公开(公告)号：US20240429588A1

公开(公告)日：2024-12-26

申请号：US18824152

申请日：2024-09-04

Applicant: Intel Corporation

Inventor： Diego Correas-Serrano ,  Georgios Dogiamis ,  Henning Braunisch ,  Neelam Prabhu Gaunkar ,  Telesphor Kamgaing

IPC: H01P3/16

Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems. In one aspect, a microelectronic support for millimeter-wave communication includes a millimeter-wave communication transmission line, wherein the transmission line includes a trace in a metal layer, wherein the trace is electrically coupled to a via by a via pad in the metal layer; and a ground plane in the metal layer, wherein one or more metal portions contact the via pad and the ground plane.

公开(公告)号：US12166261B2

公开(公告)日：2024-12-10

申请号：US16911883

申请日：2020-06-25

Applicant: Intel Corporation

Inventor： Diego Correas-Serrano ,  Georgios Dogiamis ,  Henning Braunisch ,  Neelam Prabhu Gaunkar ,  Telesphor Kamgaing

IPC: H01P3/16 ,  H01P3/12 ,  H01P5/08 ,  H01P5/107

Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

公开(公告)号：US12155372B2

公开(公告)日：2024-11-26

申请号：US17688065

申请日：2022-03-07

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Aleksandar Aleksov ,  Feras Eid ,  Telesphor Kamgaing ,  Johanna M. Swan

IPC: H03H9/54 ,  H03H9/02 ,  H03H9/64

Abstract: Embodiments may relate to a die such as an acoustic wave resonator (AWR) die. The die may include a first filter and a second filter in the die body. The die may further include an electromagnetic interference (EMI) structure that surrounds at least one of the filters. Other embodiments may be described or claimed.

公开(公告)号：US12040776B2

公开(公告)日：2024-07-16

申请号：US16526633

申请日：2019-07-30

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Aleksandar Aleksov ,  Feras Eid ,  Georgios Dogiamis ,  Johanna M. Swan

IPC: H03H9/05 ,  H01L23/00 ,  H01L23/538 ,  H01L25/00 ,  H01L25/18 ,  H03H9/58 ,  H10N30/87 ,  H10N30/88 ,  H10N39/00 ,  H01L23/498

CPC classification number: H03H9/0552 ,  H01L23/5385 ,  H01L24/16 ,  H01L25/18 ,  H01L25/50 ,  H03H9/58 ,  H10N30/875 ,  H10N30/883 ,  H10N39/00 ,  H01L23/49816 ,  H01L2224/16225 ,  H01L2924/19042

Abstract: Embodiments may relate to a radio frequency (RF) front-end module (FEM) that includes an acoustic wave resonator (AWR) die. The RF FEM may further include an active die coupled with the package substrate of the RF FEM. When the active die is coupled with the package substrate, the AWR die may be between the active die and the package substrate. Other embodiments may be described or claimed.

公开(公告)号：US11916604B2

公开(公告)日：2024-02-27

申请号：US16893660

申请日：2020-06-05

Applicant: Intel Corporation

Inventor： Diego Correas-Serrano ,  Georgios Dogiamis ,  Henning Braunisch ,  Neelam Prabhu Gaunkar ,  Telesphor Kamgaing ,  Thomas W. Brown ,  Stefano Pellerano

IPC: H03H7/30 ,  H04B15/00 ,  H04L25/03

CPC classification number: H04B15/00 ,  H04L25/03

Abstract: Embodiments may relate to a communications module comprising with a dispersion compensation module communicatively coupled between a baseband module and a radio frequency (RF) module. The dispersion compensation module may be configured to process a data signal at an intermediate frequency that is between a baseband frequency and a RF frequency. Other embodiments may be described or claimed.

公开(公告)号：US11895815B2

公开(公告)日：2024-02-06

申请号：US16909269

申请日：2020-06-23

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Adel Elsherbini ,  Feras Eid

IPC: H01R12/53 ,  H05K9/00 ,  H01B7/18 ,  H01B7/00

CPC classification number: H05K9/0098 ,  H01B7/0018 ,  H01B7/1805 ,  H01R12/53

Abstract: Cables, cable connectors, and support structures for cantilever package and/or cable attachment may be fabricated using additive processes, such as a coldspray technique, for integrated circuit assemblies. In one embodiment, cable connectors may be additively fabricated directly on an electronic substrate. In another embodiment, seam lines of cables and/or between cables and cable connectors may be additively fused. In a further embodiment, integrated circuit assembly attachment and/or cable attachment support structures may be additively formed on an integrated circuit assembly.

