公开(公告)号：US20170070294A1

公开(公告)日：2017-03-09

申请号：US15341965

申请日：2016-11-02

Applicant: INPHI CORPORATION

Inventor： Radhakrishnan L. NAGARAJAN

IPC: H04B10/40 ,  H04L7/00 ,  H04B10/54 ,  H04J14/02 ,  H04B10/50

CPC classification number: H04B10/40 ,  H04B10/2575 ,  H04B10/503 ,  H04B10/541 ,  H04J14/02 ,  H04L7/0075 ,  H04L12/40045 ,  H04L25/03006 ,  H04L2025/03433

Abstract: In an example, the present invention includes an integrated system-on-chip device. The device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. In an example, the device has a driver interface provided on the substrate member and coupled to the driver module and configured to be coupled to a silicon photonics device. In an example, a control block is configured to receive and send instruction(s) in a digital format to the communication block and is configured to receive and send signals in an analog format to communicate with the silicon photonics device.

Abstract translation: 在一个示例中，本发明包括集成片上系统设备。 该器件配置在单个硅衬底构件上。 该设备具有设置在基板部件上的数据输入/输出接口。 该装置具有设置在基板部件上并与数据输入/输出接口耦合的输入/输出块。 该装置具有设置在基板构件上并耦合到输入/输出块的信号处理块。 该装置具有设置在基板部件上并与信号处理块相连的驱动器模块。 在一个示例中，该设备具有设置在该衬底构件上的驱动器接口并且耦合到该驱动器模块并被配置为耦合到硅光子器件。 在一个示例中，控制块被配置为以数字格式接收和发送指令给通信块，并且被配置为以模拟格式接收和发送信号以与硅光子器件通信。

公开(公告)号：US20170005731A1

公开(公告)日：2017-01-05

申请号：US15268239

申请日：2016-09-16

Applicant: INPHI CORPORATION

Inventor： Radhakrishnan L. NAGARAJAN

IPC: H04B10/40 ,  H04B10/54 ,  H03L7/08 ,  H04B10/556

CPC classification number: H04B10/40 ,  H01S5/0261 ,  H01S5/0427 ,  H03L7/0807 ,  H03L2207/50 ,  H04B10/07955 ,  H04B10/541 ,  H04B10/5561 ,  H04B10/70 ,  H04B10/801 ,  H04J14/0221 ,  H04L49/109

Abstract: In an example, the present invention includes an integrated system on chip device. The device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. In an example, the device has a driver interface provided on the substrate member and coupled to the driver module and configured to be coupled to a silicon photonics device. The device also has an interface configured to communicate between the silicon photonics device and the control block.

Abstract translation: 在一个示例中，本发明包括集成片上系统设备。 该器件配置在单个硅衬底构件上。 该设备具有设置在基板部件上的数据输入/输出接口。 该装置具有设置在基板部件上并与数据输入/输出接口耦合的输入/输出块。 该装置具有设置在基板构件上并耦合到输入/输出块的信号处理块。 该装置具有设置在基板部件上并与信号处理块相连的驱动器模块。 在一个示例中，该设备具有设置在该衬底构件上的驱动器接口并且耦合到该驱动器模块并被配置为耦合到硅光子器件。 该器件还具有被配置为在硅光子器件和控制块之间通信的接口。

公开(公告)号：US20160327816A1

公开(公告)日：2016-11-10

申请号：US15072866

申请日：2016-03-17

Applicant: INPHI CORPORATION

Inventor： Radhakrishnan L. NAGARAJAN ,  Hari SHANKAR ,  Masaki KATO ,  Yang FU

IPC: G02F1/01 ,  H01S3/067 ,  H01S3/16 ,  G02F1/225

CPC classification number: G02F1/0123 ,  G02B6/12007 ,  G02F1/0147 ,  G02F1/025 ,  G02F1/225 ,  G02F1/2255 ,  G02F2001/212 ,  G02F2202/105 ,  H01S3/06754 ,  H01S3/1608 ,  H01S5/0085 ,  H01S5/0687 ,  H01S5/4012 ,  H01S5/4087 ,  H04B10/505 ,  H04B10/50575

Abstract: An integrated optical modulator device. The device can include a driver module coupled to an optical modulator. The optical modulator is characterized by a raised cosine transfer function. This optical modulator can be coupled to a light source and a bias control module, which is configured to apply an off-quadrature bias to the optical modulator. This bias can be accomplished by applying an inverse of the modulator transfer function to the optical modulator in order to minimize a noise variance. This compression function can result in an optimized increased top eye opening for a signal associated with the optical modulator. Furthermore, the optical modulator can be coupled to an EDFA (Erbium Doped Fiber Amplifier) that is coupled to a filter coupled an O/E (Optical-to-Electrical) receiver.

