Electrostatic discharge (ESD) protection circuit for multiple power domain integrated circuit
    102.
    发明申请
    Electrostatic discharge (ESD) protection circuit for multiple power domain integrated circuit 有权
    多功率集成电路的静电放电(ESD)保护电路

    公开(公告)号:US20070097581A1

    公开(公告)日:2007-05-03

    申请号:US11264557

    申请日:2005-11-01

    CPC classification number: H02H9/046 H01L2924/0002 H01L2924/00

    Abstract: An integrated circuit (300/400) includes first and second power domains and a bank of input/output (I/O) cells (305/405) coupled to the first and second power domains. The bank of I/O cells (305/405) includes a first plurality of active clamps (374/445) for the first power domain and a second plurality of active clamps (384/425) for the second power domain wherein the first (374/445) and second (384/425) pluralities of active clamps overlap along the bank of I/O cells. According to one aspect each of the plurality of input/output cells (420, 440) has a bonding pad (421, 441) for receiving an output signal referenced to a respective first power domain, and at least one ESD protection element (425, 445) for a respective second power domain. According to another aspect, each of the plurality of input/output cells (420, 440) has a bonding pad (421, 441) for receiving a respective output signal and at least one ESD protection element for each of a first power domain and a second power domain.

    Abstract translation: 集成电路(300/400)包括耦合到第一和第二电源域的第一和第二电源域和一组输入/输出(I / O)单元(305/405)。 I / O单元组(305/405)包括用于第一功率域的第一多个有源钳位(374/445)和用于第二功率域的第二多个有源钳位(384/425),其中第一( 374/445)和第二(384/425)个多个有源钳位沿I / O单元组重叠。 根据一个方面,多个输入/输出单元(420,440)中的每一个具有用于接收参考相应的第一功率域的输出信号的接合焊盘(421,441)和至少一个ESD保护元件(425,440) 445)用于相应的第二功率域。 根据另一方面,多个输入/输出单元(420,440)中的每一个具有用于接收相应输出信号的接合焊盘(421,441)和用于第一功率域和第一功率域中的每一个的至少一个ESD保护元件 第二功率域。

    THERMALLY CONDUCTIVE THERMOPLASTICS FOR DIE-LEVEL PACKAGING OF MICROELECTRONICS
    103.
    发明申请
    THERMALLY CONDUCTIVE THERMOPLASTICS FOR DIE-LEVEL PACKAGING OF MICROELECTRONICS 审中-公开
    用于微电子电路封装的导热热电偶

    公开(公告)号:US20070045823A1

    公开(公告)日:2007-03-01

    申请号:US11467282

    申请日:2006-08-25

    Applicant: James Miller

    Inventor: James Miller

    CPC classification number: H01L23/295 H01L33/641 H01L2924/0002 H01L2924/00

    Abstract: A composition and method for die-level packaging of microelectronics is disclosed. The composition includes about 20% to about 80% of a thermoplastic base matrix; about 20% to about 70% of a non-metallic, thermally conductive material such that the composition has a coefficient of thermal expansion of less than 20 ppm/C and a thermal conductivity of greater than 1.0 W/mK. Using injection molding techniques, the composition can be molten and then injected into a die containing the microelectronics to encapsulate the microelectronics therein.

    Abstract translation: 公开了一种用于微电子学模具级封装的组合物和方法。 该组合物包括约20%至约80%的热塑性基质; 约20%至约70%的非金属导热材料,使得组合物的热膨胀系数小于20ppm /℃,导热系数大于1.0W / mK。 使用注射成型技术,可以将组合物熔化,然后注入包含微电子学的模具中以将微电子学封装在其中。

    Node-to-node communication pipelines
    104.
    发明申请
    Node-to-node communication pipelines 有权
    节点到节点的通信流水线

    公开(公告)号:US20070016691A1

    公开(公告)日:2007-01-18

    申请号:US11181614

    申请日:2005-07-14

    CPC classification number: H04L69/18

    Abstract: Node-to-node communication pipelines may include code modules that are configured and assembled across a protocol according to dynamically input module-specific parameters. The parameters may be input to a service into which the modules are registered, and one or more appropriate pipelines may be dynamically assembled.

    Abstract translation: 节点到节点通信管线可以包括根据动态输入模块特定参数在协议上配置和组合的代码模块。 可以将参数输入到模块被注册到的服务中,并且可以动态地组合一个或多个适当的管道。

    Systems and methods for combining subscription services, rewards programs, and sweepstakes
    105.
    发明申请
    Systems and methods for combining subscription services, rewards programs, and sweepstakes 审中-公开
    组合订阅服务,奖励计划和抽奖活动的系统和方法

