an emission area which emits light that is generated, the emission area having a rectangular shape with a long side along a direction perpendicular to a rotational direction of the photoconductor drum, and a short side along the rotational direction, a lens unit which focuses the light, which is emitted from the emission area, on a peripheral surface of the photoconductor drum, thereby executing exposure, and forming on the peripheral surface a beam spot, and a driving circuit which causes the light-emitting element to emit light, thereby making a width of the shape of the beam spot in a direction along the rotational direction close to a width of the beam spot in a direction perpendicular to the rotational direction.

摘要翻译： 一种曝光装置，其在旋转的感光鼓上照射光，从而进行曝光，包括发光元件单元，其包括具有发射所产生的光的发射区域的发光元件，发光区域具有长的矩形形状 一侧沿着与感光鼓的旋转方向垂直的方向和沿着旋转方向的短边;透镜单元，其将从发光区域发射的光聚焦在感光鼓的外周面上，由此执行 曝光和在外围表面上形成光斑，以及使发光元件发光的驱动电路，从而使光束的形状沿着旋转方向的方向的宽度接近宽度 光束在与旋转方向垂直的方向上。

公开(公告)号：US20110089337A1

公开(公告)日：2011-04-21

申请号：US12993682

申请日：2009-05-22

申请人： Kenji Kobayashi

发明人： Kenji Kobayashi

IPC分类号： G21K5/08 ,  G21K5/10

CPC分类号： H01L21/68707 ,  H01L21/67115 ,  H01L21/67132

摘要： A light irradiation apparatus 10 is configured to comprise: a supporting means 11 for supporting a semiconductor wafer W as an irradiated object, the semiconductor wafer W being stuck with an adhesive sheet S having an ultraviolet curable adhesive on a circuit formation surface; and a light irradiating means 13 having a focus axis P at a location spaced by a predetermined distance, and being provided so as to enable head-swinging motion thereof. The supporting means 11 is supported by a multi-joint robot 12, and relatively displaces the wafer W so as to prevent an adhesive layer surface SA of the adhesive sheet S from deviating from a position of the focus axis P, when the ultraviolet ray irradiating means 13 performs the head-swinging motion.

摘要翻译： 光照射装置10被构造为包括：用于支撑半导体晶片W作为被照射物体的支撑装置11，半导体晶片W在电路形成表面上粘附有具有紫外线固化粘合剂的粘合片S; 以及具有聚焦轴P位于间隔预定距离的位置处的光照射装置13，并且被设置成能够进行头摆动作。 支撑装置11由多关节机器人12支撑，并且当紫外线照射时，相对移动晶片W以防止粘合片S的粘合剂层表面SA偏离聚焦轴P的位置 装置13执行头摆动作。

公开(公告)号：US07914353B2

公开(公告)日：2011-03-29

申请号：US12038045

申请日：2008-02-27

申请人： Kenji Kobayashi ,  Makoto Yamaguchi

发明人： Kenji Kobayashi ,  Makoto Yamaguchi

IPC分类号： H01T21/02

CPC分类号： H01T13/08 ,  H01T21/02

摘要： A method for manufacturing a spark plug and a spark plug manufactured by the method in which a gasket used for securing the air-tightness when mounting the spark plug on an internal-combustion engine is prevented from falling out from the metal shell with a simple step.

摘要翻译： 一种用于制造火花塞和火花塞的方法，其通过以下方法制造：通过简单的步骤防止在将火花塞安装在内燃机上时用于确保气密性的垫圈的方法 。

公开(公告)号：US07900677B2

公开(公告)日：2011-03-08

申请号：US11916788

申请日：2006-06-26

申请人： Hideaki Nonaka ,  Kenji Kobayashi

发明人： Hideaki Nonaka ,  Kenji Kobayashi

IPC分类号： H01L21/683

CPC分类号： H01L21/67132 ,  Y10T156/1343 ,  Y10T156/17 ,  Y10T156/1705

摘要： A sheet sticking apparatus comprises a sheet feed-out unit 12 including a peel plate 22 for peeling off an adhesive sheet S from a release liner PS; and a press roller 14 for pressing the adhesive sheet S onto a wafer W supported by a table 13 to stick the sheet thereto, wherein the peel plate 22 is supported movably forward and backward by a cylinder 50. The peel plate 22 is arranged so that the initial position of the front end is adjusted forward/backward corresponding to the size of the wafer W or the size of the table 13 supporting the same.

摘要翻译： 片材粘贴装置包括片材送出单元12，其包括用于从剥离衬垫PS剥离粘合片S的剥离板22; 以及用于将粘合片S按压到由桌子13支撑的晶片W上以将片材粘贴在其上的压辊14，其中剥离板22由圆柱体50可向前和向后可移动。剥离板22被布置成使得 前端的初始位置根据晶片W的大小或支撑该晶片W的台13的大小进行前后调整。

公开(公告)号：US20110035099A1

公开(公告)日：2011-02-10

申请号：US12805422

申请日：2010-07-30

申请人： Kenji Kobayashi

发明人： Kenji Kobayashi

IPC分类号： G06F7/00 ,  G09G5/10

CPC分类号： B60K35/00 ,  B60K2370/186 ,  B60K2370/1868 ,  G09G5/10 ,  G09G2320/028 ,  G09G2320/0606 ,  G09G2320/0626 ,  G09G2360/144 ,  G09G2380/10

摘要： In a display control device, a direction of a light source in a region around a self-vehicle is estimated, and whether the direction of the light source coincides with a display arrangement direction which indicates an arrangement direction of a display portion as viewed from a passenger in the self-vehicle is determined. Then, a brightness of the display portion is set to be increased when the direction of the light source coincides with the display arrangement direction, compared with when the direction of the light source does not coincide with the display arrangement direction. Therefore, the brightness of the display portion can be more accurately controlled such that the display portion is easily viewed by the passenger in the self-vehicle.

摘要翻译： 在显示控制装置中，估计自身车辆周围区域中的光源的方向，以及光源的方向是否与从显示部的方向观察显示部的显示布置方向一致 确定了自行车的乘客。 然后，当光源的方向与显示排列方向不一致时，显示部分的亮度被设定为当光源的方向与显示排列方向一致时增加。 因此，可以更精确地控制显示部分的亮度，使得显示部分容易被乘客在自行车中观看。