公开(公告)号：US5537225A

公开(公告)日：1996-07-16

申请号：US464215

申请日：1995-06-05

Applicant: Shuichi Morikawa ,  Masahiko Futatsuka ,  Satoshi Ishida ,  Yasunori Miyauchi ,  Minoru Masuda ,  Makoto Takagawa

Inventor： Shuichi Morikawa ,  Masahiko Futatsuka ,  Satoshi Ishida ,  Yasunori Miyauchi ,  Minoru Masuda ,  Makoto Takagawa

IPC: B65H1/06 ,  B65H3/06 ,  B65H3/52 ,  B65H3/56 ,  H04N1/00 ,  H04N1/04 ,  H04N1/10 ,  H04N1/12 ,  H04N1/193 ,  H04N1/203 ,  F21S3/00

CPC classification number: B65H3/5238 ,  B65H1/06 ,  B65H3/063 ,  B65H3/56 ,  H04N1/0057 ,  H04N1/00572 ,  H04N1/0058 ,  H04N1/00596 ,  H04N1/00602 ,  H04N1/0061 ,  H04N1/00628 ,  H04N1/04 ,  H04N1/1215 ,  H04N1/125 ,  H04N1/203 ,  H04N1/2032 ,  B65H2511/514 ,  B65H2515/34 ,  H04N1/0464 ,  H04N1/1017 ,  H04N1/12 ,  H04N1/121 ,  H04N1/193 ,  H04N2201/044 ,  Y10T292/0913 ,  Y10T292/0917 ,  Y10T292/0936

Abstract: An image reading apparatus has a reading unit including a light source lamp mounted on a unit frame arranged in a document reading portion. The image reading apparatus comprised as a lamp frame supporting the light source lamp. The lamp frame has a pin. Projections are pivotally arranged on a back side surface of the lamp frame at an interval in a longitudinal direction of the light source lamp. An upper end of the projections has a grip for grasping. One of the projections has an elongated hole for receiving the pin. The pin regulates an pivoting angle of the projection. Slit holes, in which the projections are fitted, are formed in the unit frame.

Abstract translation: 图像读取装置具有读取单元，该读取单元包括安装在文档读取部分中的单元框架上的光源灯。 图像读取装置包括支撑光源灯的灯框。 灯框架有一个针脚。 突出部以与光源灯的长度方向间隔的方式摆动配置在灯框的背面侧。 突起的上端具有用于抓握的把手。 其中一个突起具有用于接收销的细长孔。 销调节突起的枢转角度。 在单元框架中形成有突起嵌入的狭缝孔。

公开(公告)号：US5510909A

公开(公告)日：1996-04-23

申请号：US463856

申请日：1995-06-05

Applicant: Shuichi Morikawa ,  Masahiko Futatsuka ,  Satoshi Ishida ,  Yasunori Miyauchi ,  Minori Masuda ,  Makoto Takagawa

Inventor： Shuichi Morikawa ,  Masahiko Futatsuka ,  Satoshi Ishida ,  Yasunori Miyauchi ,  Minori Masuda ,  Makoto Takagawa

IPC: B65H1/06 ,  B65H3/06 ,  B65H3/52 ,  B65H3/56 ,  H04N1/00 ,  H04N1/04 ,  H04N1/10 ,  H04N1/12 ,  H04N1/193 ,  H04N1/203 ,  B65H1/00 ,  B65H9/00

CPC classification number: B65H3/5238 ,  B65H1/06 ,  B65H3/063 ,  B65H3/56 ,  H04N1/0057 ,  H04N1/00572 ,  H04N1/0058 ,  H04N1/00596 ,  H04N1/00602 ,  H04N1/0061 ,  H04N1/00628 ,  H04N1/04 ,  H04N1/1215 ,  H04N1/125 ,  H04N1/203 ,  H04N1/2032 ,  B65H2511/514 ,  B65H2515/34 ,  H04N1/0464 ,  H04N1/1017 ,  H04N1/12 ,  H04N1/121 ,  H04N1/193 ,  H04N2201/044 ,  Y10T292/0913 ,  Y10T292/0917 ,  Y10T292/0936

Abstract: A paper feed roller (5) is divided into a first roller (5a) and a second roller (5b); a slit (58) through which about 10 to 20 sheets of documents can pass is formed between the first roller and a gate plate (57) opposite to this; and the paper fed out therefrom is fed out to a space between the second roller (5b) and a separation pad (7) in contact with this.Also, there is adopted a construction in which the pressing force of a paper conveyance spring is transformed by a slide cam sliding in a direction parallel to the paper feed roller; and the paper width detection sensor is assembled by a fitting construction.

Abstract translation: 供纸辊（5）分为第一辊（5a）和第二辊（5b）; 在第一辊和与其相反的门板（57）之间形成有通过约10至20张纸张的狭缝（58）; 并且从其馈送的纸送到第二辊（5b）和与其接触的分离垫（7）之间的空间。 此外，采用这样的结构，其中通过沿与送纸辊平行的方向滑动的滑动凸轮来变换纸张传送弹簧的按压力; 并且纸宽检测传感器通过装配结构组装。

公开(公告)号：US5183780A

公开(公告)日：1993-02-02

申请号：US658389

申请日：1991-02-20

Applicant: Shigeru Noguchi ,  Satoshi Ishida ,  Hiroshi Iwata ,  Keiichi Sano ,  Shoichiro Nakayama

Inventor： Shigeru Noguchi ,  Satoshi Ishida ,  Hiroshi Iwata ,  Keiichi Sano ,  Shoichiro Nakayama

IPC: H01L29/78 ,  H01L21/02 ,  H01L21/20 ,  H01L21/225 ,  H01L21/285 ,  H01L21/336 ,  H01L21/77 ,  H01L21/84 ,  H01L29/786 ,  H01L29/92

CPC classification number: H01L29/78696 ,  H01L21/2022 ,  H01L21/2257 ,  H01L21/28525 ,  H01L27/1214 ,  H01L28/40 ,  H01L29/66757 ,  H01L29/66765 ,  H01L29/78618

Abstract: In a method of fabricating a semiconductor device according to the present invention, a semiconductor film is formed on a substrate, and an insulator film is formed so as to cover the semiconductor film. Then, a dopant source is arranged on the insulator film and then, a region for electrical contact is irradiated with a high-energy beam through the dopant source. Consequently, the insulator film and the semiconductor film in the irradiated region are melted, to form a polycrystalline contact region having impurities supplied from the dopant source doped therein. Thus, the high-energy beam is irradiated to the region for electrical contact through the dopant source to form the polycrystalline contact region, thereby to make it possible to omit the patterning process such as etching processing for providing a contact hole.

Abstract translation: 在制造根据本发明的半导体器件的方法中，在衬底上形成半导体膜，并且形成绝缘膜以覆盖半导体膜。 然后，在绝缘膜上布置掺杂剂源，然后通过掺杂源用高能束照射用于电接触的区域。 因此，照射区域中的绝缘体膜和半导体膜被熔化，以形成从其中掺杂的掺杂剂源提供的杂质的多晶接触区域。 因此，高能束被照射到通过掺杂剂源进行电接触的区域以形成多晶接触区域，从而可以省略图案化处理，例如用于提供接触孔的蚀刻处理。