公开(公告)号：US08728919B2

公开(公告)日：2014-05-20

申请号：US13723601

申请日：2012-12-21

申请人： Masaru Kito ,  Yoshiaki Fukuzumi ,  Masaru Kidoh ,  Megumi Ishiduki ,  Yosuke Komori ,  Hiroyasu Tanaka ,  Ryota Katsumata ,  Hideaki Aochi

发明人： Masaru Kito ,  Yoshiaki Fukuzumi ,  Masaru Kidoh ,  Megumi Ishiduki ,  Yosuke Komori ,  Hiroyasu Tanaka ,  Ryota Katsumata ,  Hideaki Aochi

IPC分类号： H01L21/20

CPC分类号： H01L29/7926 ,  H01L27/0688 ,  H01L27/11551 ,  H01L27/11556 ,  H01L29/7881

摘要： A non-volatile semiconductor storage device includes a plurality of memory strings each having a plurality of electrically rewritable memory cells connected in series. Each of the memory strings comprising: a first semiconductor layer including a columnar portion extending in a vertical direction with respect to a substrate; a plurality of first conductive layers formed to surround side surfaces of the columnar portions via insulation layers, and formed at a certain pitch in the vertical direction, the first conductive layers functioning as floating gates of the memory cells; and a plurality of second conductive layers formed to surround the first conductive layers via insulation layers, and functioning as control electrodes of the memory cells. Each of the first conductive layers has a length in the vertical direction that is shorter than a length in the vertical direction of each of the second conductive layers.

摘要翻译： 非挥发性半导体存储装置包括多个存储串，每个存储串具有串联连接的多个电可重写存储单元。 每个存储器串包括：第一半导体层，包括相对于衬底在垂直方向上延伸的柱状部分; 多个第一导电层，经由绝缘层形成为围绕柱状部分的侧表面，并以垂直方向上的一定间距形成，第一导电层用作存储器单元的浮动栅极; 以及形成为经由绝缘层包围第一导电层并且用作存储单元的控制电极的多个第二导电层。 每个第一导电层在垂直方向上具有比每个第二导电层的垂直方向上的长度短的长度。

公开(公告)号：US08410538B2

公开(公告)日：2013-04-02

申请号：US12834390

申请日：2010-07-12

申请人： Megumi Ishiduki ,  Yoshiaki Fukuzumi ,  Ryota Katsumata ,  Masaru Kidoh ,  Masaru Kito ,  Hideaki Aochi

发明人： Megumi Ishiduki ,  Yoshiaki Fukuzumi ,  Ryota Katsumata ,  Masaru Kidoh ,  Masaru Kito ,  Hideaki Aochi

IPC分类号： H01L29/66

CPC分类号： H01L27/11578 ,  H01L27/11582 ,  H01L29/7926

摘要： According to one embodiment, a semiconductor memory device includes a substrate, a stacked body, a memory film, and a SiGe film. The stacked body includes a plurality of conductive layers and a plurality of insulating layers alternately stacked above the substrate. The memory film includes a charge storage film. The memory film is provided on a sidewall of a memory hole punched through the stacked body. The SiGe film is provided inside the memory film in the memory hole.

摘要翻译： 根据一个实施例，半导体存储器件包括衬底，层叠体，存储膜和SiGe膜。 层叠体包括交替层叠在基板的上方的多个导电层和多个绝缘层。 记忆膜包括电荷存储膜。 记忆膜设置在穿过堆叠体的冲击的存储孔的侧壁上。 SiGe膜被提供在存储器孔内的记忆膜内部。

公开(公告)号：US08247863B2

公开(公告)日：2012-08-21

申请号：US12708161

申请日：2010-02-18

申请人： Yoshiaki Fukuzumi ,  Ryota Katsumata ,  Masaru Kito ,  Masaru Kidoh ,  Hiroyasu Tanaka ,  Megumi Ishiduki ,  Yosuke Komori ,  Hideaki Aochi

发明人： Yoshiaki Fukuzumi ,  Ryota Katsumata ,  Masaru Kito ,  Masaru Kidoh ,  Hiroyasu Tanaka ,  Megumi Ishiduki ,  Yosuke Komori ,  Hideaki Aochi

IPC分类号： H01L29/792

CPC分类号： H01L27/11578 ,  H01L27/11582 ,  H01L29/792 ,  H01L29/7926

摘要： A memory string comprises: a pair of columnar portions; a first insulating layer surrounding a side surface of the columnar portions; a charge storage layer surrounding a side surface of the first insulating layer; a second insulating layer surrounding a side surface of the charge storage layer; and a first conductive layer surrounding a side surface of the second insulating layer. A select transistor comprises: a second semiconductor layer extending from an upper surface of the columnar portions; a third insulating layer surrounding a side surface of the second semiconductor layer; a fourth insulating layer surrounding a side surface of the third insulating layer; and a second conductive layer surrounding a side surface of the fourth insulating layer. The first semiconductor layer is formed continuously in an integrated manner with the second semiconductor layer. The first insulating layer is formed continuously in an integrated manner with the third insulating layer.

