公开(公告)号：US4676827A

公开(公告)日：1987-06-30

申请号：US844350

申请日：1986-03-26

申请人： Naoyuki Hosoda ,  Masaki Morikawa ,  Naoki Uchiyama ,  Hideaki Yoshida ,  Toshiaki Ono

发明人： Naoyuki Hosoda ,  Masaki Morikawa ,  Naoki Uchiyama ,  Hideaki Yoshida ,  Toshiaki Ono

IPC分类号： C22C9/00 ,  C30B13/00 ,  H01B1/02 ,  H01L21/48 ,  H01L23/49 ,  C22B9/00

CPC分类号： H01L24/43 ,  C22C9/00 ,  C30B13/00 ,  C30B29/02 ,  H01B1/026 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48624 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/0101 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/0106 ,  H01L2924/01063 ,  H01L2924/01064 ,  H01L2924/01065 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/0107 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/01105 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20752 ,  Y10T428/12431

摘要： The present invention eliminates the problems associated with the use of oxygen-free copper and other high-purity copper materials as bonding wires. At least one rare earth element, or at least one element selected from the group consisting of Mg, Ca, Ti, Zr, Hf, Li, Na, K, Rb and Cs, or the combination of at least one rare earth element and at least one elemented selected from the above-specified group is incorporated in high-purity copper as a refining component in an amount of 0.1-100 ppm on a weight basis, and the high-purity copper is subsequently refined by zone melting. The very fine wire drawn from the so refined high-purity copper has the advantage that it can be employed in high-speed ball bonding of a semiconductor chip with a minimum chance of damaging the bonding pad on the chip by the ball forming at the tip of the wire.

摘要翻译： 本发明消除了与使用无氧铜和其它高纯度铜材料作为接合线相关的问题。 至少一种稀土元素或选自Mg，Ca，Ti，Zr，Hf，Li，Na，K，Rb和Cs中的至少一种元素，或至少一种稀土元素和 从上述规定组中选择的至少一种元素作为精制成分以0.1〜100ppm的重量配合在高纯度铜中，高纯度铜随后通过区域熔融进行精制。 从精细化的高纯度铜制成的极细金属丝具有以下优点：可以将半导体芯片的高速球接合用于通过在尖端处的球形成而损坏芯片上的焊盘的最小机会 的电线。