公开(公告)号：US20100229378A1

公开(公告)日：2010-09-16

申请号：US12293646

申请日：2007-03-12

申请人： Takashi Uchino ,  Tadashi Shinozaki ,  Norifumi Eguchi ,  Naoki Yamauchi ,  Masao Hidaka ,  Toru Nakazono

发明人： Takashi Uchino ,  Tadashi Shinozaki ,  Norifumi Eguchi ,  Naoki Yamauchi ,  Masao Hidaka ,  Toru Nakazono

IPC分类号： B23P19/00

CPC分类号： H05K13/0478 ,  H01L21/67144 ,  H01L24/29 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/07802 ,  H05K13/085 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  H01L2224/83

摘要： A challenge to be met by the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method that enable a reduction in the frequency of operation required with switching of a component type, to thus enhance productivity.In component mount operation for taking chips of component types A, B, and C out of a component supply portion by means of a single mount head and mounting the chips on two substrates held by a first lane and a second lane, when a subsequently-carried-in subsequent substrate has come to be able to undergo component mount operation before completion of processing pertaining to a preceding substrate mount process in which component mount operation is carried out on a previously-carried-in preceding substrate among a plurality of substrates, processing pertaining to a subsequent substrate mount process is started by taking, as mount start components, chips already serving as targets of component mount operation for the preceding substrate at this timing, and processing pertaining to the preceding substrate mount process during which mounting is not yet completed is continually carried out. Thereby, the frequency of operation required with switching of a component type, such as replacement of a nozzle, can be reduced.

摘要翻译： 本发明要解决的课题是提供一种电子部件安装装置和电子部件安装方法，其能够降低部件类型的切换所需的操作频率，从而提高生产率。 在用于通过单个安装头从组件供应部分中取出组件类型A，B和C的芯片的组件安装操作中，并且将芯片安装在由第一通道和第二通道保持的两个基板上， 随后的衬底已经能够在完成与之前的衬底安装工艺相关的处理之前进行组件安装操作，其中在多个衬底之间对先前存在的在前衬底进行组件安装操作，处理 关于随后的基板安装工艺，通过作为安装启动部件开始已经作为前面基板的部件安装操作的目标的芯片，以及与之前的基板安装处理有关的处理，其中安装尚未完成 不断进行 由此，可以减少切换喷嘴等部件的切换所需的操作频率。

公开(公告)号：US20090204251A1

公开(公告)日：2009-08-13

申请号：US12279072

申请日：2007-03-20

申请人： Yasuhiro Maenishi

发明人： Yasuhiro Maenishi

IPC分类号： G06F19/00

CPC分类号： H05K13/085

摘要： To provide a method for determining a mounting condition to be set for at least one apparatus among apparatuses for manufacturing component-mounted boards. The method includes: determining, from among the apparatuses, a specific apparatus which satisfies a predetermined standard in performance associated with a manufacturing operation (S1); obtaining the mounting condition associated with the manufacturing operation from the specific apparatus determined in the determining (S2); and setting the mounting condition obtained in the obtaining for an apparatus other than the specific apparatus (S3).

摘要翻译： 提供一种用于确定在用于制造部件安装板的装置中为至少一个装置设置的安装条件的方法。 该方法包括：从设备中确定满足与制造操作相关的性能的预定标准的特定设备（S1）; 从确定（S2）中确定的特定装置获得与制造操作相关联的安装条件; 并设定在特定装置以外的装置的获得中获得的安装条件（S3）。

公开(公告)号：US20090088881A1

公开(公告)日：2009-04-02

申请号：US12045137

申请日：2008-03-10

申请人： Jin Zhu ,  Ming Wang ,  Chih-Yi Tu

发明人： Jin Zhu ,  Ming Wang ,  Chih-Yi Tu

IPC分类号： G06F17/00

CPC分类号： G06F17/5009 ,  H05K13/085

摘要： An exemplary simulation system for manufacturing a printed circuit board is provided. The simulation system includes at least one simulation sub-system. The simulation sub-system includes an input module, a storing module, a processing module, and an output module. The input module is configured for acquiring a number of processing parameters associated with steps of a process for manufacturing the printed circuit board. The storing module is configured for storing a number of simulation functions relating to the steps of the process for manufacturing the printed circuit board. The processing module is configured for selecting and performing the corresponding simulation function according to the acquired parameters, thereby obtaining a simulation result. The output module is configured for output the simulation result.

