Abstract:
A high temperature pressure transducer is fabricated from silicon carbide. A wafer of silicon carbide has reduced or active areas which act as deflecting diaphragms. Positioned on the reduced or active area is a silicon carbide sensor. The sensor is secured to the silicon carbide wafer by a glass bond. The pressure transducer is fabricated by first epitaxially growing a layer of highly N-doped 3C silicon carbide on a first silicon wafer or substrate. A second wafer of silicon carbide is selected to be a carrier wafer. The carrier wafer is etched preferentially to produce the deflecting members or reduced areas which serve as diaphragms. The 3C material on the silicon slice is patterned appropriately to provide a series of individual piezoresistors which then may be interconnected to form a Wheatstone bridge. The two wafers are joined together using a high temperature glass frit, such as a pyroceram, with the various resistor elements appropriately placed over the deflecting members of the silicon carbide wafer. The silicon on the silicon wafer is removed and various metallic contacts and interconnects are formed on the 3C silicon carbide resistor network.
Abstract:
There is disclosed an internally switched multiple range transducer. The transducer employs a plurality of individual pressure sensors or Wheatstone bridges fabricated from semiconductor materials and utilizing piezoresistors. Each sensor is designed to accommodate accurately a given pressure range, therefore, each sensor is selected to provide an output when an applied pressure is within its accommodated range. As soon as the pressure exceeds the range, then another sensor is employed to produce an output. Each of the sensors, or each separate transducer, is coupled to a switch or other device to enable the selection of one of the plurality of sensors to operate within its given pressure range when the applied pressure is in that range. In this manner one obtains pressure measurements with a high degree of accuracy across a relatively large pressure range.
Abstract:
A sensor array for a pressure transducer having a diaphragm with an active region, and capable of deflecting when a force is applied to the diaphragm. The sensor array disposed on a single substrate, the substrate secured to the diaphragm. The sensor array having a first outer sensor near an edge of the diaphragm at a first location and on the active region, a second outer sensor near an edge of the diaphragm at a second location and on the active region, and at least one center sensor substantially overlying a center of the diaphragm. The sensors connected in a bridge array to provide an output voltage proportional to the force applied to the diaphragm. The sensors dielectrically isolated from the substrate.
Abstract:
A gas density transducer including: a piezoresistive bridge sensor operative to provide an output indicative of an applied pressure, a computing processor having multiple inputs and at least one output, with the output of the bridge sensor coupled to an input of the processor; a temperature sensor coupled to an input of the processor for providing at an output a signal indicative of a temperature of the bridge sensor, the output of the temperature sensor coupled to an input of the processor; and, at least one memory accessible by the processor and having stored therein: compensation coefficients for compensating the output of the bridge sensor for temperature variation; an algorithm for solving Van der Waal's equation; and, code for providing at an output of the processor a signal indicative of a gas density when the bridge is subjected to a gas containing environment.
Abstract:
A compact absolute and gage pressure transducer consists of two sensors made from the same silicon wafer and adjacent each other on the wafer. The transducer contains a common header with a first and a second input port for receiving a first and a second pressure, respectively. The second port is directed through a reference tube into the hollow of a housing to apply pressure from the reference tube to the common sensor arrangement. The first port is directed from another surface of the housing to direct pressure to both sensor devices. One sensor operates as a gage sensor producing an output proportional to the difference between input pressures and the other sensor produces an absolute output. The sensor chip is associated with a sensor header which includes an alignment pin extending therefrom, and a guide plate with an aperture for accommodating an alignment pin.