摘要翻译： 存储器串包括：一对柱状部分; 围绕所述柱状部分的侧表面的第一绝缘层; 围绕所述第一绝缘层的侧表面的电荷存储层; 围绕电荷存储层的侧表面的第二绝缘层; 以及围绕所述第二绝缘层的侧表面的第一导电层。 选择晶体管包括：从柱状部分的上表面延伸的第二半导体层; 围绕所述第二半导体层的侧表面的第三绝缘层; 围绕所述第三绝缘层的侧表面的第四绝缘层; 以及围绕所述第四绝缘层的侧表面的第二导电层。 第一半导体层以与第二半导体层一体化的方式连续地形成。 第一绝缘层与第三绝缘层一体地形成。

公开(公告)号：US20120135595A1

公开(公告)日：2012-05-31

申请号：US13365600

申请日：2012-02-03

申请人： Masaru Kito ,  Ryota Katsumata ,  Masaru Kidoh ,  Hiroyasu Tanaka ,  Yoshiaki Fukuzumi ,  Hideaki Aochi ,  Yasuyuki Matsuoka

发明人： Masaru Kito ,  Ryota Katsumata ,  Masaru Kidoh ,  Hiroyasu Tanaka ,  Yoshiaki Fukuzumi ,  Hideaki Aochi ,  Yasuyuki Matsuoka

IPC分类号： H01L21/336

CPC分类号： H01L29/7881 ,  H01L27/115 ,  H01L27/11556

摘要： A non-volatile semiconductor storage device has a plurality of memory strings with a plurality of electrically rewritable memory cells connected in series. Each of the memory strings includes: a first columnar semiconductor layer extending in a direction perpendicular to a substrate; a charge accumulation layer formed on the first columnar semiconductor layer via a first air gap and accumulating charges; a block insulation layer contacting the charge accumulation layer; and a plurality of first conductive layers contacting the block insulation layer.

摘要翻译： 非易失性半导体存储装置具有多个具有串联连接的多个电可重写存储单元的存储器串。 每个存储器串包括：在垂直于衬底的方向上延伸的第一柱状半导体层; 电荷累积层，经由第一气隙形成在第一柱状半导体层上，并积累电荷; 与电荷累积层接触的块绝缘层; 以及与块绝缘层接触的多个第一导电层。

公开(公告)号：US08148769B2

公开(公告)日：2012-04-03

申请号：US12534576

申请日：2009-08-03

申请人： Masaru Kito ,  Yoshiaki Fukuzumi ,  Ryota Katsumata ,  Masaru Kidoh ,  Hiroyasu Tanaka ,  Megumi Ishiduki ,  Yosuke Komori ,  Hideaki Aochi

发明人： Masaru Kito ,  Yoshiaki Fukuzumi ,  Ryota Katsumata ,  Masaru Kidoh ,  Hiroyasu Tanaka ,  Megumi Ishiduki ,  Yosuke Komori ,  Hideaki Aochi

IPC分类号： H01L29/788

CPC分类号： H01L27/11578 ,  H01L27/11582 ,  H01L29/66833 ,  H01L29/792 ,  H01L29/7926

摘要： A nonvolatile semiconductor memory device includes a plurality of memory strings, each of which has a plurality of electrically rewritable memory cells connected in series; and select transistors, one of which is connected to each of ends of each of the memory strings. Each of the memory strings is provided with a first semiconductor layer having a pair of columnar portions extending in a perpendicular direction with respect to a substrate, and a joining portion formed so as to join lower ends of the pair of columnar portions; a charge storage layer formed so as to surround a side surface of the columnar portions; and a first conductive layer formed so as to surround the side surface of the columnar portions and the charge storage layer, and configured to function as a control electrode of the memory cells. Each of the select transistors is provided with a second semiconductor layer extending upwardly from an upper surface of the columnar portions; and a second conductive layer formed so as to surround a side surface of the second semiconductor layer with a gap interposed, and configured to function as a control electrode of the select transistors.