摘要翻译： 提供了用于制造印刷电路板的示例性模拟系统。 仿真系统包括至少一个仿真子系统。 仿真子系统包括输入模块，存储模块，处理模块和输出模块。 输入模块被配置为用于获取与用于制造印刷电路板的工艺的步骤相关联的多个处理参数。 存储模块被配置为存储与制造印刷电路板的工艺步骤相关的多个模拟功能。 处理模块被配置为根据获取的参数来选择和执行相应的模拟功能，从而获得模拟结果。 输出模块配置为输出仿真结果。

公开(公告)号：US20080154392A1

公开(公告)日：2008-06-26

申请号：US11792833

申请日：2005-12-02

申请人： Yasuhiro Maenishi ,  Chikashi Konishi ,  Akihito Yamasaki ,  Takeshi Kuribayashi

发明人： Yasuhiro Maenishi ,  Chikashi Konishi ,  Akihito Yamasaki ,  Takeshi Kuribayashi

IPC分类号： G05B13/02

CPC分类号： H05K13/085 ,  H05K13/0853 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53191

摘要： An operating time reducing method in which a processing procedure of a component mounting order determination method can be changed depending on the type of an operation loss that affects a component mounting time for mounting components onto the board is an operating time reducing method for a component mounter, wherein the method includes: an operation loss identifying step (S22 to S26, S30, S34 to S38, S42 to S46) of identifying an operation loss to be resolved in the component mounter; a processing procedure selecting step (S28, S32, S40, S48, S50, S52) of selecting, based on the identified operation loss, a processing procedure for reducing an operating time of the component mounter; and a processing procedure executing step (S28, S32, S40, S48, S50, S52) of executing the selected processing procedure.

摘要翻译： 可以根据影响用于将部件安装到板上的部件安装时间的操作损失的类型来改变部件安装顺序确定方法的处理过程的操作时间缩短方法是用于部件安装器的操作时间减少方法 ，其中所述方法包括：识别要在组件安装机中解决的操作损失的操作损失识别步骤（S22至S26，S30，S34至S38，S42至S46）; 基于所识别的操作损失，选择用于减少部件安装机的操作时间的处理过程的处理过程选择步骤（S28，S32，S40，S48，S50，S52） 以及执行所选择的处理过程的处理过程执行步骤（S28，S32，S40，S48，S50，S52）。

公开(公告)号：US07313859B2

公开(公告)日：2008-01-01

申请号：US10490772

申请日：2002-09-24

申请人： Yasuhiro Maenishi ,  Ikuo Yoshida ,  Satoshi Masuda ,  Akihito Yamasaki

发明人： Yasuhiro Maenishi ,  Ikuo Yoshida ,  Satoshi Masuda ,  Akihito Yamasaki

IPC分类号： B23Q15/00 ,  G05B13/02

CPC分类号： H05K13/0452 ,  H05K13/085 ,  Y10T29/53022 ,  Y10T29/53026 ,  Y10T29/5303 ,  Y10T29/53048 ,  Y10T29/53091

摘要： An optimization apparatus capable of efficiently placing an electronic component. An optimization unit (203) determines a first assignment to the placement apparatus and calculates a first placement time required for placing all the electronic components assigned to the placement apparatus by the first assignment onto a circuit board by the placement apparatus. The optimization unit selects two placement apparatuses among a plurality of placement apparatuses, selects a type of an electronic component assigned for the selected placement apparatus, determines a second assignment by interchanging two selected times assigned, calculates a second placement time required for placing all the electronic components assigned to the placement apparatus by the second assignment onto the circuit board by the placement apparatus, and employs the one of the first assignment and the second assignment which has a smaller placement time.

