-
公开(公告)号：US11784670B2
公开(公告)日：2023-10-10
申请号：US17219864
申请日：2021-03-31
申请人： Molex, LLC
摘要： Methods, systems, and apparatus for using antennas for millimeter wave contactless communication. One of the apparatuses is a communication device that includes a transducer configured to convert electrical signals into extremely high frequency (EHF) electromagnetic signals, the EHF electromagnetic signals substantially emitted from a first surface of the communication device, wherein the transducer is positioned on a substrate of the communication device, and an integrated circuit coupled to the substrate, wherein the transducer includes multiple parallel resonant antenna elements in an array.
-
公开(公告)号：US20230238990A1
公开(公告)日：2023-07-27
申请号：US18146428
申请日：2022-12-26
发明人： Bo ZHANG , Zhongqian NIU , Xiaobo YANG , Yinian FENG , Yi HU , Bingli DAI , Jicong ZHANG , Yong FAN , Yihong SU , Hongbin WANG , Yafei WU
CPC分类号： H04B1/0458 , H01Q13/08 , H04B1/03 , H04L5/14
摘要： A terahertz full-duplex co-local oscillator solid-state front-end transmitting circuit is disclosed, which belongs to the technical field of terahertz communication. The overall structure of the solid-state front-end transmitting circuit adopts a new system, wherein the circuit comprises two branches that are parallel and driven by a local oscillator source. A branched waveguide directional coupler is configured to output two driving signals provided by the same local oscillator source respectively to two branch circuits with required powers. Two transmission signals generated from the two branches are combined into one signal for transmission through an orthogonal mode coupled duplexer, so as to fulfill the construction of a full-duplex co-local oscillator solid-state front-end transmission circuit.
-
公开(公告)号：US20230223970A1
公开(公告)日：2023-07-13
申请号：US18183331
申请日：2023-03-14
发明人： Takanori UEJIMA , Dai NAKAGAWA , Yukiya YAMAGUCHI , Yuji TAKEMATSU , Motoji TSUDA , Mayuka ONO , Hiroki FUJIWARA , Kiyoshi AIKAWA , Takashi YAMADA
摘要： In a radio-frequency module, a conductive layer covers a major surface opposite to the mounting board side of a resin layer and a major surface opposite to the mounting board side of an electronic component. The electronic component includes an electronic component body and a plurality of outer electrodes. The electronic component body includes an electrical insulating portion and a conductive portion provided inside the electrical insulating portion, forming at least a portion of a circuit element of the electronic component. The electronic component body has a third major surface and a fourth major surface opposite to each other, and an outer side surface. The third major surface forms the major surface of the electronic component, and the third major surface is in contact with the conductive layer. The plurality of outer electrodes are provided on the fourth major surface, but are not extended over the third major surface.
-
公开(公告)号：US20230059387A1
公开(公告)日：2023-02-23
申请号：US17981741
申请日：2022-11-07
申请人： NEC Corporation
发明人： Masatoshi SHIMIZU
IPC分类号： H04B1/38 , H04B1/03 , H01Q1/12 , H04B1/3888
摘要： A mounting base (14) is fixed to an antenna (13) or an antenna bracket (15) for supporting the antenna (13). A baseband unit (11) and an RF unit (12) are fixed to the mounting base (14). The baseband unit (11) fixed to the mounting base (14) is disposed to face a back part (132) of the antenna (13) and to form a space between the back part (132) and the first enclosure (111). The RF unit (12) fixed to the mounting base (14) is disposed in the space formed between the back part (132) of the antenna (13) and the baseband unit (11) and is coupled to a waveguide flange (132) of the antenna (13). Thus, for example, in a configuration of a point-to-point wireless apparatus in which an RF unit and a baseband unit are separated, restrictions on installation space of the apparatus can be facilitated.
-
公开(公告)号：US11566139B2
公开(公告)日：2023-01-31
申请号：US17062082
申请日：2020-10-02
IPC分类号： H04B1/03 , C09D5/00 , C09D133/10 , C08F220/18 , C08K5/00 , C08K5/09 , C08K5/29 , C08L83/04
摘要： The present invention is directed to coated articles demonstrating a transmission of electromagnetic radiation having a frequency of 22 to 81 GHz in the range of 70% to 100%. The articles comprise substrates coated with curable film-forming compositions comprising a first film-forming polymer prepared from at least one hydrophobic monomer, a second film-forming polymer prepared from at least one hydrophobic monomer, and a curing agent. Upon application of the curable film-forming composition to the substrate to form a coating layer, the first film-forming polymer is distributed throughout the coating layer, and the concentration of the second film-forming polymer is greater at the surface of the coating layer than the concentration of the second film-forming polymer within the bulk of the coating layer. The present invention is also drawn to methods of mitigating contaminant build-up on a substrate using the curable film-forming compositions described above.