摘要翻译： 非易失性半导体存储器件包括多个存储串，每个存储串具有串联连接的多个电可重写存储单元; 并选择晶体管，其中一个连接到每个存储器串的每一端。 每个存储器串都具有第一半导体层，该第一半导体层具有相对于衬底在垂直方向上延伸的一对柱状部分，以及形成为连接该一对柱状部分的下端的接合部分; 形成为围绕所述柱状部的侧面的电荷存储层; 以及形成为围绕柱状部分的侧面和电荷存储层的第一导电层，并且被配置为用作存储单元的控制电极。 每个选择晶体管设置有从柱状部分的上表面向上延伸的第二半导体层; 以及第二导电层，其被形成为以间隔开的方式围绕所述第二半导体层的侧表面，并且被配置为用作所述选择晶体管的控制电极。

公开(公告)号：US20110233644A1

公开(公告)日：2011-09-29

申请号：US12839895

申请日：2010-07-20

申请人： Yoshiaki FUKUZUMI ,  Ryota Katsumata ,  Masaru Kito ,  Masaru Kidoh ,  Hiroyasu Tanaka ,  Hideaki Aochi

发明人： Yoshiaki FUKUZUMI ,  Ryota Katsumata ,  Masaru Kito ,  Masaru Kidoh ,  Hiroyasu Tanaka ,  Hideaki Aochi

IPC分类号： H01L29/792

CPC分类号： H01L29/7926 ,  H01L21/28282 ,  H01L27/11578 ,  H01L27/11582 ,  H01L29/42344 ,  H01L29/66833

摘要： According to one embodiment, a nonvolatile semiconductor memory device includes first and second stacked structural bodies, first and second semiconductor pillars, a memory unit connection portion, a selection unit stacked structural body, first and second selection unit semiconductor pillars, a selection unit connection portion, and first to fifth interconnections. The semiconductor pillars pierce the stacked structural bodies. The first and second interconnections are connected to the first and second semiconductor pillars, respectively. The memory unit connection portion connects the first and second semiconductor pillars. The selection unit semiconductor pillars pierce the selection unit stacked structural body. The third and fourth interconnections are connected to the first and second selection unit semiconductor pillars, respectively. The selection unit connection portion connects the first and second selection unit semiconductor pillars. The fifth interconnection is connected to the third interconnection on a side opposite to the selection unit stacked structural body.

摘要翻译： 根据一个实施例，非易失性半导体存储器件包括第一和第二堆叠结构体，第一和第二半导体柱，存储单元连接部分，选择单元堆叠结构体，第一和第二选择单元半导体柱，选择单元连接部分 ，以及第一至第五互连。 半导体支柱刺穿堆叠的结构体。 第一和第二互连分别连接到第一和第二半导体柱。 存储单元连接部分连接第一和第二半导体柱。 选择单元半导体柱刺穿选择单元堆叠结构体。 第三和第四互连分别连接到第一和第二选择单元半导体柱。 选择单元连接部分连接第一和第二选择单元半导体柱。 第五互连在与选择单元堆叠结构体相反的一侧连接到第三互连。

公开(公告)号：US20110227140A1

公开(公告)日：2011-09-22

申请号：US12834390

申请日：2010-07-12

申请人： Megumi ISHIDUKI ,  Yoshiaki Fukuzumi ,  Ryota Katsumata ,  Masaru Kidoh ,  Masaru Kito ,  Hideaki Aochi

发明人： Megumi ISHIDUKI ,  Yoshiaki Fukuzumi ,  Ryota Katsumata ,  Masaru Kidoh ,  Masaru Kito ,  Hideaki Aochi

IPC分类号： H01L27/115 ,  H01L21/8246

CPC分类号： H01L27/11578 ,  H01L27/11582 ,  H01L29/7926

摘要： According to one embodiment, a semiconductor memory device includes a substrate, a stacked body, a memory film, and a SiGe film. The stacked body includes a plurality of conductive layers and a plurality of insulating layers alternately stacked above the substrate. The memory film includes a charge storage film. The memory film is provided on a sidewall of a memory hole punched through the stacked body. The SiGe film is provided inside the memory film in the memory hole.

摘要翻译： 根据一个实施例，半导体存储器件包括衬底，层叠体，存储膜和SiGe膜。 层叠体包括交替层叠在基板的上方的多个导电层和多个绝缘层。 记忆膜包括电荷存储膜。 记忆膜设置在穿过堆叠体的冲击的存储孔的侧壁上。 SiGe膜被提供在存储器孔内的记忆膜内部。

公开(公告)号：US07969789B2

公开(公告)日：2011-06-28

申请号：US12536226

申请日：2009-08-05

申请人： Ryota Katsumata ,  Masaru Kito ,  Yoshiaki Fukuzumi ,  Masaru Kidoh ,  Hiroyasu Tanaka ,  Megumi Ishiduki ,  Yosuke Komori ,  Hideaki Aochi

发明人： Ryota Katsumata ,  Masaru Kito ,  Yoshiaki Fukuzumi ,  Masaru Kidoh ,  Hiroyasu Tanaka ,  Megumi Ishiduki ,  Yosuke Komori ,  Hideaki Aochi

IPC分类号： G11C16/04

CPC分类号： H01L27/11578 ,  G11C11/5671 ,  G11C16/0475 ,  G11C16/0483 ,  H01L27/11551 ,  H01L27/11556 ,  H01L27/11582

摘要： In a nonvolatile semiconductor memory device having n (n is an integer of two or more) electrode films stacked and having charge storage layers provided above and below each of the electrode films, when data “0” is written by injecting electrons into the charge storage layer on a source line side of a memory cell of the number k (k is an integer of 1 to (n−1)) as counted from an end on a bit line side in a selected semiconductor pillar, positive program potential is given to the electrode film of the number 1 to k as counted from the bit line side, and 0 V is given to the electrode film of the number (k+1) to n, therewith positive potential is given to the bit line and 0 V is given to the source line.