摘要翻译： 一种能够有效地放置电子部件的优化装置。 优化单元（203）确定对所述放置装置的第一分配，并且通过所述放置装置计算将通过所述第一分配分配给所述放置装置的所有电子部件放置到电路板上所需的第一放置时间。 优化单元选择多个放置装置中的两个放置装置，选择分配给所选择的放置装置的电子部件的种类，通过交换所分配的两个选择时间来确定第二分配，计算放置所有电子装置所需的第二放置时间 通过由放置装置对电路板进行第二次分配而分配给放置装置的部件，并且采用具有较小放置时间的第一分配和第二分配中的一个。

公开(公告)号：US07133731B2

公开(公告)日：2006-11-07

申请号：US10533436

申请日：2004-05-25

申请人： Takuya Yamazaki ,  Yasuhiro Maenishi ,  Ikuo Yoshida ,  Akihito Yamasaki

发明人： Takuya Yamazaki ,  Yasuhiro Maenishi ,  Ikuo Yoshida ,  Akihito Yamasaki

IPC分类号： G06F19/00

CPC分类号： H05K13/0413 ,  H05K13/085 ,  Y10T29/49124

摘要： The present invention provides a component mounting sequence optimizing method, a component mounting device, a program for executing the component mounting sequence optimizing method, and recording medium in which the program is recorded, in the component mounting device with a component holding head capable of holding a plurality of components and having a component recognition camera. The invention includes a component mounting sequence optimizing device and a mounting sequence for components is determined on basis of a result of comparison between conveyance times for the components and recognition times required for recognitions of the components. Thus cycle time for mounting can be reduced, in comparison with conventional arts, in mounting of components with a component holding head having a plurality of component holding members and having a component recognition camera.

摘要翻译： 本发明提供一种部件安装顺序优化方法，部件安装装置，用于执行部件安装顺序优化方法的程序，以及其中记录有程序的记录介质，在具有能够保持的部件保持头的部件安装装置中 多个部件并具有部件识别相机。 基于组件的传送时间与识别部件所需的识别时间之间的比较结果确定本发明包括部件安装顺序优化装置和部件的安装顺序。 因此，与常规技术相比，可以减少安装的循环时间，在具有具有多个部件保持部件并具有部件识别相机的部件保持头部件的安装中。

公开(公告)号：US20060230610A1

公开(公告)日：2006-10-19

申请号：US11452339

申请日：2006-06-14

申请人： Hyo Kim ,  Byung Lee

发明人： Hyo Kim ,  Byung Lee

IPC分类号： H05K3/30

CPC分类号： H05K3/0097 ,  H05K3/303 ,  H05K13/0061 ,  H05K13/085 ,  H05K2203/1476 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/5196 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53187

摘要： Mounting methods of electronic components in which the electronic components are mounted on plural printed circuit boards are disclosed. An exemplary method includes: supplying a printed circuit board on a first conveyor; transferring the printed circuit board to the third conveyor and simultaneously, transferring the printed circuit board transferred to the first conveyor to the second conveyor; mounting the electronic components to about half-portion of the printed circuit board by moving the printed circuit board to one side and simultaneously, mounting the electronic components to about half-portion from the original position of the printed circuit board and transferring the printed circuit board to a fourth conveyor, simultaneously transferring the printed circuit board to the second conveyor to the third conveyor and then discharging the printed circuit boards sequentially.

摘要翻译： 公开了将电子部件安装在多个印刷电路板上的电子部件的安装方法。 一种示例性方法包括：在第一输送机上提供印刷电路板; 将印刷电路板转移到第三传送器并同时将传送到第一传送器的印刷电路板传送到第二传送器; 通过将印刷电路板移动到一侧并同时将电子部件安装到印刷电路板的大约半部分，将电子部件安装到从印刷电路板的原始位置的大约一半的位置，并将印刷电路板 到第四输送机，同时将印刷电路板传送到第二输送机到第三输送机，然后顺序排出印刷电路板。

公开(公告)号：US20060229758A1

公开(公告)日：2006-10-12

申请号：US10568965

申请日：2004-08-26

申请人： Yasuhiro Maenishi ,  Takuya Yamazaki ,  Akihito Yamasaki ,  Hiroyoshi Nishida ,  Ikuo Yoshida ,  Chikashi Konishi ,  Masaya Matsumoto

发明人： Yasuhiro Maenishi ,  Takuya Yamazaki ,  Akihito Yamasaki ,  Hiroyoshi Nishida ,  Ikuo Yoshida ,  Chikashi Konishi ,  Masaya Matsumoto