Abstract translation: 集成光调制器装置。 该装置可以包括耦合到光调制器的驱动器模块。 光调制器的特征在于升高的余弦传递函数。 该光调制器可以耦合到光源和偏置控制模块，该偏置控制模块被配置为向光调制器施加非正交偏置。 可以通过将调制器传递函数的反相应用于光调制器来实现该偏置，以便最小化噪声方差。 该压缩功能可以导致用于与光学调制器相关联的信号的优化的增加的顶部眼睛开度。 此外，光调制器可以耦合到耦合到耦合到O / E（光 - 电）接收器的滤波器的EDFA（掺铒光纤放大器）。

公开(公告)号：US20160261361A1

公开(公告)日：2016-09-08

申请号：US15158982

申请日：2016-05-19

Applicant: INPHI CORPORATION

Inventor： Radhakrishnan L. NAGARAJAN

IPC: H04J14/02 ,  H04L12/933 ,  H04B10/556 ,  H04B10/70 ,  H04B10/079

CPC classification number: H04B10/40 ,  H01S5/0261 ,  H01S5/0427 ,  H03L7/0807 ,  H03L2207/50 ,  H04B10/07955 ,  H04B10/541 ,  H04B10/5561 ,  H04B10/70 ,  H04B10/801 ,  H04J14/0221 ,  H04L49/109

Abstract: In an example, the present invention includes an integrated system on chip device. The device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. In an example, the device has a driver interface provided on the substrate member and coupled to the driver module and configured to be coupled to a silicon photonics device. The device also has an interface configured to communicate between the silicon photonics device and the control block.

公开(公告)号：US20160191151A1

公开(公告)日：2016-06-30

申请号：US15065789

申请日：2016-03-09

Applicant: INPHI CORPORATION

Inventor： Radhakrishnan L. NAGARAJAN

IPC: H04B10/038

CPC classification number: H04B10/038 ,  H01S5/0085 ,  H01S5/06825 ,  H01S5/4025 ,  H04B10/503 ,  H04B10/516 ,  H04B10/801 ,  H04J14/02 ,  H04L1/0042 ,  H04Q11/0003

Abstract: In an example, the present invention includes an integrated system on chip device. At least a pair of laser devices are associated with a channel and coupled to a switch to select one of the pair of laser devices to be coupled to an optical multiplexer to provide for a redundant laser device.

Abstract translation: 在一个示例中，本发明包括集成片上系统设备。 至少一对激光器件与通道相关联并耦合到开关，以选择要耦合到光复用器的一对激光器件中的一个以提供冗余激光器件。

公开(公告)号：US20150249501A1

公开(公告)日：2015-09-03

申请号：US14625489

申请日：2015-02-18

Applicant: INPHI CORPORATION

Inventor： Radhakrishnan L. NAGARAJAN

IPC: H04B10/2575 ,  H04B10/40 ,  H04J14/02

CPC classification number: H04J14/02 ,  H04B10/40

Abstract: An integrated apparatus with optical/electrical interfaces and protocol converter on a single silicon substrate. The apparatus includes an optical module comprising one or more modulators respectively coupled with one or more laser devices for producing a first optical signal to an optical interface and one or more photodetectors for detecting a second optical signal from the optical interface to generate a current signal. Additionally, the apparatus includes a transmit lane module coupled between the optical module and an electrical interface to receive a first electric signal from the electrical interface and provide a framing protocol for driving the one or more modulators. Furthermore, the apparatus includes a receive lane module coupled between the optical module and the electrical interface to process the current signal to send a second electric signal to the electrical interface.

Abstract translation: 在单个硅衬底上具有光/电接口和协议转换器的集成设备。 该装置包括一个光学模块，该光学模块包括分别与一个或多个激光装置耦合的一个或多个调制器，用于产生到光学接口的第一光信号，以及一个或多个光电检测器，用于检测来自光学接口的第二光信号以产生电流信号。 另外，该装置包括耦合在光学模块和电接口之间以从电接口接收第一电信号并提供用于驱动一个或多个调制器的成帧协议的发射通道模块。 此外，该装置包括耦合在光学模块和电接口之间的接收通道模块，以处理电流信号以向电接口发送第二电信号。