公开(公告)号：US09007806B2

公开(公告)日：2015-04-14

申请号：US13782263

申请日：2013-03-01

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani ,  Marco Morelli ,  Giulio Ricotti

IPC: G11C11/00 ,  G11C23/00 ,  H01H1/00 ,  G11C11/50 ,  H01H59/00 ,  H01H1/52 ,  G11C7/02 ,  G11C7/10 ,  G11C7/12 ,  G11C5/00 ,  G11C29/12 ,  G11C29/04

CPC classification number: G11C23/00 ,  G11C5/005 ,  G11C7/02 ,  G11C7/1048 ,  G11C7/12 ,  G11C11/50 ,  G11C29/12 ,  G11C2029/0409 ,  H01H1/0036 ,  H01H1/52 ,  H01H59/0009

Abstract: An electromechanical memory element includes a fixed body and a deformable element attached to the fixed body. An actuator causes a deformation of the deformable element from a first position (associated with a first logic state) to a second position (associated with a second logic state) where a mobile element makes contact with a fixed element. A programming circuit then causes a weld to be formed between the mobile element and the fixed element. The memory element is thus capable of associating the first and second positions with two different logic states. The weld may be selectively dissolved to return the deformable element back to the first position.

Abstract translation: 机电存储元件包括固定体和附接到固定体的可变形元件。 致动器使可变形元件从第一位置（与第一逻辑状态相关联）变形到移动元件与固定元件接触的第二位置（与第二逻辑状态相关联）。 然后编程电路在可移动元件和固定元件之间形成焊缝。 因此，存储元件能够将第一和第二位置与两个不同的逻辑状态相关联。 可以选择性地溶解焊缝以将可变形元件返回到第一位置。

公开(公告)号：US20140191779A1

公开(公告)日：2014-07-10

申请号：US14171211

申请日：2014-02-03

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani

IPC: G01R31/28

CPC classification number: G01R31/2851 ,  G01R31/2886 ,  G01R31/3025 ,  G01R31/303 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated circuit integrated on a semiconductor material die and adapted to be at least partly tested wirelessly, wherein circuitry for setting a selected radio communication frequencies to be used for the wireless test of the integrated circuit are integrated on the semiconductor material die.

Abstract translation: 一种集成在半导体材料裸片上并适于至少部分地被无线测试的集成电路，其中用于设置用于集成电路的无线测试的所选无线电通信频率的电路集成在半导体材料裸片上。