摘要翻译： 在具有n（n为2以上的整数）的电极膜的非易失性半导体存储装置中，在各电极膜的上下配置有电荷存储层的情况下，在将数据“0”注入到电荷存储部 在选择的半导体柱中从位线侧的端部开始计数k（k为1〜（n-1）的整数）的存储单元的源极侧的层，将正的程序电位赋予 从位线侧计数1〜k的电极膜，向数字（k + 1）〜n的电极膜施加0V，其中给定位线为0V，0V为 给源线。

公开(公告)号：US07847334B2

公开(公告)日：2010-12-07

申请号：US12403919

申请日：2009-03-13

申请人： Ryota Katsumata ,  Masaru Kito ,  Hiroyasu Tanaka ,  Masaru Kidoh ,  Yoshiaki Fukuzumi ,  Hideaki Aochi ,  Yasuyuki Matsuoka

发明人： Ryota Katsumata ,  Masaru Kito ,  Hiroyasu Tanaka ,  Masaru Kidoh ,  Yoshiaki Fukuzumi ,  Hideaki Aochi ,  Yasuyuki Matsuoka

IPC分类号： H01L29/788

CPC分类号： H01L21/764 ,  H01L27/11551 ,  H01L27/11556 ,  H01L27/11575 ,  H01L27/11578

摘要： A non-volatile semiconductor storage device has a plurality of memory strings with a plurality of electrically rewritable memory cells connected in series. Each of the memory strings comprises: a first columnar semiconductor layer extending in a vertical direction to a substrate; a charge accumulation layer formed around the first columnar semiconductor layer via a first insulation layer; and a first conductive layer formed around the charge accumulation layer via a second insulation layer. Each of the first conductive layers is formed to expand in a two-dimensional manner, and air gaps are formed between the first conductive layers located there above and there below.

摘要翻译： 非易失性半导体存储装置具有多个具有串联连接的多个电可重写存储单元的存储器串。 每个存储器串包括：沿垂直方向延伸到衬底的第一柱状半导体层; 电荷累积层，经由第一绝缘层形成在第一柱状半导体层周围; 以及经由第二绝缘层形成在电荷累积层周围的第一导电层。 每个第一导电层被形成为以二维方式膨胀，并且在位于其上方和下方的第一导电层之间形成气隙。

公开(公告)号：US07821058B2

公开(公告)日：2010-10-26

申请号：US11970992

申请日：2008-01-08

申请人： Masaru Kidoh ,  Ryota Katsumata ,  Masaru Kito ,  Yoshiaki Fukuzumi ,  Hideaki Aochi ,  Hiroyasu Tanaka ,  Yasuyuki Matsuoka ,  Yoshio Ozawa ,  Mitsuru Sato

发明人： Masaru Kidoh ,  Ryota Katsumata ,  Masaru Kito ,  Yoshiaki Fukuzumi ,  Hideaki Aochi ,  Hiroyasu Tanaka ,  Yasuyuki Matsuoka ,  Yoshio Ozawa ,  Mitsuru Sato

IPC分类号： H01L27/115 ,  H01L21/8247 ,  H01L29/792

CPC分类号： H01L29/792 ,  G11C16/0483 ,  H01L27/0688 ,  H01L27/11568 ,  H01L27/11578 ,  H01L27/11582 ,  H01L29/66833 ,  H01L29/7926

摘要： According to an aspect of the present invention, there is provided a nonvolatile semiconductor memory including: a columnar semiconductor; a charge storage insulating film including: a first insulating film formed around the columnar semiconductor, a charge storage film formed around the first insulating film, and a second insulating film formed around the charge storage film; an electrode extending two-dimensionally to surround the charge storage insulating film, the electrode having a groove; and a metal silicide formed on a sidewall of the groove.

摘要翻译： 根据本发明的一个方面，提供了一种非易失性半导体存储器，包括：柱状半导体; 电荷存储绝缘膜，包括：围绕所述柱状半导体形成的第一绝缘膜，围绕所述第一绝缘膜形成的电荷存储膜，以及形成在所述电荷存储膜周围的第二绝缘膜; 电极，其二维地延伸以包围电荷存储绝缘膜，所述电极具有凹槽; 以及形成在所述槽的侧壁上的金属硅化物。