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公开(公告)号：US11245273B2
公开(公告)日：2022-02-08
申请号：US16282097
申请日：2019-02-21
Applicant: STMicroelectronics Pte Ltd
Inventor： Prabhu Jyoti , Cho Seng Dominic Tay
IPC: H02J7/00 , H01M50/10 , H01M50/20 , H01M50/204 , H01M50/207 , H01M10/46
Abstract: A battery charging system includes a first electrical connector disposed facing a first shelf, a second electrical connector disposed facing a second shelf, a first charge device coupled to the first electrical connector, and a second charge device coupled to the second electrical connector. A mobile device includes a first electrical connector, a first shelf portion and a second shelf portion, which are facing the first electrical connector, and a third shelf portion and a fourth shelf portion, which are facing the second electrical connector. Each of the electrical connectors of the battery charging system and the mobile device includes a first conductor, a second conductor, and a third conductor, with the first conductor electrically coupled to the third conductor, and the second conductor electrically isolated from and disposed between the first and third conductors, which enable the battery charging system and mobile device to easily swap batteries.
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公开(公告)号：US20210305438A1
公开(公告)日：2021-09-30
申请号：US17187510
申请日：2021-02-26
Applicant: STMICROELECTRONICS LTD , STMICROELECTRONICS PTE LTD
Inventor： David GANI , Yiying KUO
IPC: H01L31/0203 , H01L31/02 , H01L31/18 , H01L31/0392
Abstract: The present disclosure is directed to a package, such as a wafer level chip scale package (WLCSP), with a die coupled to a central portion of a transparent substrate. The transparent substrate includes a central portion having and a peripheral portion surrounding the central portion. The package includes a conductive layer coupled to a contact of the die within the package that extends from the transparent substrate to an active surface of the package. The active surface is utilized to mount the package within an electronic device or to a printed circuit board (PCB) accordingly. The package includes a first insulating layer separating the die from the conductive layer, and a second insulating layer on the conductive layer.
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公开(公告)号：US20210193476A1
公开(公告)日：2021-06-24
申请号：US17096434
申请日：2020-11-12
Applicant: STMicroelectronics Pte Ltd
Inventor： Yuzhan WANG , Pradeep BASAVANAHALLI KUMARSWAMY , Hong Kia KOH , Alberto LEOTTI , Patrice RAMONDA
IPC: H01L21/3105 , H01L21/762
Abstract: A first dielectric layer made of a first dielectric material is deposited over a semiconductor substrate. A buffer layer is then deposited on an upper surface of the first dielectric layer. A trench is opened to extend through the buffer layer and the first dielectric layer. A second dielectric layer made of a second dielectric material is the deposited in a conformal manner on the buffer layer and filling the trench. Chemical mechanical polishing of the second dielectric layer is performed to remove overlying portions of the second dielectric layer with the buffer layer being used as a polish stop. After removing the buffer layer, the first dielectric layer and the second dielectric material filling the trench form a pre-metallization dielectric layer having a substantially planar upper surface.
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公开(公告)号：US11009474B2
公开(公告)日：2021-05-18
申请号：US16217631
申请日：2018-12-12
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Malek Brahem , Hatem Majeri , Olivier Le Neel , Ravi Shankar
Abstract: The present disclosure is directed to a gas sensor device that includes a plurality of gas sensors. Each of the gas sensors includes a semiconductor metal oxide (SMO) film, a heater, and a temperature sensor. Each of the SMO films is designed to be sensitive to a different gas concentration range. As a result, the gas sensor device is able to obtain accurate readings for a wide range of gas concentration levels. In addition, the gas sensors are selectively activated and deactivated based on a current gas concentration detected by the gas sensor device. Thus, the gas sensor device is able to conserve power as gas sensors are on when appropriate instead of being continuously on.
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公开(公告)号：US10768133B2
公开(公告)日：2020-09-08
申请号：US15723661
申请日：2017-10-03
Applicant: STMicroelectronics Pte Ltd
Inventor： Ravi Shankar , Olivier Le Neel , Tien-Choy Loh , Shian-Yeu Kam
Abstract: Miniature resistive gas detectors incorporate thin films that can selectively identify specific gases when heated to certain characteristic temperatures. A solid state gas sensor module is disclosed that includes a gas sensor, a heater, and a temperature sensor, stacked over an insulating recess. The insulating recess is partially filled with a support material that provides structural integrity. The solid state gas sensor module can be integrated on top of an ASIC on a common substrate. With sufficient thermal insulation, such a gas detector can be provided as a low-power component of mobile electronic devices such as smart phones. A method of operating a multi-sensor array allows detection of relative concentrations of different gas species by either using dedicated sensors, or by thermally tuning the sensors to monitor different gas species.
