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公开(公告)号：US20240036019A1
公开(公告)日：2024-02-01
申请号：US18485072
申请日：2023-10-11
Applicant: STMICROELECTRONICS S.r.l. , STMICROELECTRONICS PTE LTD
Inventor： Malek BRAHEM , Hatem MAJERI , Olivier LE NEEL , Ravi SHANKAR , Enrico Rosario ALESSI , Pasquale BIANCOLILLO
CPC classification number: G01N33/0047 , G01N27/12 , G01N27/021
Abstract: The present disclosure is directed to a gas sensor device that detects gases with large molecules (e.g., a gas with a molecular weight between 150 g/mol and 450 g/mol), such as siloxanes. The gas sensor device includes a thin film gas sensor and a bulk film gas sensor. The thin film gas sensor and the bulk film gas sensor each include a semiconductor metal oxide (SMO) film, a heater, and a temperature sensor. The SMO film of the thin film gas sensor is an thin film (e.g., between 90 nanometers and 110 nanometers thick), and the SMO film of the bulk film gas sensor is an thick film (e.g., between 5 micrometers and 20 micrometers thick). The gas sensor device detects gases with large molecules based on a variation between resistances of the SMO thin film and the SMO thick film.
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公开(公告)号：US20230236161A1
公开(公告)日：2023-07-27
申请号：US18091470
申请日：2022-12-30
Applicant: STMicroelectronics PTE LTD , STMicroelectronics S.r.l.
Inventor： Ravi SHANKAR , Wei Ren Douglas LEE , Giuseppe BRUNO
CPC classification number: G01N33/0027 , G01N27/045
Abstract: A gas sensor is formed by a thin-film semiconductor metal-oxide gas sensing layer, with a thermally conductive and electrically-insulating layer in direct physical contact with a back of the gas sensing layer to carry the gas sensing layer. Sensing circuitry applies a voltage to the gas sensing layer and measures a current flowing through the gas sensing layer. The current flowing through the gas sensing layer is indicative of whether a gas under detection has been detected by the gas sensing layer, and serves to self-heat the gas sensing layer. A support structure extends from a substrate to make direct physical contact with and carry the thermally conductive and electrically insulating layer about a perimeter of a back face thereof, with the support structure shaped to form an air gap between the back of the thermally conductive and electrically insulating layer and a front of the substrate.
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公开(公告)号：US20180156747A1
公开(公告)日：2018-06-07
申请号：US15367081
申请日：2016-12-01
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Olivier LE NEEL , Alexandre LE ROCH , Ayoub LAHLALIA , Ravi SHANKAR
CPC classification number: G01N27/18 , G01N33/0047
Abstract: The present disclosure is directed to a gas sensor that includes an active sensor area that is exposed to an environment for detection of elements. The gas sensor may be an air quality sensor that can be fixed in position or carried by a user. The gas sensor includes a heater formed above chamber. The gas sensor includes an active sensor layer above the heater that forms the active sensor area. The gas sensor can include a passive conductive layer, such as a hotplate that further conducts and distributes heat from the heater to the active sensor area. The heater can include a plurality of extensions. The heater can also include a first conductive layer and a second conductive layer on the first conductive layer where the second conductive layer includes a plurality of openings to increase an amount of heat and to more evenly distribute heat from the heater to the active sensor area.
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Patent Agency Ranking
公开(公告)号：US20160187973A1
公开(公告)日：2016-06-30
申请号：US14586547
申请日：2014-12-30
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Ravi SHANKAR , Olivier LENEEL
CPC classification number: G06F3/014 , G09G5/18 , G09G2370/16
Abstract: A flexible smart glove detects fine hand and finger motions while permitting the wearer to make hand gestures with dexterity. The flexible smart glove has a thickness of less than about 100 μm and incorporates capacitive micro-sensors positioned at finger joint locations. The micro-sensors are thin film devices built on substrates made of a pliable material such as polyimide. Interdigitated serpentine capacitors monitor strain in the back of the hand, while parallel plate capacitors monitor contact pressure on the palm. Thus the smart glove responds electrically to various types of hand motions. Thin film resistors responsive to changes in body temperature are also formed on the flexible substrate. Motion and temperature data is transmitted from the glove to a microprocessor via a passive RFID tag or an active wireless transmitter. An ASIC is embedded in the smart glove to relay real time sensor data to a remote processor.
