公开(公告)号：US20190261955A1

公开(公告)日：2019-08-29

申请号：US16404672

申请日：2019-05-06

Applicant: Butterfly Network, Inc.

Inventor： Kailiang Chen ,  Nevada J. Sanchez ,  Susan A. Alie ,  Tyler S. Ralston ,  Jonathan M. Rothberg ,  Keith G. Fife ,  Joseph Lutsky

IPC: A61B8/08 ,  H04B11/00

Abstract: Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application-specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC.

公开(公告)号：US20190261954A1

公开(公告)日：2019-08-29

申请号：US16404665

申请日：2019-05-06

Applicant: Butterfly Network, Inc.

Inventor： Kailiang Chen ,  Nevada J. Sanchez ,  Susan A. Alie ,  Tyler S. Ralston ,  Jonathan M. Rothberg ,  Keith G. Fife ,  Joseph Lutsky

IPC: A61B8/08 ,  H04B11/00

Abstract: Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application-specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC.

公开(公告)号：US10340867B2

公开(公告)日：2019-07-02

申请号：US16245202

申请日：2019-01-10

Applicant: Butterfly Network, Inc.

Inventor： Amandeep Singh ,  Kailiang Chen ,  Tyler S. Ralston

IPC: H03F3/45 ,  G01S7/523 ,  G01S15/89 ,  H03M1/12 ,  B06B1/02 ,  G01H17/00 ,  G01N29/44

Abstract: An ultrasound circuit comprising a trans-impedance amplifier (TIA) with built-in time gain compensation functionality is described. The TIA is coupled to an ultrasonic transducer to amplify an electrical signal generated by the ultrasonic transducer in response to receiving an ultrasound signal. The TIA is, in some cases, followed by further analog and digital processing circuitry.

公开(公告)号：US20190142391A1

公开(公告)日：2019-05-16

申请号：US16245310

申请日：2019-01-11

Applicant: Butterfly Network, Inc.

Inventor： Liewei Bao ,  Kailiang Chen ,  Tyler S. Ralston ,  Nevada J. Sanchez

IPC: A61B8/00 ,  B06B1/02 ,  G01S15/89 ,  G01S7/52

Abstract: Circuitry for ultrasound devices is described. A multi-level pulser is described, which can support time-domain and spatial apodization. The multi-level pulser may be controlled through a software-defined waveform generator. In response to the execution of a computer code, the waveform generator may access master segments from a memory, and generate a stream of packets directed to pulsing circuits. The stream of packets may be serialized. A plurality of decoding circuits may modulate the streams of packets to obtain spatial apodization.

公开(公告)号：US20190140603A1

公开(公告)日：2019-05-09

申请号：US16178117

申请日：2018-11-01

Applicant: Butterfly Network, Inc.

Inventor： Kailiang Chen ,  Keith G. Fife ,  Nevada J. Sanchez ,  Andrew J. Casper ,  Tyler S. Ralston

IPC: H03F3/16 ,  A61B8/00 ,  G01S7/52 ,  H03F1/08 ,  H03F3/45 ,  A61B5/00

Abstract: A variable current trans-impedance amplifier (TIA) for an ultrasound device is described. The TIA may be coupled to an ultrasonic transducer to amplify an output signal of the ultrasonic transducer representing an ultrasound signal received by the ultrasonic transducer. During acquisition of the ultrasound signal by the ultrasonic transducer, one or more current sources in the TIA may be varied.

公开(公告)号：US10277236B2

公开(公告)日：2019-04-30

申请号：US15979883

申请日：2018-05-15

Applicant: Butterfly Network, Inc.

