公开(公告)号：US11264687B2

公开(公告)日：2022-03-01

申请号：US15972441

申请日：2018-05-07

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Adel A. Elsherbini

IPC: H01P1/208 ,  H01P3/12 ,  H01P11/00 ,  H01P5/10 ,  H01P1/20 ,  H01P7/06 ,  H01P5/16

Abstract: Microelectronic assemblies that include a lithographically-defined substrate integrated waveguide (SIW) component, and related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate portion having a first face and an opposing second face; and an SIW component that may include a first conductive layer on the first face of the package substrate portion, a dielectric layer on the first conductive layer, a second conductive layer on the dielectric layer, and a first conductive sidewall and an opposing second conductive sidewall in the dielectric layer, wherein the first and second conductive sidewalls are continuous structures.

公开(公告)号：US11251512B2

公开(公告)日：2022-02-15

申请号：US16466627

申请日：2017-01-05

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Sasha Oster ,  Telesphor Kamgaing

IPC: H05K7/00 ,  H01P5/08 ,  H01P3/16 ,  H01R12/70 ,  H01R31/06 ,  H05K1/18 ,  H05K7/14

Abstract: Embodiments of the invention include an active mm-wave interconnect. In an embodiment, the active mm-wave interconnect includes a dielectric waveguide that is coupled to a first connector and a second connector. According to an embodiment, each of the first and second connectors may include a mm-wave engine. In an embodiment, the mm-wave engines may include a power management die, a modulator die, a demodulator die, a mm-wave transmitter die, and a mm-wave receiver die. Additional embodiments may include connectors that interface with predefined interfaces, such as small form-factor pluggables (SFP), quad small form-factor pluggables (QSFP), or octal small form-factor pluggables (OSFP). Accordingly, embodiments of the invention allow for plug and play functionality with existing servers and other high performance computing systems.

公开(公告)号：US20210408657A1

公开(公告)日：2021-12-30

申请号：US16912067

申请日：2020-06-25

Applicant: Intel Corporation

Inventor： Diego Correas-Serrano ,  Georgios Dogiamis ,  Henning Braunisch ,  Neelam Prabhu Gaunkar ,  Telesphor Kamgaing

IPC: H01P5/02 ,  H01L23/498 ,  H01R12/75 ,  H01L23/66 ,  H01P3/16

Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

公开(公告)号：US20210408652A1

公开(公告)日：2021-12-30

申请号：US16911559

申请日：2020-06-25

Applicant: Intel Corporation

Inventor： Diego Correas-Serrano ,  Georgios Dogiamis ,  Henning Braunisch ,  Neelam Prabhu Gaunkar ,  Telesphor Kamgaing

IPC: H01P3/16 ,  H01P1/20 ,  H01P5/08 ,  H01P1/208

Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

公开(公告)号：US20210398922A1

公开(公告)日：2021-12-23

申请号：US16909258

申请日：2020-06-23

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Feras Eid ,  Adel Elsherbini

IPC: H01L23/66 ,  H01L23/00 ,  H01L23/367 ,  H01L23/498 ,  H01L23/544 ,  H01P3/06 ,  H01L21/48 ,  H01P11/00

Abstract: Cables, cable connectors, and support structures for cantilever package and/or cable attachment may be fabricated using additive processes, such as a coldspray technique, for integrated circuit assemblies. In one embodiment, cable connectors may be additively fabricated directly on an electronic substrate. In another embodiment, seam lines of cables and/or between cables and cable connectors may be additively fused. In a further embodiment, integrated circuit assembly attachment and/or cable attachment support structures may be additively formed on an integrated circuit assembly.

公开(公告)号：US20210375820A1

公开(公告)日：2021-12-02

申请号：US16887126

申请日：2020-05-29

Applicant: Intel Corporation

Inventor： Feras Eid ,  Adel Elsherbini ,  Georgios Dogiamis

IPC: H01L23/00

Abstract: Magnetic structures may be incorporated into integrated circuit assemblies, which will enable local heating and reflow of solder interconnects for the attachment of integrated circuit devices to electronic substrates. Such magnetic structures will eliminate exposure of the entire integrated circuit assembly to elevated temperatures for an extended period of time, which eliminates associated warpage and thermal degradation consequences from such exposure. Additionally, such magnetic structures will allow for re-workability of specific solder interconnects.

公开(公告)号：US20210193519A1

公开(公告)日：2021-06-24

申请号：US16721243

申请日：2019-12-19

Applicant: INTEL CORPORATION

Inventor： Aleksandar Aleksov ,  Telesphor Kamgaing ,  Georgios Dogiamis ,  Feras Eid ,  Johanna M. Swan ,  Shawna M. Liff

IPC: H01L21/768 ,  H01L23/00

Abstract: Disclosed herein are inorganic dies with organic interconnect layers and related structures, devices, and methods. In some embodiments, an integrated circuit (IC) structure may include an inorganic die and one or more organic interconnect layers on the inorganic die, wherein the organic interconnect layers include an organic dielectric.

公开(公告)号：US20210193518A1

公开(公告)日：2021-06-24

申请号：US16721235

申请日：2019-12-19

Applicant: INTEL CORPORATION

Inventor： Aleksandar Aleksov ,  Feras Eid ,  Telesphor Kamgaing ,  Georgios Dogiamis ,  Johanna M. Swan

IPC: H01L21/768 ,  H01L23/00

Abstract: Disclosed herein are inorganic dies with organic interconnect layers and related structures, devices, and methods. In some embodiments, an integrated circuit (IC) structure may include an inorganic die and one or more organic interconnect layers on the inorganic die, wherein the organic interconnect layers include an organic dielectric.

公开(公告)号：US20210125931A1

公开(公告)日：2021-04-29

申请号：US16667698

申请日：2019-10-29

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Aleksandar Aleksov ,  Feras Eid ,  Telesphor Kamgaing ,  Johanna M. Swan

IPC: H01L23/538 ,  B81B7/00 ,  H01L23/28 ,  H01L23/552 ,  H01L21/56

Abstract: Embodiments may relate to a microelectronic package that includes a substrate with an overmold material. The microelectronic package may include a die in the overmold material, and an inactive side of the die may be coupled with a face of the substrate. A through-mold via (TMV) may be present in the overmold material. The TMV may be communicatively coupled with the substrate, and an active side of the die may be communicatively coupled with the TMV by a trace in the overmold material. Other embodiments may be described or claimed.

公开(公告)号：US20210067132A1

公开(公告)日：2021-03-04

申请号：US16550673

申请日：2019-08-26

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios Dogiamis ,  Feras Eid ,  Aleksandar Aleksov ,  Johanna M. Swan

IPC: H03H9/08 ,  H01L27/20 ,  H03H9/70 ,  H01L23/552 ,  H01L23/367 ,  H01L25/16 ,  H01L23/498 ,  H03H3/02 ,  H03H9/54 ,  H03H9/05 ,  H01L23/66

Abstract: Embodiments may relate to a radio frequency (RF) front-end module (FEM). The RF FEM may include an integrated die with an active portion and an acoustic wave resonator (AWR) portion adjacent to the active portion. The RF FEM may further include a lid coupled with the die. The lid may at least partially overlap the AWR portion at a surface of the die. Other embodiments may be described or claimed.