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Patent Agency Ranking
公开(公告)号：US10684389B2
公开(公告)日：2020-06-16
申请号：US16107911
申请日：2018-08-21
Inventor： Wing Shenq Wong , Andy Price , Eric Christison
IPC: H01L31/167 , G01V8/12 , H01L25/16
Abstract: A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.
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167.发明申请公开(公告)号：US20200075475A1
公开(公告)日：2020-03-05
申请号：US16550775
申请日：2019-08-26
Applicant: STMicroelectronics Pte Ltd
Inventor： Daniel Yap , Hung Meng Loh
IPC: H01L23/498 , H01L23/31 , H01L23/495 , H01L21/48
Abstract: A method of forming a solder connection includes forming a solder mask on a thermal pad of a printed circuit board. The solder mask leaves unmasked portions of the thermal pad and forming the solder mask includes forming a plurality of mask stripes extending from edges of each unmasked portion towards a center of the unmasked portion. The method includes depositing solder paste on the unmasked portions of the thermal pad and placing an exposed thermal pad of an integrated circuit package on the solder paste deposited on the thermal pad of the printed circuit board. The method includes forming a solder connection by heating the solder paste between the unmasked portions of the thermal pad on the printed circuit board and the exposed thermal pad of the integrated circuit package.
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公开(公告)号：US20200033309A1
公开(公告)日：2020-01-30
申请号：US16458561
申请日：2019-07-01
Applicant: STMicroelectronics PTE LTD
Inventor： Fangxing YUAN , Ravi SHANKAR , Olivier LE NEEL
Abstract: The present disclosure is directed to a selective multi-gas sensor device that detects when a high concentration level of a particular gas, such as methane, carbon monoxide, and/or ethanol, is present. The selective multi-gas sensor device detects and identifies a particular gas based on a ratio between a sensitivity of a gas sensitive material at a first temperature and a sensitivity of the gas sensitive material at a second temperature.
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公开(公告)号：US20190363123A1
公开(公告)日：2019-11-28
申请号：US16536984
申请日：2019-08-09
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Jean-Michel Grebet , Wee Chin Judy Lim
IPC: H01L27/146 , H01L31/0203
Abstract: An image sensing device includes an interconnect layer and a number of grid array contacts arranged on a bottom side of the interconnect layer. An image sensor integrated circuit (IC) is carried by the interconnect layer and has an image sensing surface. A number of electrical connections are coupled between the image sensor IC and an upper side of the interconnect layer. A transparent plate overlies the image sensing surface of the image sensor IC. A cap is carried by the interconnect layer and has an opening overlying transparent plate and the image sensing surface. The cap has an upper wall spaced above the interconnect layer and the image sensor IC to define an internal cavity and the cap defines an air vent coupled to the internal cavity.
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公开(公告)号：US20190154801A1
公开(公告)日：2019-05-23
申请号：US15818465
申请日：2017-11-20
Applicant: STMICROELECTRONICS PTE LTD
Inventor： David GANI
CPC classification number: G01S7/4808 , G01J1/4204 , G01S7/4813 , G01S7/4814 , G01S7/4816 , G01S7/4876 , G01S7/493 , G01S7/497 , G01S17/026 , G01S17/08
Abstract: A semiconductor package that is a proximity sensor includes a light transmitting die, a light receiving die, an ambient light sensor, a cap, and a substrate. The light receiving die and the light transmitting die are coupled to the substrate. The cap is coupled to the substrate forming a first chamber around the light transmitting die and a second chamber around the light receiving die. The cap further includes a recess with contact pads. The ambient light sensor is mounted within the recess of the cap and coupled to the contact pads. The cap includes electrical traces that are coupled to the contact pads within the recess coupling the ambient light sensor to the substrate. By utilizing a cap with a recess containing contact pads, a proximity sensor can be formed in a single semiconductor package all while maintaining a compact size and reducing the manufacturing costs of proximity sensors.
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