    公开(公告)号:US20060253324A1

    公开(公告)日:2006-11-09

    申请号:US11404373

    申请日:2006-04-14

    Applicant: James Miller

    Inventor: James Miller

    CPC classification number: G06Q30/02 G06Q30/0212 G06Q30/0235 G06Q30/0236

    Abstract: A method includes, in response to a request by a subscriber for a subscription to a product or service, wherein the subscription has a subscription period and wherein the subscription period is initially for a first period of time, automatically providing the subscriber with the product or service for the first period of time. The method also includes automatically entering the subscriber into one or more sweepstakes drawings which occur during the first period of time. The one or more sweepstakes drawings have one or more corresponding jackpots. The method also includes, at the end of the subscription period, automatically renewing the subscription for a next period of time; and in connection with the renewed subscription, automatically entering the subscriber into one or more sweepstakes drawings which occur during the next period of time. The operations of automatic renewing the subscription for a next period of time, and automatically entering the subscriber into one or more sweepstakes drawings occurring during that period of time are repeated until the subscriber terminates the subscription.

    Abstract translation: 一种方法包括响应于订户对产品或服务的订阅的请求,其中订阅具有订阅周期,并且其中订阅周期最初是第一时间段,自动向用户提供产品或 服务第一期。 该方法还包括将用户自动地输入到在第一时间段期间发生的一个或多个抽奖图。 一个或多个抽奖图纸具有一个或多个相应的累积奖金。 该方法还包括在订阅周期结束时自动续订订阅下一段时间; 并且与更新的订阅有关,自动地将用户输入到在下一段时间内发生的一个或多个抽奖图。 在下一个时间段内自动更新订阅的操作以及在该时间段内自动进入一个或多个抽奖绘图的用户被重复直到订阅者终止订阅。

    Plastic container
    106.
    发明申请
    Plastic container 有权
    塑料容器

    公开(公告)号:US20060207963A1

    公开(公告)日:2006-09-21

    申请号:US11430610

    申请日:2006-05-09

    Abstract: A blow molded, hollow plastic container including two opposed, relatively longer sidewall portions which alternate with two opposed, relatively shorter sidewall portions. A first of the relatively shorter sidewall portions includes a grip area, and the opposed second relatively shorter sidewall portion includes a pour area.

    Abstract translation: 吹塑成型的中空塑料容器,其包括两个相对的相对较长的侧壁部分,其与两个相对较短的侧壁部分交替。 相对较短的侧壁部分中的第一个包括握持区域,并且相对的第二相对较短的侧壁部分包括倾倒区域。

    High-density, thermally-conductive plastic compositions for encapsulating motors
    107.
    发明授权
    High-density, thermally-conductive plastic compositions for encapsulating motors 有权
    用于密封电机的高密度导热塑料组合物

    公开(公告)号:US07077990B2

    公开(公告)日:2006-07-18

    申请号:US10607352

    申请日:2003-06-26

    Applicant: James Miller

    Inventor: James Miller

    Abstract: A method for making a stator assembly having a thermally-conductive, plastic housing for a high speed motor is provided. A thermally-conductive, high-density polymer composition is used to make the housing, and the stator is uniformly encapsulated therein. The polymer composition comprises a base polymer matrix such as polyphenylene sulfide, and a thermally-conductive, high-density filler material such as zinc oxide.

    Abstract translation: 提供一种用于制造具有用于高速电动机的导热塑料壳体的定子组件的方法。 使用导热高密度聚合物组合物制造壳体,并且定子被均匀地包封在其中。 聚合物组合物包括聚苯硫醚等基础聚合物基质,氧化锌等导热性高密度填料。

    Electrostatic discharge protection for an integrated circuit
    110.
    发明申请
    Electrostatic discharge protection for an integrated circuit 审中-公开
    集成电路的静电放电保护

    公开(公告)号:US20060028776A1

    公开(公告)日:2006-02-09

    申请号:US10914442

    申请日:2004-08-09

    CPC classification number: H01L27/0255 H01L27/0292

    Abstract: An ESD protection circuit (40) uses parasitic drain-body diodes (47, 49) of the output buffer transistors (46, 48) as the main, or dominant, ESD protection diodes. Specifically, butted source-body ties in the output buffer transistors (46, 48) provide the ESD diodes (47, 49). Using parasitic drain-body diodes of output buffer transistors with butted source-body ties as the dominant ESD diodes reduces the layout area required to implement the ESD protection circuit as compared to an ESD protection circuit having stand alone diodes. Also, the butted source-body ties reduce susceptibility to latch-up and reduce capacitive loading because there are no added diffusion regions tied to the pad.

    Abstract translation: ESD保护电路(40)使用输出缓冲晶体管(46,48)的寄生漏极体二极管(47,49)作为主要或主要的ESD保护二极管。 具体地说,输出缓冲晶体管(46,48)中的对接源体连接提供ESD二极管(47,49)。 与具有独立二极管的ESD保护电路相比,使用具有对接源体束带的输出缓冲晶体管的寄生漏极体二极管作为主要ESD二极管减少了实现ESD保护电路所需的布局面积。 此外,对接的源体相关性降低了闩锁的敏感性并降低了电容负载,因为没有附加的扩散区域与焊盘相连。

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