公开(公告)号：US20230320021A1

公开(公告)日：2023-10-05

申请号：US18331474

申请日：2023-06-08

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Johanna M. Swan ,  Georgios Dogiamis ,  Henning Braunisch ,  Adel A. Elsherbini ,  Aleksandar Aleksov ,  Richard Dischler

IPC: H05K7/14 ,  H05K1/02 ,  H01P5/12 ,  H01P3/16

CPC classification number: H05K7/1489 ,  H05K1/0243 ,  H01P5/12 ,  H01P3/16 ,  H05K2201/10356 ,  H01L24/16

Abstract: Embodiments may relate an electronic device that includes a first server blade and a second server blade coupled with a chassis. The first and second server blades may include respective microelectronic packages. The electronic device may further include a waveguide coupled to the first and second server blades such that their respective microelectronic packages are communicatively coupled by the waveguide. Other embodiments may be described or claimed.

公开(公告)号：US20230307846A1

公开(公告)日：2023-09-28

申请号：US17700819

申请日：2022-03-22

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Alon Cohen ,  Ophir Shabtay

IPC: H01Q19/10 ,  H01L25/065 ,  H01L23/498 ,  H01L23/552 ,  H01L23/66 ,  H01Q21/08

CPC classification number: H01Q19/104 ,  H01L25/0655 ,  H01L23/49827 ,  H01L23/552 ,  H01L23/66 ,  H01Q21/08 ,  H01L2223/6616 ,  H01L2223/6677

Abstract: Embodiments of a microelectronic assembly comprise a plurality of transceiver modules, each transceiver module including a first antenna; a printed circuit board (PCB); and a reflector module coupled to the PCB and separated from the plurality of transceiver modules by a space. The reflector module comprises: a substrate having a first side and an opposing second side, the first side being proximate to the plurality of transceiver modules, an antenna-array on the first side of the substrate, the antenna-array including a plurality of second antennas; a first integrated circuit (IC) die on the second side of the substrate; and a second IC die on the second side of the substrate. The first IC die comprises radio frequency (RF) switches configured to operate at electromagnetic frequencies between 20 kHz and 1 THz, and the second IC die comprises memory cell arrays and digital logic circuits.

公开(公告)号：US11728290B2

公开(公告)日：2023-08-15

申请号：US16394514

申请日：2019-04-25

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Georgios Dogiamis ,  Johanna M. Swan ,  Aleksandar Aleksov ,  Telesphor Kamgaing ,  Henning Braunisch

IPC: H01L23/66 ,  H01L23/538 ,  H01L25/065 ,  H01L23/00 ,  H01L21/48 ,  H01L21/683 ,  H01L25/00

CPC classification number: H01L23/66 ,  H01L21/486 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/5386 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/50 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6683 ,  H01L2224/16227 ,  H01L2924/1423 ,  H01L2924/1903

Abstract: Embodiments may relate to a microelectronic package that includes a substrate signal path and a waveguide. The package may further include dies that are communicatively coupled with one another by the substrate signal path and the waveguide. The substrate signal path may carry a signal with a frequency that is different than the frequency of a signal that is to be carried by the waveguide. Other embodiments may be described or claimed.

公开(公告)号：US11721650B2

公开(公告)日：2023-08-08

申请号：US16437930

申请日：2019-06-11

Applicant: Intel Corporation

Inventor： Brandon C. Marin ,  Aleksandar Aleksov ,  Georgios Dogiamis ,  Jeremy D. Ecton ,  Suddhasattwa Nad ,  Mohammad Mamunur Rahman

IPC: H01L23/66 ,  H01L23/498 ,  H01L21/48 ,  H01P3/08 ,  H01P11/00 ,  H01P3/06

CPC classification number: H01L23/66 ,  H01L21/481 ,  H01L21/4846 ,  H01L23/49838 ,  H01P3/06 ,  H01P3/08 ,  H01P3/088 ,  H01P11/003 ,  H01P11/005 ,  H01L2223/6627

Abstract: Embodiments include semiconductor packages and method of forming the semiconductor packages. A semiconductor package includes first waveguides over a package substrate. The first waveguides include first angled conductive layers, first transmission lines, and first cavities. The semiconductor package also includes a first dielectric over the first waveguides and package substrate, second waveguides over the first dielectric and first waveguides, and a second dielectric over the second waveguides and first dielectric. The second waveguides include second angled conductive layers, second transmission lines, and second cavities. The first angled conductive layers are positioned over the first transmission lines and package substrate having a first pattern of first triangular structures. The second angled conductive layers are positioned over the second transmission lines and first dielectric having a second pattern of second triangular structures, where the second pattern is shaped as a coaxial interconnects enclosed with second triangular structures and portions of first dielectric.