IPC分类号： G06F19/00

CPC分类号： G06F17/50 ,  G06F2217/08 ,  G06Q10/06 ,  H05K13/085 ,  Y10T29/4913

摘要： A plurality of patterns having the same component placement structure is included in the board, said plurality of patterns corresponding respectively to a plurality of sub-boards obtained by partitioning said board. The optimization method of an order of component mounting i) includes a step of optimizing the order of component mounting for any one pattern among the plurality of patterns (S2), a step of calculating a quotient and a remainder by dividing the total number of the patterns included in the board by the number of mounters (S4), a step of determining the quotient as the number of patterns to be allocated in the case where the remainder is zero (S6), and a step of i) determining a number, which is the quotient plus one, as the number of patterns to be allocated to the same number of the mounters as the remainder, starting from the mounter in a process farthest upstream, and ii) determining the quotient as the number of patterns to be allocated to the rest of the mounters, in the case where the remainder is one or greater (S6 to S10), and a step of allocating the allocated number of patterns, to each of the mounters (S12).

摘要翻译： 具有相同组件放置结构的多个图案包括在板中，所述多个图案分别对应于通过划分所述板而获得的多个子板。 组件安装的顺序的优化方法i）包括优化多个模式中的任何一个模式的组件安装顺序（S 2）的步骤，通过将总数除以 包括在所述板中的所述图案通过所述多个所述移位器（S 4），将所述商确定为在余数为零的情况下要分配的模式数的步骤（S 6），以及步骤i）确定 一个数字，即商加一个，作为与最后上游的过程中从安装者开始的分配给相同数量的移位器的模式的数量，以及ii）将商定义为模式数 在剩余部分为1或更大的情况下（S 6至S 10）以及将分配的模式数量分配给每个安装器的步骤（S12）被分配给其余的移动器。

公开(公告)号：US20060162154A1

公开(公告)日：2006-07-27

申请号：US11328809

申请日：2006-01-09

申请人： William White

发明人： William White

IPC分类号： H05K3/30 ,  B23P19/00

CPC分类号： H05K13/04 ,  G01R31/2808 ,  H05K13/085 ,  H05K13/0857 ,  Y10S414/135 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/5196 ,  Y10T29/53013 ,  Y10T29/53022 ,  Y10T29/53048 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53187

摘要： An in-line programming (ILP) system and method for programming and testing programmable integrated circuit devices (PICS) and performing the assembly of printed circuit board assemblies (PCBAs). Printed circuit boards enter and leave the ILP system on a conveyor system. PICs are loaded into the ILP system, and the ILP system automatically programs and tests the PICs and places them onto the PCBs as the PCBs arrive on the conveyor. The programming and testing operations are performed by the same piece of equipment that performs the PCBA assembly operation.

摘要翻译： 一种用于编程和测试可编程集成电路器件（PICS）并执行印刷电路板组件（PCBA）组装的在线编程（ILP）系统和方法。 印刷电路板在输送系统上进入和离开ILP系统。 PIC被加载到ILP系统中，并且ILP系统自动对PIC进行编程和测试，并在PCB到达传送带时将它们放置在PCB上。 编程和测试操作由执行PCBA组装操作的同一件设备执行。

公开(公告)号：US20040143963A1

公开(公告)日：2004-07-29

申请号：US10478374

申请日：2003-11-21

发明人： Mohammad Mehdianpour ,  Ralf Schulz

IPC分类号： H05K003/30 ,  B23P019/00

CPC分类号： H05K13/0061 ,  H05K13/085 ,  Y10T29/4913 ,  Y10T29/53187

摘要： The invention relates to an assembly system and method for assembling components on substrates, with, for example, two substrate support pairs arranged perpendicular to a conveyor run, comprising substrate supports (110, 130, 120, 140) which may be displaced perpendicular to the conveyor run. Assembly fields (500, 550) are arranged to the side of the conveyor run, which can be supplied with circuit boards (L) by means of the substrate supports (110, 130, 120, 140). A loading device (210) and an unloading device (220) are arranged along the conveyor run (T), by means of which the circuit boards (L) can be placed on the substrate supports (110, 130, 120, 140). The loading device (210) and the unloading device (22) may be displaced along the conveyor run in a loading direction and an unloading direction. A flexible execution of assembly processes is possible with the above arrangement. Furthermore, non-productive time, such as for example the time required to exchange an assembled circuit board (L) for an unassembled circuit board (L) in the assembly field is eliminated.