Inventor： Kailiang Chen ,  Tyler S. Ralston

IPC: H03M1/12 ,  H03M1/00 ,  A61B8/00 ,  H03M1/46

Abstract: An ultrasound device including an asynchronous successive approximation analog-to-digital converter and method are provided. The device includes at least one ultrasonic transducer, a plurality of asynchronous successive-approximation-register (SAR) analog-to-digital converters (ADC) coupled to the at least one ultrasonic transducer, at least one asynchronous SAR in the plurality having a sample and hold stage, a digital-to-analog converter (DAC), a comparator, and control circuitry, wherein a DAC update event following at least one bit conversion is synchronized to a corresponding DAC update event of at least one other ADC in the plurality of ADCs.

公开(公告)号：US20190086525A1

公开(公告)日：2019-03-21

申请号：US16178871

申请日：2018-11-02

Applicant: Butterfly Network, Inc.

Inventor： Kailiang Chen ,  Keith G. Fife ,  Tyler S. Ralston ,  Nevada J. Sanchez ,  Andrew J. Casper

IPC: G01S7/527 ,  G01S7/52 ,  G01S15/89 ,  B06B1/02

Abstract: Methods and apparatus are described for implementing a coding scheme on ultrasound signals received by a plurality of ultrasonic transducers. The coding, and subsequent decoding, may allow for multiple ultrasonic transducers to be operated in a receive mode simultaneously while still differentiating the contribution of the individual ultrasonic transducers. Improved signal characteristics may result, including improved signal-to-noise ratio (SNR).

公开(公告)号：US20190047850A1

公开(公告)日：2019-02-14

申请号：US16158999

申请日：2018-10-12

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Susan A. Alie ,  Keith G. Fife ,  Nevada J. Sanchez ,  Tyler S. Ralston ,  Jaime Scott Zahorian

IPC: B81C1/00 ,  B06B1/02 ,  B06B1/06 ,  B81B7/00

Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

公开(公告)号：US09933516B2

公开(公告)日：2018-04-03

申请号：US15288324

申请日：2016-10-07

Applicant: Butterfly Network, Inc.

Inventor： Kailiang Chen ,  Tyler S. Ralston

IPC: A61B8/00 ,  G01S7/524 ,  H03K19/0175 ,  G01S7/521

CPC classification number: G01S7/524 ,  A61B8/4483 ,  A61B8/54 ,  G01S7/5202 ,  G01S7/5208 ,  G01S7/52096 ,  G01S7/521 ,  H03K19/017545

Abstract: Apparatus and methods are provided directed to a device, including at least one ultrasonic transducer, a multi-level pulser coupled to the at least one ultrasonic transducer; the multi-level pulser including a plurality of input terminals configured to receive respective input voltages, an output terminal configured to provide an output voltage, and a signal path between a first input terminal and the output terminal including a first transistor having a first conductivity type coupled to a first diode and, in parallel, a second transistor having a second conductivity type coupled to a second diode.

公开(公告)号：US20170360414A1

公开(公告)日：2017-12-21

申请号：US15631729

申请日：2017-06-23

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Susan A. Alie ,  Nevada J. Sanchez ,  Tyler S. Ralston ,  Christopher Thomas McNulty ,  Jaime Scott Zahorian ,  Paul Francis Cristman ,  Matthew de Jonge ,  Keith G. Fife ,  David Elgena

IPC: A61B8/00 ,  A61B8/08

CPC classification number: A61B8/4477 ,  A61B8/0883 ,  A61B8/0891 ,  A61B8/12 ,  A61B8/4236 ,  A61B8/4427 ,  A61B8/4444 ,  A61B8/4472 ,  A61B8/4494 ,  A61B8/465 ,  A61B8/467 ,  A61B8/483 ,  A61B8/485 ,  A61B8/488 ,  A61B8/5207 ,  A61B8/54 ,  A61B8/56 ,  B06B1/0292 ,  B06B1/0622

Abstract: A system comprising a multi-modal ultrasound probe configured to operate in a plurality of operating modes associated with a respective plurality of configuration profiles; and a computing device coupled to the handheld multi-modal ultrasound probe and configured to, in response to receiving input indicating an operating mode selected by a user, cause the multi-modal ultrasound probe to operate in the selected operating mode.