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    ELECTRODE STRUCTURE AND THE CORRESPONDING ELECTRICAL COMPONENT USING THE SAME AND THE FABRICATION MERHOD THEREOF
    2.
    发明申请
    ELECTRODE STRUCTURE AND THE CORRESPONDING ELECTRICAL COMPONENT USING THE SAME AND THE FABRICATION MERHOD THEREOF 审中-公开
    电极结构及其相应电气元件及其制造方法

    公开(公告)号：US20150325364A1

    公开(公告)日：2015-11-12

    申请号：US14630665

    申请日：2015-02-25

    Applicant: CYNTEC CO., LTD.

    Inventor： CHIH-SUN LEE ,  Cheng-Chang Lee ,  Yi-Wei Chen

    IPC: H01F27/29 ,  H01F41/12

    CPC classification number: H01F27/292 ,  H01F17/045 ,  H01F27/2847 ,  H01F41/10 ,  H01F41/12 ,  Y10T29/49075

    Abstract: An electrical component is disclosed, wherein the electrical component comprises: a body and an electrode structure disposed on a first surface of the body, wherein the electrode structure comprises an inner metal layer and an outer metal layer, wherein a terminal of a conductive element of the electrical component is disposed between the inner metal layer and the outer metal layer, wherein the terminal of the conductive element of the electrical component is electrically connected to the inner metal layer and the outer metal layer for electrically connecting with an external circuit.

    Abstract translation: 公开了一种电气部件，其中所述电气部件包括：主体和设置在所述主体的第一表面上的电极结构，其中所述电极结构包括内部金属层和外部金属层，其中，导电元件的端子 所述电气部件设置在所述内侧金属层和所述外部金属层之间，其中，所述电气部件的导电性元件的端子与所述内部金属层和所述外部金属层电连接，以与外部电路电连接。

    Variable coupled inductor
    3.
    发明授权
    Variable coupled inductor 有权

    公开(公告)号：US11017937B2

    公开(公告)日：2021-05-25

    申请号：US15972238

    申请日：2018-05-07

    Applicant: CYNTEC CO., LTD.

    Inventor： Lan-Chin Hsieh ,  Cheng-Chang Lee ,  Chih-Hung Chang ,  Chih-Siang Chuang ,  Tsung-Chan Wu ,  Roger Hsieh

    IPC: H01F27/28 ,  H01F27/24 ,  H01F17/04 ,  H01F3/14 ,  H01F38/02 ,  H01F3/10

    Abstract: A variable coupled inductor comprises a first core having a first protrusion, a second protrusion, a third protrusion, a first conducting-wire groove and a second conducting-wire groove on the top surface of the first core, wherein the second protrusion is disposed between the first protrusion and the third protrusion, wherein a first conducting wire is disposed in the first conducting-wire groove, and a second conducting wire is disposed in the second conducting-wire groove, wherein a second core, disposed over the first core, wherein a magnetic structure is integrally formed with the second core and protruded on the bottom surface of the second core, wherein the bottom surface of the magnetic structure is located over the top surface of the second protrusion.

    VARIABLE COUPLED INDUCTOR
    6.
    发明申请
    VARIABLE COUPLED INDUCTOR 有权
    可变耦合电感器

    公开(公告)号：US20160099099A1

    公开(公告)日：2016-04-07

    申请号：US14967307

    申请日：2015-12-13

    Applicant: CYNTEC CO., LTD.

    Inventor： Lan-Chin Hsieh ,  Cheng-Chang Lee ,  Chih-Hung Chang ,  Chih-Siang Chuang ,  Tsung-Chan Wu ,  Roger Hsieh

    IPC: H01F27/24 ,  H01F27/28

    CPC classification number: H01F27/24 ,  H01F3/14 ,  H01F17/04 ,  H01F27/2823 ,  H01F38/023 ,  H01F2003/106

    Abstract: A variable coupled inductor includes a first core, two conducting wires, a second core and a magnetic structure. The first core includes two first protruding portions, a second protruding portion and two grooves, wherein the second protruding portion is located between the two first protruding portions and each of the grooves is located between one of the first protruding portions and the second protruding portion. Each of the conducting wires is disposed in one of the grooves. The second core is disposed on the first core. A first gap is formed between each of the first protruding portions and the second core and a second gap is formed between the second protruding portion and the second core. The magnetic structure is disposed between the second protruding portion and the second core and distributed symmetrically with respect to a centerline of the second protruding portion.

    Abstract translation: 可变耦合电感器包括第一芯，两个导线，第二芯和磁结构。 第一芯包括两个第一突出部分，第二突出部分和两个凹槽，其中第二突出部分位于两个第一突出部分之间，并且每个槽位于第一突出部分和第二突出部分之一之间。 每个导线设置在一个凹槽中。 第二芯设置在第一芯上。 在第一突出部和第二芯之间形成有第一间隙，在第二突出部和第二芯之间形成有第二间隙。 磁性结构设置在第二突出部和第二芯之间，并相对于第二突出部的中心线对称分布。

    PCB inter-layer conductive structure applicable to large-current PCB
    8.
    发明授权
    PCB inter-layer conductive structure applicable to large-current PCB 有权

    公开(公告)号：US10199153B2

    公开(公告)日：2019-02-05

    申请号：US14755528

    申请日：2015-06-30

    Applicant: CYNTEC CO., LTD.

    Inventor： Yi-Wei Chen ,  Cheng-Chang Lee

    IPC: H05K3/40 ,  H01F27/28 ,  H05K1/02 ,  H05K1/11 ,  H05K3/06 ,  H01F17/00 ,  H05K3/46

    Abstract: For producing an inter-layer conductive structure of a circuit board, an insulating layer, a first conductive layer, a second conductive layer and an electric contact material are provided, wherein the insulating layer includes at least a conductive hole therein. The electric contact material is inserted into the conductive hole of the insulating layer to form a conductive plug, and the first and second conductive layers are laminated to opposite surfaces of the insulating layer, respectively. After lamination, the conductive plug has two ends thereof in electric contact with the first conductive layer and the second conductive layer, respectively.

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