METHOD AND APPARATUS FOR MAPPING UPLINK CONTROL INFORMATION IN WIRELESS COMMUNICATION SYSTEM

    公开(公告)号:US20220303978A1

    公开(公告)日:2022-09-22

    申请号:US17831850

    申请日:2022-06-03

    Abstract: Provided is a method of a terminal in a wireless communication system, including receiving DCI for scheduling PUSCH transmission; determining a number of modulation symbols per layer for transmission of UCI based on a number of code blocks associated with a UL-SCH, CUL-SCH, a value Kr for an r-th code block of the code blocks and a number of bits of the UCI, OACK, wherein in case that the DCI includes CBGTI and the CBGTI indicates that the r-th code block associated with the UL-SCH of the PUSCH transmission is not for transmission, the value Kr for the UCI is determined as 0, and else, the value Kr for the UCI is determined as a size of the r-th code block for the UL-SCH of the PUSCH transmission; and transmitting, to a base station, the UCI on the PUSCH based on the number of modulation symbols per layer.

    Method and device for grant-free data transmission in wireless communication system

    公开(公告)号:US11405907B2

    公开(公告)日:2022-08-02

    申请号:US16728438

    申请日:2019-12-27

    Abstract: A communication technique and a system thereof for converging an Internet of Things (IoT) technology and a 5th generation (5G) communication system for supporting a high data transmission rate beyond that of a 4th generation (4G) system are provided. The disclosure may be applied to intelligent services, such as smart homes, smart buildings, smart cities, smart cars or connected cars, health care, digital education, retail, and security and safety related services, on the basis of 5G communication technologies and IoT-related technologies. The disclosure provides a method and device for transmitting or receiving a plurality of dynamic scheduling-based and/or grant-free based data, and reporting feedback information relating to the plurality of data, in a wireless communication system.

    Electronic device including heat dissipation structure

    公开(公告)号:US11388841B2

    公开(公告)日:2022-07-12

    申请号:US17266355

    申请日:2019-06-24

    Abstract: An electronic device according to various embodiments of the disclosure includes: a housing including a plurality of acoustic holes; an enclosure mounted in the housing; at least one heating element disposed in the enclosure; a heat dissipation structure disposed on the heating element to transfer heat generated from the heating element; and a heat dissipation duct disposed at least partially on the heat dissipation structure to provide a path for transferring the heat transferred from the heat dissipation structure to the outside through the acoustic holes. The heat dissipation structure may include: at least one first heat transfer member coupled to the one heating element; and a second heat transfer member disposed at least partially on the first heat transfer member to transfer, to the heat dissipation duct, heat transferred from the first heat transfer member.

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