摘要:
A semiconductor package is assembled using first and second lead frames. The first lead frame includes a die flag and the second lead frame includes lead fingers. When the first and second lead frames are mated, the lead fingers surround the die flag. Side surfaces of the die flag are partially etched to form an extended die attach surface on the die flag, and portions of the top surface of each of the lead fingers also are partially etched to form lead finger surfaces that are complementary with the etched side surfaces of the die flag. A semiconductor die is attached to the extended die attach surface and bond pads of the semiconductor die are electrically connected to the lead fingers. An encapsulating material covers the die, electrical connections, and top surfaces of the die flag and lead fingers.
摘要:
A process for generating social recommendations is provided. For each user, a user profile index is accessed to determine reading interests of the user. Further, relevance matching is performed to determine matching users having at least one publishing interest that is relevant to the reading interests of the user. Next, the matching users are ranked. Based on the ranking, one or more top ranked matching user(s) are determined. Additionally, a social recommendation for each of the top ranked matching user(s) is enabled to be made to the user.
摘要:
Methods for calibrating a photolithographic system are disclosed. A cold lens contour for a reticle design and at least one hot lens contour for the reticle design are generated from which a process window is defined. Aberrations induced by a lens manipulator are characterized in a manipulator model and the process window is optimized using the manipulator model. Aberrations are characterized by identifying variations in critical dimensions caused by lens manipulation for a plurality of manipulator settings and by modeling behavior of the manipulator as a relationship between manipulator settings and aberrations. The process window may be optimized by minimizing a cost function for a set of critical locations.
摘要:
A clamp mechanism for clamping a heat sink is disclosed in the present invention. The clamp mechanism includes a base. An accommodating space is formed on a side of the base, and the accommodating space is for accommodating the heat sink. The clamp mechanism further includes at least one constraining component pivoted to the base for engaging with an engaging portion of the heat sink, so as to fix the heat sink inside the accommodating space. The clamp mechanism further includes at least one contacting component pivoted to the base for buckling a hook of the heat sink when pivoting relative to the base, so as to rotate the hook relative to a shaft of the heat sink.
摘要:
A real-time, signature-free, blocker prevents buffer overflow attacks. The system and method, called SigFree, can filter out code injection buffer overflow attack packets targeting at various Internet services such as web services. Motivated by the observation that buffer overflow attacks typically contain executables whereas legitimate client requests never contain executables in most Internet services, SigFree blocks attacks by checking, without any preknowledge of the real attacks, if “executable” instruction sequences can be blindly disassembled and extracted from a packet. Being signature-free, the invention can block new and unknown buffer overflow attacks. It is immunized from almost every attack-side code obfuscation method, and transparent to the servers being protected. The approach is therefore suited to economical Internet-wide deployment with very low deployment and maintenance costs. SigFree can also handle encrypted SSL packets. An experimental study shows that SigFree can block all types of code-injection attack packets without yielding any false positives or false negatives. Moreover, SigFree causes negligible throughput degradation to normal client requests.
摘要:
A thermionic electron emission device includes an insulating substrate and one or more lattices located on the insulating substrate. Each lattice includes a first, second, third and fourth electrode down-leads located on the insulating substrate to define an area. A thermionic electron emission unit is located in the area. The thermionic electron emission unit includes a first electrode, a second electrode, and a thermionic electron emitter. The thermionic electron emitter includes a carbon nanotube film structure. The carbon nanotube film structure includes a carbon nanotube film. The carbon nanotube film includes a number of carbon nanotubes joined end to end along axial directions of the carbon nanotubes by contacting with each other directly.
摘要:
A receiver supports a single carrier (SC) form of modulation and a multi-carrier form of modulation such as orthogonal frequency division multiplexing (OFDM). Upon receiving a signal, the receiver determines a maximum fluctuation range (MFR) as a function of at least a fourth-order cumulant of a received signal; and classifies a modulation type of the received signal as a function of the determined maximum fluctuation range. After determining the modulation type of the received signal, the receiver switches to that modulation mode to recover data from the received signal.
摘要:
A heat sink includes a base with a plurality of recesses defined therein, a plurality of columned fins each having a head and a body extending from the head, and a cover joining with the base. Each head is received in and higher than a corresponding recess of the base. The heads are sandwiched between the cover and the base, whereby the columned fins are secured on the base. A portion of the cover contacting the head of each of the columned fins protrudes to form a deformed part. A method of manufacturing the heat sink is also disclosed.
摘要:
A field emission device includes a cathode, an anode, an emitter, a first adjusting electrode, and a second adjusting electrode. The emitter electrically connects to the cathode. The cathode, the first adjusting electrode, and the second adjusting electrode electrically connect to an electrode down-lead. The anode electrically connects another electrode down-lead. The cathode is disposed between the first adjusting electrode and the second adjusting electrode.
摘要:
A method for making a field emission device includes the following steps. An insulative substrate is provided. An electron pulling electrode is formed on the insulative substrate. A secondary electron emission layer is formed on the electron pulling electrode. A first dielectric layer is fabricated. The first dielectric layer has a second opening to expose the secondary electron emission layer. A cathode plate having an electron output portion is provided. An electron emission layer is formed on part surface of the cathode plate. The cathode plate is placed on the first dielectric layer. The electron output portion and the second opening have at least one part overlapped, and at least one part of the electron emission layer is oriented to the secondary electron emission layer via the second opening.