Abstract:
A transducer sensor is positioned within a hollow of the body of a housing. The housing has an extending alignment pin, which pin coacts with a corresponding slot or aperture in the wall of a vessel whose pressure or temperature is to be monitored. The transducer body is associated with a connector where the alignment pin is placed and extends from the housing in a fixed relation to the connector. A suitable aperture or slot in the wall of the vessel to be monitored accommodates the extending pin whereby when the transducer is placed in the vessel aperture the connector associated with the transducer is always located in proper position. Positioned on the housing is a sliding nut which can move in a direction parallel to the central axis of the housing and either to the right or left. This sliding nut is rotatably positioned in the housing and coacts with threads formed in the aperture in the wall of the vessel to enable tightening of the transducer housing when placed in the wall and when the alignment pin is positioned within the corresponding slot or aperture. This assures a proper alignment so that an external connector which is not moveable or rotatable can be immediately connected to the transducer connector without further experimentation or adjustment.
Abstract:
There is disclosed a method and apparatus for mounting a leadless semiconductor chip on a header. The semiconductor chip has contacts on a surface and the chip is of a specified geometric shape. The header has a contact surface for receiving the chip with the contact surface of the header containing header contact pins, which pins have to contact the contacts on the semiconductor chip. The header has a guide pin extending from the contact surface and there is a guide plate which has an aperture adapted to be placed over the guide pin, the guide plate further has a chip accommodating aperture of the same geometric shape as the chip. The guide plate, when placed over the guide pin enables the chip to be placed in the chip accommodating aperture so that the contacts of the header pin are properly and accurately aligned with respect to the contacts on the semiconductor chip.
Abstract:
A high pressure transducer has an H shaped cross-section with a center arm of the H having a top and bottom surface with the top surface of the H accommodating four strain gauges. Two strain gauges are located at the center of the top portion of the center arm of the H and are positive strain gauges, while two strain gauges are located near the periphery of the center arm of the gauge. The bottom surface of the center arm of the gauge has an active area of a smaller diameter than the circular diameter of the center arm portion of the transducer. The smaller active area is surrounded by a thicker stepped area which surrounds an active area on the pressure side of the H shaped member. The surrounding stepped area enables one to position the two negative strain gauges on the opposite surface of the center arm and near the periphery to thereby cause the negative gauges to respond to a negative stresses and therefore to enable one to provide a full Wheatstone bridge which includes the two positive strain gauges located at the center of the center arm of the H and the two negative peripheral gauges.
Abstract:
A pressure header assembly has a closed front and back surface. The back surface has an aperture for accommodating a separate dual die pressure header. The dual die pressure header has an absolute and differential pressure sensor positioned thereon. A differential pressure port is located on a side surface of the pressure header assembly and is directed to a bore in the pressure header assembly. The bore contains an elongated tube which is positioned in the pressure header assembly and locked in place by means of a crush nut and locking nut assembly. One end of the tube is coupled to the differential pressure port, while the other end of the tube accommodates a differential pressure tube which is bent in an arcuate position and directed to the underside of the sensor of the differential sensor assembly mounted in the dual die pressure header. Suitable leads from the dual die pressure header assembly are directed to a terminal board which is mounted within a pressure transducer housing shell, which terminal board coacts with an outboard contact cap assembly forming the transducer. The pressure header assembly portion also contains extending tabs which have apertures for external mounting.
Abstract:
A transducer sensor is positioned within a hollow of the body of a housing. The housing has an extending alignment pin, which pin coacts with a corresponding slot or aperture in the wall of a vessel whose pressure or temperature is to be monitored. The transducer body is associated with a connector where the alignment pin is placed and extends from the housing in a fixed relation to the connector. A suitable aperture or slot in the wall of the vessel to be monitored accommodates the extending pin whereby when the transducer is placed in the vessel aperture the connector associated with the transducer is always located in proper position. Positioned on the housing is a sliding nut which can move in a direction parallel to the central axis of the housing and either to the right or left. This sliding nut is rotatably positioned in the housing and coacts with threads formed in the aperture in the wall of the vessel to enable tightening of the transducer housing when placed in the wall and when the alignment pin is positioned within the corresponding slot or aperture. This assures a proper alignment so that an external connector which is not moveable or rotatable can be immediately connected to the transducer connector without further experimentation or adjustment.