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    MAGNETIC COMPONENT
    131.
    发明申请
    MAGNETIC COMPONENT 有权

    公开(公告)号：US20220301756A1

    公开(公告)日：2022-09-22

    申请号：US17691081

    申请日：2022-03-09

    Applicant: CYNTEC CO., LTD.

    Inventor： Shao-Wei Chang ,  Chu-Keng Lin ,  Hung-Chih Lin ,  Hsieh-Shen Hsieh

    IPC: H01F27/02 ,  H01F17/06 ,  H01F41/02 ,  H01F27/32

    Abstract: A magnetic component includes a first core component, a second core component and at least one coil. The first core component includes a first molding bobbin covering a first part of a core set by an injection molding process. The second core component includes a second molding bobbin covering a second part of the core set by the injection molding process. The first core component is assembled with the second core component to form a first pillar and a second pillar. Each of the first pillar and the second pillar includes a plurality of cores stacked with each other in a direction toward an outside or inside of the magnetic component. The at least one coil is wound on at least one of the first pillar and the second pillar.

    Electronic device
    132.
    发明授权
    Electronic device 有权

    公开(公告)号：US11450461B2

    公开(公告)日：2022-09-20

    申请号：US16820992

    申请日：2020-03-17

    Applicant: CYNTEC CO., LTD.

    Inventor： Sen-Huei Chen ,  Chi-Cheng Ma

    IPC: H05K1/18 ,  H01F5/06 ,  H01F5/04 ,  H05K1/11 ,  H01F41/063 ,  H01F41/076 ,  H01F27/06

    Abstract: An electronic device comprising: a body having a first portion and a second portion located below the first portion, wherein a bottom surface of the first portion and a side surface of the second portion forms an opening under the bottom surface of the first portion, wherein at least one portion of an electrode is disposed on the bottom surface of the first portion of the body, and at least one portion of the second portion of the body is disposed in an opening of a circuit board with the electrode being disposed on and electrically connected with the circuit board.

    Magnetic Device and the Method to Make the Same
    135.
    发明申请
    Magnetic Device and the Method to Make the Same 有权

    公开(公告)号：US20220130603A1

    公开(公告)日：2022-04-28

    申请号：US17508935

    申请日：2021-10-22

    Applicant: CYNTEC CO., LTD.

    Inventor： CHI-HSUN LEE ,  Min-Feng Chung

    IPC: H01F27/36 ,  H01F27/29 ,  H01F41/02

    Abstract: At least one shielding layer made of conductive material is formed on a body of an inductor, wherein at least one portion of the top surface of the body is exposed from the shielding layer, so as to provide an exhaust channel for moisture inside the body to leak to the outside of the body, thereby preventing the residual moisture from deforming the inductor due to thermal expansion.

    Integrated vertical inductor
    138.
    发明授权
    Integrated vertical inductor 有权

    公开(公告)号：US11257614B2

    公开(公告)日：2022-02-22

    申请号：US16177391

    申请日：2018-10-31

    Applicant: CYNTEC CO., LTD.

    Inventor： Hsin-Jung Cheng ,  Ming-Tsung Pan

    IPC: H01F27/30 ,  H01F17/00 ,  H01F27/32 ,  H01F27/24 ,  H01F27/28 ,  H01F27/02 ,  H01F27/26 ,  H01F27/29

    Abstract: An integrated vertical inductor includes a bobbin having an elongated, hollow tube, an upper flange disposed at an upper end of the elongated, hollow tube, and a base structure integrated with a lower end of the elongated, hollow tube. The elongated, hollow tube comprises a central opening extending along its longitudinal direction. The base structure comprises a lateral opening communicating with the central opening. A first magnetic core piece is installed in the central opening of the elongated, hollow tube. A second magnetic core piece is juxtaposed with the first magnetic core piece. A plurality of electrodes is disposed on a bottom surface of the base structure.

    Stacked electronic structure
    140.
    发明授权
    Stacked electronic structure 有权

    公开(公告)号：US11024702B2

    公开(公告)日：2021-06-01

    申请号：US16690148

    申请日：2019-11-21

    Applicant: CYNTEC CO., LTD.

    Inventor： Bau-Ru Lu ,  Jianhong Zeng ,  Chun Hsien Lu

    IPC: H01L49/02 ,  H05K1/11 ,  H01L23/00 ,  H01L23/532 ,  H01L23/31 ,  H01L25/065

    Abstract: A stacked electronic structure comprises: a substrate and a magnetic device, wherein electronic devices and conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the electronic devices, and the magnetic device is disposed over and electrically connected to the conductive pillars, wherein at least one recess or groove can be formed on the bottom surface of the conductive pillar, such as copper pillar, to help the venting of the soldering material as well as to increase the soldering area.

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