POLYMER COMPOUND PEELING AGENT, ADHESIVE MATERIAL, AND METHOD OF USING ADHESIVE MATERIALS

    公开(公告)号:US20210261830A1

    公开(公告)日:2021-08-26

    申请号:US17058737

    申请日:2020-05-08

    Abstract: The present invention provides a polymer compound peeling agent usable for peeling as many types of polymer compounds as possible and capable of reducing a burden required for a peeling treatment when a polymer compound having adhered to an adhesion object is peeled. The polymer compound peeling agent for peeling a polymer compound having adhered to an adhesion object contains a photoresponsive liquid crystal material having a phase structure reversibly transitioning between an isotropic phase and a liquid crystal phase due to photoisomerization based on irradiation lights of different wavelengths. When the polymer compound is adhered to the adhesion object, the photoresponsive liquid crystal material is contained in the polymer compound with the phase structure set to the isotropic phase, and the phase structure of the photoresponsive liquid crystal material is allowed to transition from the isotropic phase to the liquid crystal phase by photoisomerization based on the light irradiation.

    High-frequency probe position correction technology

    公开(公告)号:US11092651B2

    公开(公告)日:2021-08-17

    申请号:US16304895

    申请日:2017-04-12

    Inventor: Ryo Sakamaki

    Abstract: A high-frequency characteristic inspection apparatus includes a pair of high-frequency probes that inspect an electrical characteristic of a plane circuit including a signal region and a ground region formed apart from each other by an S parameter obtained by pushing a tip against a surface of the plane circuit and discharging a high frequency and a measurement apparatus. The high-frequency probe includes a ground terminal that is in contact with the ground region at its tip and a signal terminal that is in contact with the signal region simultaneously with the ground terminal at its tip. The pair of high-frequency probes are configured to contact with a surface of the plane circuit at the same time while facing each other at a certain interval.

    RELATIONSHIP ANALYSIS DEVICE, RELATIONSHIP ANALYSIS METHOD, AND RECORDING MEDIUM

    公开(公告)号:US20210232957A1

    公开(公告)日:2021-07-29

    申请号:US15734779

    申请日:2019-06-07

    Abstract: A relationship analysis device includes a parameter sample data calculation unit that calculates sample data for parameters for a simulator that receives inputs of data of a first type and outputs data of a second type, calculating sample data; a second type sample data acquisition unit that inputs, to the simulator, observation data and sample data, and obtains sample data of the second type; and a parameter value determination unit that calculates a weight for sample data based on the difference between observation data of the second type and the sample data of the second type, and based on the relationship between a first distribution that the observation data of the first type followed and a second distribution being a distribution of the data of the first type, and calculates a value for the parameters using the calculated weight.

    RELATIONSHIP ANALYSIS DEVICE, RELATIONSHIP ANALYSIS METHOD, AND RECORDING MEDIUM

    公开(公告)号:US20210224664A1

    公开(公告)日:2021-07-22

    申请号:US15734668

    申请日:2019-06-07

    Abstract: A relationship analysis device includes a parameter sample data calculation unit that calculates a plurality of pieces of sample data for parameters for a simulator that receives inputs of data of a first type and outputs data of a second type, calculating the plurality of pieces of sample data; a second type sample data acquisition unit that inputs, to the simulator, observation data of the first type and a plurality of pieces of sample data, and obtains sample data of the second type for each of the plurality of pieces of sample data; and a parameter value determination unit that calculates a weight for each of the plurality of pieces of sample data based on the difference between observation data of the second type and the calculated sample data of the second type and calculates a value for the parameters using the calculated weight.

    Method of manufacturing semiconductor package using alignment mark on wafer

    公开(公告)号:US11056410B2

    公开(公告)日:2021-07-06

    申请号:US16497283

    申请日:2018-03-28

    Abstract: A method of manufacturing a semiconductor package and a semiconductor package in which positional alignment between a wafer and a substrate until the wafer is mounted and packaged on the substrate is achieved accurately. A wafer is mounted on a package substrate by using first alignment marks and D-cuts as benchmarks, and then a mold resin layer is formed on the wafer in a state in which the first alignment mark is exposed. A part of the mold resin layer is removed by using the D-cuts exposed from the mold resin layer as benchmarks, so that the first alignment marks can be visually recognized. A second alignment marks are formed on the mold resin layer by using the first alignment marks as benchmarks. A Cu redistribution layer to be conducted to a pad portion is formed on a mold resin layer by using the second alignment marks as benchmarks.

    METHOD OF MOLDING PLANT-BASED MATERIAL AND MOLDED BODY

    公开(公告)号:US20210170625A1

    公开(公告)日:2021-06-10

    申请号:US16071223

    申请日:2017-01-24

    Abstract: In order to provide a method of molding plant-based material to mold three-dimensional shape of cross section for relatively long plant-based material while maintaining the continuity of original cell/tissue of the plant-based material by means of simple equipment and process, we obtained a long plant-based material of high density and high strength by continuously giving compressing/drawing deformation to the component tissue of the plant-based material toward the center direction while extruding the plant-based material via the extruding die having a prescribed extrusion ratio and die angle for a relatively long plant-based material long in the fiber direction.

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