-
公开(公告)号：US11554278B2
公开(公告)日：2023-01-17
申请号：US17071632
申请日：2020-10-15
IPC分类号： A62C37/50 , F16K27/00 , E03B9/06 , A62C35/20 , E03B9/02 , F17D5/00 , G01D4/00 , G01F1/46 , F17D5/02 , F17D1/04 , G01M3/00 , H04B1/03
摘要： An infrastructure monitoring assembly includes a nozzle cap defining an internal cavity; an antenna positioned at least partially external to the internal cavity; and the antenna covered with a non-metallic material. An infrastructure monitoring assembly includes a nozzle cap defining a first end and a second end, the first end defining a threaded bore configured to mount on a nozzle of a fire hydrant; a cover coupled to the nozzle cap opposite from the first end; an enclosure positioned at least partially between the cover and the first end, the enclosure at least partially defining a cavity; a monitoring device positioned within the cavity; and an antenna positioned between the cover and the first end of the nozzle cap, the antenna connected in electrical communication with the monitoring device, the antenna covered by a non-metallic material.
-
公开(公告)号：US11528044B2
公开(公告)日：2022-12-13
申请号：US17210523
申请日：2021-03-24
摘要： A radio frequency module includes a module board; a first semiconductor device containing a first power amplifier and a second power amplifier; and a second semiconductor device containing a first switch, the first switch including a first terminal connected to the first power amplifier and a second terminal connected to the second power amplifier. In the radio frequency module, the first semiconductor device and the second semiconductor device are stacked together and disposed on the module board. An aspect of such a radio frequency module is that it is possible to achieve a compact form factor, although still provide RF transmit and receive capability. The RF module also includes external-connection terminals and a LNA, and the first semiconductor device and the low noise amplifier are disposed on mutually opposite surfaces of the module board.
-
公开(公告)号：US20220329271A1
公开(公告)日：2022-10-13
申请号：US17219864
申请日：2021-03-31
申请人： Keyssa Systems, Inc.
摘要： Methods, systems, and apparatus for using antennas for millimeter wave contactless communication. One of the apparatuses is a communication device that includes a transducer configured to convert electrical signals into extremely high frequency (EHF) electromagnetic signals, the EHF electromagnetic signals substantially emitted from a first surface of the communication device, wherein the transducer is positioned on a substrate of the communication device, and an integrated circuit coupled to the substrate, wherein the transducer includes multiple parallel resonant antenna elements in an array.
-
公开(公告)号：US20220278702A1
公开(公告)日：2022-09-01
申请号：US17744213
申请日：2022-05-13
申请人： Apple Inc.
发明人： Yuehui Ouyang , Yi Jiang , Matthew A. Mow , Basim Noori , Mattia Pascolini , Ruben Caballero
摘要： An electronic device may be provided with wireless circuitry. The wireless circuitry may include one or more antennas. The antennas may include phased antenna arrays each of which includes multiple antenna elements. Phased antenna arrays may be mounted along edges of a housing for the electronic device, behind a dielectric window such as a dielectric logo window in the housing, in alignment with dielectric housing portions at corners of the housing, or elsewhere in the electronic device. A phased antenna array may include arrays of patch antenna elements on dielectric layers separated by a ground layer. A baseband processor may distribute wireless signals to the phased antenna arrays at intermediate frequencies over intermediate frequency signal paths. Transceiver circuits at the phased antenna arrays may include upconverters and downconverters coupled to the intermediate frequency signal paths.
-
公开(公告)号：US11296731B2
公开(公告)日：2022-04-05
申请号：US16769384
申请日：2019-01-24
发明人： Makoto Okazaki , Seiitirou Iketani
摘要： A transmitter comprises a main body case, a controller that is provided inside the main body case, a communication unit that is connected to the controller, and an elongated antenna unit that is connected to the communication unit. The antenna unit is disposed along an inner wall surface of the main body case.
-
-
-
-
-
-
-
-
-
搜索结果
465 条记录 (耗时 0.025 秒)
