公开(公告)号：US20230046075A1

公开(公告)日：2023-02-16

申请号：US17453063

申请日：2021-11-01

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Chang-Yu CHIANG

IPC: H05K7/20

Abstract: A liquid cooling system includes a liquid coolant conduit in proximity to heat-generating electrical components within an enclosed space. The conduit allows circulation of a liquid coolant to extract heat from the heat-generating components. The heat-generating components includes at least one first heat-generating electrical component and at least one second heat-generating electrical component. The first heat-generating component produces greater heat than the second heat-generating component. The enclosed space includes an inlet and an outlet. The conduit includes a nozzle fluidly connected to the inlet. The nozzle is located within the enclosed space. The nozzle forms first and second aperture sets. The first aperture set directs the liquid coolant to the first heat-generating component. The second aperture set directs the liquid coolant to the second heat-generating component. The nozzle allows liquid coolant to pass the first heat-generating component at a faster rate than the second heat-generating component.

公开(公告)号：US20220354022A1

公开(公告)日：2022-11-03

申请号：US17387415

申请日：2021-07-28

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Yu Nien HUANG ,  Sin-Hong LIEN ,  Jen-Mao CHEN

IPC: H05K7/20

Abstract: A system includes a rack of servers and a fluid circuit for cooling the rack of servers. The fluid circuit includes one or more cooling modules, a heat-exchanging module, and a pump. The one or more cooling modules are thermally connected to a conduit for flowing a coolant therethrough. Each cooling module includes a heat-exchanger thermally connected to the conduit and a chiller fluidly coupled to the heat-exchanger. The heat-exchanging module is fluidly connected to an outlet of the conduit. The pump is configured to drive the coolant from the heat-exchanging module to each server in the rack of servers.

公开(公告)号：US20220225528A1

公开(公告)日：2022-07-14

申请号：US17236557

申请日：2021-04-21

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Guo-Xiang HU

IPC: H05K7/20

Abstract: An immersion liquid cooling tank assembly includes a generally hexagonal tank, a condenser, a manifold system, and at least one top cover. The tank includes a base and a plurality of side walls. The base and the plurality of sidewalls are connected. The condenser includes a plurality of condenser tubes. The manifold system is coupled to the condenser to assist in distributing liquid flow to and from the plurality of condenser tubes. The at least one top cover is located generally opposite to the base.

公开(公告)号：US20220225527A1

公开(公告)日：2022-07-14

申请号：US17236509

申请日：2021-04-21

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Tsung-Ta LI ,  Guo-Xiang HU

IPC: H05K7/20

Abstract: An immersion liquid cooling tank assembly includes a generally elliptical tank, at least one condenser including a plurality of condenser tubes, at least one cooling fan adjacent to the condenser, a manifold system coupled to the at least one condenser to assist in distributing liquid flow to and from the plurality of condenser tubes, and a top cover disposed over the generally elliptical tank. The top cover includes an air baffle.

公开(公告)号：US20220104372A1

公开(公告)日：2022-03-31

申请号：US17123985

申请日：2020-12-16

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Hou-Hsien CHANG

IPC: H05K5/02 ,  F16H19/04 ,  H05K7/14

Abstract: A lock mechanism within a slot of a computer chassis is disclosed. The lock mechanism includes a gear wheel, a gear rack body, a push rod latch, a push rod body, and a chassis latch. The gear wheel, the gear rack body, the push rod latch, the push rod body, and the chassis latch cooperate to restrict a flap in the slot from opening when the flap is in the closed position, and the chassis latch is engaged with a cutout on the push rod body.

公开(公告)号：US20220030732A1

公开(公告)日：2022-01-27

申请号：US17071403

申请日：2020-10-15

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Hou-Hsien CHANG

IPC: H05K7/14 ,  G06F1/18

Abstract: A locking mechanism for a computing device controls movement of a removable module within a computer chassis. The locking mechanism comprises a lock pin, a head, and a spring stopper. The lock pin includes an elongated shaft and a head. The spring stopper is disposed on the elongated shaft. The spring is disposed about the elongated shaft such that the spring extends from the spring stopper toward an end of the elongated shaft. As the lock pin moves along a longitudinal axis of the elongated shaft from a first position to a second position, the spring is configured to compress between the spring stopper and a fixed bracket in the computer chassis. The opposite second end extends through a hole in the removable module, thereby preventing the removable module from being removed from the computer chassis.

公开(公告)号：US20210392790A1

公开(公告)日：2021-12-16

申请号：US17070194

申请日：2020-10-14

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Kuan-Hsiang LIAO

IPC: H05K7/20

Abstract: A cooling system is disclosed for a server rack holding one or more servers. The cooling system includes a cooling module configured to condition coolant to provide cooling within the server rack. The cooling system further includes at least one evaporator configured to couple to an upstream side of the server rack, relative to airflow through the server rack, and cool the airflow flowing into the server rack with the coolant. The cooling system further includes at least one condenser configured to couple to a downstream side of the server rack, relative to the airflow through the server rack, and cool the coolant after the coolant passes through the at least one evaporator.

公开(公告)号：US20210092868A1

公开(公告)日：2021-03-25

申请号：US16743958

申请日：2020-01-15

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Yu-Nien Huang ,  Tsung-Ta LI ,  Kuo-Wei LEE

IPC: H05K7/20 ,  G06F1/20

Abstract: A fan arrangement to generate increased airflow in a chassis is disclosed. The chassis includes one area having electronic components. A first row of fan modules is located in the chassis relative to the electronic components to generate airflow in a direction of the length of the chassis through the electronic components. The first row of fan modules includes at least one gap between the fan modules. A second row of fan modules is located a predetermined distance from the first row. The second row of fan modules includes at least one gap between the fan modules. Each of the fan modules in the second row is staggered from one of the fan modules of the first row. A first panel connects one of fan modules in the first row with one of the fan modules of the second row to create a channel.

公开(公告)号：US20200303283A1

公开(公告)日：2020-09-24

申请号：US16358250

申请日：2019-03-19

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Kuen-Hsien WU ,  Shih-I LIANG

IPC: H01L23/40 ,  H01L23/427 ,  F28D15/02 ,  F28F3/00

Abstract: A heat sink having a flexible heat sink base is disclosed in order to flex the heat sink into contact with concave heat sources. Flexibility is achieved by providing a series of concentric grooves on the heat sink base on a surface opposite the surface contacting the heat source. A central cylinder is provided at the center of the concentric grooves. A biasing device, such as a spring, exerts a force on the central cylinder to flex the heat sink base.

公开(公告)号：US20200214177A1

公开(公告)日：2020-07-02

申请号：US16413238

申请日：2019-05-15

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Yu-Nien Huang ,  Ching-Yu CHEN ,  Tsung-Ta LI

IPC: H05K7/20

Abstract: A dynamic air impedance mechanism is provided which has particular utility in changing the impedance of air flow within servers. The mechanism comprises an air duct having a plurality of vent holes, a control plate defining a plurality of openings, and relative movement between the openings in the control plate and the corresponding vent holes in the air duct to change the impedance of air flow through the server.