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    Stacked electronic structure
    142.
    发明授权
    Stacked electronic structure 有权

    公开(公告)号：US11024702B2

    公开(公告)日：2021-06-01

    申请号：US16690148

    申请日：2019-11-21

    Applicant: CYNTEC CO., LTD.

    Inventor： Bau-Ru Lu ,  Jianhong Zeng ,  Chun Hsien Lu

    IPC: H01L49/02 ,  H05K1/11 ,  H01L23/00 ,  H01L23/532 ,  H01L23/31 ,  H01L25/065

    Abstract: A stacked electronic structure comprises: a substrate and a magnetic device, wherein electronic devices and conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the electronic devices, and the magnetic device is disposed over and electrically connected to the conductive pillars, wherein at least one recess or groove can be formed on the bottom surface of the conductive pillar, such as copper pillar, to help the venting of the soldering material as well as to increase the soldering area.

    Variable coupled inductor
    143.
    发明授权
    Variable coupled inductor 有权

    公开(公告)号：US11017937B2

    公开(公告)日：2021-05-25

    申请号：US15972238

    申请日：2018-05-07

    Applicant: CYNTEC CO., LTD.

    Inventor： Lan-Chin Hsieh ,  Cheng-Chang Lee ,  Chih-Hung Chang ,  Chih-Siang Chuang ,  Tsung-Chan Wu ,  Roger Hsieh

    IPC: H01F27/28 ,  H01F27/24 ,  H01F17/04 ,  H01F3/14 ,  H01F38/02 ,  H01F3/10

    Abstract: A variable coupled inductor comprises a first core having a first protrusion, a second protrusion, a third protrusion, a first conducting-wire groove and a second conducting-wire groove on the top surface of the first core, wherein the second protrusion is disposed between the first protrusion and the third protrusion, wherein a first conducting wire is disposed in the first conducting-wire groove, and a second conducting wire is disposed in the second conducting-wire groove, wherein a second core, disposed over the first core, wherein a magnetic structure is integrally formed with the second core and protruded on the bottom surface of the second core, wherein the bottom surface of the magnetic structure is located over the top surface of the second protrusion.

    Electronic module
    144.
    发明授权
    Electronic module 有权

    公开(公告)号：US11017934B2

    公开(公告)日：2021-05-25

    申请号：US15835486

    申请日：2017-12-08

    Applicant: CYNTEC CO., LTD.

    Inventor： Bau-Ru Lu ,  Chun Hsien Lu ,  Da-Jung Chen

    IPC: H01F27/02 ,  H01F27/28 ,  H01F41/00 ,  H01F27/32 ,  H01F27/36 ,  H01F27/24 ,  H01F17/04 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18

    Abstract: The present invention discloses an electronic module. The electronic module comprises: a substrate, having a top surface and a bottom surface; a plurality of coils on the top surface of the substrate, wherein each coil comprises a corresponding first end and a corresponding second end; and a molding body, disposed on the substrate to encapsulate said coils, wherein said corresponding first end and said corresponding second end of each coil are electrically coupled to a corresponding first electrode and a corresponding second electrode of the electronic module.

    Three-dimensional package structure
    146.
    发明授权
    Three-dimensional package structure 有权

    公开(公告)号：US10991681B2

    公开(公告)日：2021-04-27

    申请号：US16779660

    申请日：2020-02-02

    Applicant: CYNTEC CO., LTD.

    Inventor： Da-Jung Chen ,  Chun-Tiao Liu ,  Chau-Chun Wen

    IPC: H01L25/16 ,  H01L23/495 ,  H01L23/552 ,  H01L23/04 ,  H01L23/498 ,  H01L23/64 ,  H01L23/00 ,  H01L25/10

    Abstract: A three-dimensional package structure includes an energy storage element, a semiconductor package body and a shielding layer. The semiconductor package body has a plurality of second conductive elements and at least one control device inside. The energy storage element is disposed on the semiconductor package body. The energy storage element including a magnetic body is electrically connected to the second conductive elements. The semiconductor package body or the energy storage element has a plurality of first conductive elements to be electrically connected to an outside device. The three-dimensional package structure is applicable to a POL, (Point of Load) converter.

    Circuit board and electronic module with an electrode structure
    147.
    发明授权
    Circuit board and electronic module with an electrode structure 有权

    公开(公告)号：US10863622B2

    公开(公告)日：2020-12-08

    申请号：US15970893

    申请日：2018-05-04

    Applicant: CYNTEC CO., LTD.

    Inventor： Chi-Feng Huang

    IPC: H05K1/11 ,  H05K1/18 ,  H05K3/42 ,  H05K1/14 ,  H05K1/09 ,  H05K3/34 ,  H05K3/40

    Abstract: An electronic module is disclosed, wherein the electronic module comprises: a first circuit board, comprising a top surface, a bottom surface, and a lateral surface connecting the top surface and the bottom surface of the first circuit board; wherein an electrode structure is disposed on the first circuit board, wherein a second circuit board is disposed under the bottom surface of the first circuit board, wherein a soldering material is disposed between the bottom surface of the electrode structure and the second circuit board and extended onto a wettable flank of the electrode structure to form a soldering structure, wherein said soldering structure comprises an outer surface that is located above the bottom surface of the first circuit board and outside the outmost portion of the lateral surface of the first circuit board.

    Apparatus of coupled inductors with balanced electromotive forces
    149.
    发明授权
    Apparatus of coupled inductors with balanced electromotive forces 有权

    公开(公告)号：US10650961B2

    公开(公告)日：2020-05-12

    申请号：US16246569

    申请日：2019-01-14

    Applicant: CYNTEC CO., LTD.

    Inventor： Chia-Cheng Chuang

    IPC: H01F17/04 ,  H01F27/40 ,  H01F3/10 ,  H01F27/28 ,  H01F27/29

    Abstract: An apparatus of coupled inductors includes a first coil and a second coil arranged in a way that an inter-coil capacitance between the first coil and the second coil can keep electromotive forces induced by a first inductance of the first coil and a second inductance of the second coil about the same. As the current bypasses an unbalanced parasitic capacitor, a compensation capacitor disposed between the two coils can compensate the inter-coil capacitance of the parasitic capacitor. The apparatus of coupled inductors implemented with a specific coil arrangement or disposed with the compensation capacitor can keep the EMFs induced over the two inductances equal in amplitude, which prevents both the differential-mode and common-mode interference from being converted, improving the characteristics of mode conversion and is suitable to be utilized in a PoE system or the like.

    Integrally-formed inductor
    150.
    发明授权
    Integrally-formed inductor 有权

    公开(公告)号：US10546684B2

    公开(公告)日：2020-01-28

    申请号：US14830735

    申请日：2015-08-20

    Applicant: CYNTEC CO., LTD.

    Inventor： Yi-Min Huang ,  Chih-Siang Chuang ,  Yung-Cheng Chang

    IPC: H01F27/29 ,  H01F17/00

    Abstract: An inductive component is disclosed, the inductive component comprising: a metal structure, the metal structure comprising a conductor wire and a lead frame, wherein the lead frame and the conductor wire are integrally formed, wherein the lead frame comprises a first part and a second part space spaced apart from the first part, wherein a contiguous metal path is formed from the first part of the lead frame to the second part of the lead frame via the conductor wire; a magnetic body encapsulating the conductor wire, and a first portion of the first part and a second portion of the second part of the lead frame adjacent to the conductor wire.

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