公开(公告)号：US20060154469A1

公开(公告)日：2006-07-13

申请号：US11033008

申请日：2005-01-11

申请人： Kevin Hess ,  Susan Downey ,  James Miller ,  Cheng Yong

发明人： Kevin Hess ,  Susan Downey ,  James Miller ,  Cheng Yong

IPC分类号： H01L21/4763

CPC分类号： H01L24/05 ,  H01L23/522 ,  H01L23/53214 ,  H01L23/53228 ,  H01L24/03 ,  H01L2224/05624 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00014

摘要： A method provides an interconnect structure having enhanced structural support when underlying functional metal layers are insulated with a low modulus dielectric. A first metal layer having a plurality of openings overlies the substrate. A first electrically insulating layer overlies the first metal layer. A second metal layer overlies the first electrically insulating layer, the second metal layer having a plurality of openings. An interconnect pad that defines an interconnect pad area overlies the second metal layer. At least a certain amount of the openings in the two metal layers are aligned to improve structural strength of the interconnect structure. The amount of alignment may differ depending upon the application and materials used. A bond wire connection or conductive bump may be used with the interconnect structure.

公开(公告)号：US20070210442A1

公开(公告)日：2007-09-13

申请号：US11750048

申请日：2007-05-17

申请人： Kevin Hess ,  Susan Downey ,  James Miller ,  Cheng Yong

发明人： Kevin Hess ,  Susan Downey ,  James Miller ,  Cheng Yong

IPC分类号： H01L23/053

CPC分类号： H01L24/05 ,  H01L23/522 ,  H01L23/53214 ,  H01L23/53228 ,  H01L24/03 ,  H01L2224/05624 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00014

摘要： A method provides an interconnect structure having enhanced structural support when underlying functional metal layers are insulated with a low modulus dielectric. A first metal layer having a plurality of openings overlies the substrate. A first electrically insulating layer overlies the first metal layer. A second metal layer overlies the first electrically insulating layer, the second metal layer having a plurality of openings. An interconnect pad that defines an interconnect pad area overlies the second metal layer. At least a certain amount of the openings in the two metal layers are aligned to improve structural strength of the interconnect structure. The amount of alignment may differ depending upon the application and materials used. A bond wire connection or conductive bump may be used with the interconnect structure.

摘要翻译： 当底层功能性金属层与低模量电介质绝缘时，一种方法提供具有增强的结构支撑的互连结构。 具有多个开口的第一金属层覆盖在基板上。 第一电绝缘层覆盖在第一金属层上。 第二金属层覆盖在第一电绝缘层上，第二金属层具有多个开口。 限定互连焊盘区域的互连焊盘覆盖在第二金属层上。 两个金属层中的至少一定量的开口对齐以提高互连结构的结构强度。 取决于使用的应用和材料，对齐量可能会有所不同。 接合线连接或导电凸块可以与互连结构一起使用。

公开(公告)号：US20050122198A1

公开(公告)日：2005-06-09

申请号：US10729531

申请日：2003-12-05

申请人： Yaping Zhou ,  Susan Downey ,  Sheila Chopin ,  Tu-Anh Tran ,  Alan Woosley ,  Peter Harper ,  Perry Pelley

发明人： Yaping Zhou ,  Susan Downey ,  Sheila Chopin ,  Tu-Anh Tran ,  Alan Woosley ,  Peter Harper ,  Perry Pelley

IPC分类号： H01F17/00 ,  H01F41/04 ,  H01L23/522 ,  H01F5/00

CPC分类号： H01F17/0033 ,  H01F41/046 ,  H01L23/5227 ,  H01L23/645 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4813 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/3025 ,  Y10T29/4902 ,  H01L2224/45015 ,  H01L2924/207

摘要： An inductive device (105) is formed above a substrate (225) having a conductive coil formed around a core (109). The coil comprises segments formed from a first plurality of bond wires (113) and a second plurality of bond wires (111). The first plurality of bond wires (113) extends between the core (109) and the substrate (225). Each of the first plurality of bond wires is coupled to two of a plurality of wire bond pads (117, 116). The second plurality of bond wires (111) extends over the core (109) and is coupled between two of the plurality of wire bond pads (117, 119). A shield (141) includes a portion that is positioned between the core (109) and the substrate (225).

摘要翻译： 在具有围绕芯（109）形成的导电线圈的衬底（225）上方形成感应器件（105）。 线圈包括由第一多个接合线（113）和第二多个接合线（111）形成的线段。 第一多个接合线（113）在芯（109）和衬底（225）之间延伸。 第一多个接合线中的每一个耦合到多个引线接合焊盘（117,116）中的两个。 所述第二多个接合线（111）在所述芯（109）上方延伸并耦合在所述多个引线接合焊盘（117,119）中的两个之间。 屏蔽（141）包括位于芯（109）和衬底（225）之间的部分。