Abstract translation: 灵活的智能手套可以检测精细的手指和手指运动，同时允许佩戴者灵巧地进行手势。 柔性智能手套具有小于约100μm的厚度，并且包括位于手指接合位置处的电容式微传感器。 微传感器是由诸如聚酰亚胺等柔韧材料制成的基板上的薄膜装置。 交叉蛇形电容器用于监测手背的应变，而平行电容器则监测手掌上的接触压力。 因此，智能手套电动响应于各种类型的手动。 响应于体温变化的薄膜电阻也形成在柔性基板上。 运动和温度数据通过无源RFID标签或有源无线发射器从手套传送到微处理器。 ASIC嵌入智能手套中以将实时传感器数据中继到远程处理器。
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公开(公告)号：US20200033309A1
公开(公告)日：2020-01-30
申请号：US16458561
申请日：2019-07-01
Applicant: STMicroelectronics PTE LTD
Inventor： Fangxing YUAN , Ravi SHANKAR , Olivier LE NEEL
Abstract: The present disclosure is directed to a selective multi-gas sensor device that detects when a high concentration level of a particular gas, such as methane, carbon monoxide, and/or ethanol, is present. The selective multi-gas sensor device detects and identifies a particular gas based on a ratio between a sensitivity of a gas sensitive material at a first temperature and a sensitivity of the gas sensitive material at a second temperature.
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公开(公告)号：US20210156836A1
公开(公告)日：2021-05-27
申请号：US17166580
申请日：2021-02-03
Applicant: STMICROELECTRONICS S.r.l. , STMICROELECTRONICS PTE LTD
Inventor： Malek BRAHEM , Hatem MAJERI , Olivier LE NEEL , Ravi SHANKAR , Enrico Rosario ALESSI , Pasquale BIANCOLILLO
Abstract: The present disclosure is directed to a gas sensor device that detects gases with large molecules (e.g., a gas with a molecular weight between 150 g/mol and 450 g/mol), such as siloxanes. The gas sensor device includes a thin film gas sensor and a bulk film gas sensor. The thin film gas sensor and the bulk film gas sensor each include a semiconductor metal oxide (SMO) film, a heater, and a temperature sensor. The SMO film of the thin film gas sensor is an thin film (e.g., between 90 nanometers and 110 nanometers thick), and the SMO film of the bulk film gas sensor is an thick film (e.g., between 5 micrometers and 20 micrometers thick). The gas sensor device detects gases with large molecules based on a variation between resistances of the SMO thin film and the SMO thick film.
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公开(公告)号：US20190257804A1
公开(公告)日：2019-08-22
申请号：US15901721
申请日：2018-02-21
Applicant: STMICROELECTRONICS PTE LTD , STMICROELECTRONICS S.R.L.
Inventor： Malek BRAHEM , Hatem MAJERI , Olivier LE NEEL , Ravi SHANKAR , Enrico Rosario ALESSI , Pasquale BIANCOLILLO
Abstract: The present disclosure is directed to a gas sensor device that detects gases with large molecules (e.g., a gas with a molecular weight between 150 g/mol and 450 g/mol), such as siloxanes. The gas sensor device includes a thin film gas sensor and a bulk film gas sensor. The thin film gas sensor and the bulk film gas sensor each include a semiconductor metal oxide (SMO) film, a heater, and a temperature sensor. The SMO film of the thin film gas sensor is an thin film (e.g., between 90 nanometers and 110 nanometers thick), and the SMO film of the bulk film gas sensor is an thick film (e.g., between 5 micrometers and 20 micrometers thick). The gas sensor device detects gases with large molecules based on a variation between resistances of the SMO thin film and the SMO thick film.
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公开(公告)号：US20160103109A1
公开(公告)日：2016-04-14
申请号：US14511280
申请日：2014-10-10
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Yonggang JIN , Ravi SHANKAR
IPC: G01N33/00
CPC classification number: G01N33/0009 , H01L2224/48091 , H01L2924/00014
Abstract: A gas sensor device may include a gas sensor integrated circuit (IC) having a gas sensing surface, and bond pads adjacent to the gas sensing surface, and a frame having gas passageways extending therethrough adjacent the gas sensing surface. The gas sensor device may include leads, each having a proximal end spaced from the frame and bonded to a respective bond pad, and a distal end extending downwardly from the proximal end, and encapsulation material filling the space between the proximal ends of the leads and the frame.
Abstract translation: 气体传感器装置可以包括具有气体检测表面的气体传感器集成电路（IC）和与气体感测表面相邻的接合焊盘，以及具有在气体感测表面附近延伸穿过的气体通道的框架。 气体传感器装置可以包括引线，每个引线具有与框架间隔开并且接合到相应的接合焊盘的近端，以及从近端向下延伸的远端，以及填充引线的近端之间的空间的封装材料以及 框架。
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