公开(公告)号：US11251512B2

公开(公告)日：2022-02-15

申请号：US16466627

申请日：2017-01-05

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Sasha Oster ,  Telesphor Kamgaing

IPC: H05K7/00 ,  H01P5/08 ,  H01P3/16 ,  H01R12/70 ,  H01R31/06 ,  H05K1/18 ,  H05K7/14

Abstract: Embodiments of the invention include an active mm-wave interconnect. In an embodiment, the active mm-wave interconnect includes a dielectric waveguide that is coupled to a first connector and a second connector. According to an embodiment, each of the first and second connectors may include a mm-wave engine. In an embodiment, the mm-wave engines may include a power management die, a modulator die, a demodulator die, a mm-wave transmitter die, and a mm-wave receiver die. Additional embodiments may include connectors that interface with predefined interfaces, such as small form-factor pluggables (SFP), quad small form-factor pluggables (QSFP), or octal small form-factor pluggables (OSFP). Accordingly, embodiments of the invention allow for plug and play functionality with existing servers and other high performance computing systems.

公开(公告)号：US20210408657A1

公开(公告)日：2021-12-30

申请号：US16912067

申请日：2020-06-25

Applicant: Intel Corporation

Inventor： Diego Correas-Serrano ,  Georgios Dogiamis ,  Henning Braunisch ,  Neelam Prabhu Gaunkar ,  Telesphor Kamgaing

IPC: H01P5/02 ,  H01L23/498 ,  H01R12/75 ,  H01L23/66 ,  H01P3/16

Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

公开(公告)号：US20210408652A1

公开(公告)日：2021-12-30

申请号：US16911559

申请日：2020-06-25

Applicant: Intel Corporation

Inventor： Diego Correas-Serrano ,  Georgios Dogiamis ,  Henning Braunisch ,  Neelam Prabhu Gaunkar ,  Telesphor Kamgaing

IPC: H01P3/16 ,  H01P1/20 ,  H01P5/08 ,  H01P1/208

Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

公开(公告)号：US20210193519A1

公开(公告)日：2021-06-24

申请号：US16721243

申请日：2019-12-19

Applicant: INTEL CORPORATION

Inventor： Aleksandar Aleksov ,  Telesphor Kamgaing ,  Georgios Dogiamis ,  Feras Eid ,  Johanna M. Swan ,  Shawna M. Liff

IPC: H01L21/768 ,  H01L23/00

Abstract: Disclosed herein are inorganic dies with organic interconnect layers and related structures, devices, and methods. In some embodiments, an integrated circuit (IC) structure may include an inorganic die and one or more organic interconnect layers on the inorganic die, wherein the organic interconnect layers include an organic dielectric.

公开(公告)号：US20210193518A1

公开(公告)日：2021-06-24

申请号：US16721235

申请日：2019-12-19

Applicant: INTEL CORPORATION

Inventor： Aleksandar Aleksov ,  Feras Eid ,  Telesphor Kamgaing ,  Georgios Dogiamis ,  Johanna M. Swan

IPC: H01L21/768 ,  H01L23/00

Abstract: Disclosed herein are inorganic dies with organic interconnect layers and related structures, devices, and methods. In some embodiments, an integrated circuit (IC) structure may include an inorganic die and one or more organic interconnect layers on the inorganic die, wherein the organic interconnect layers include an organic dielectric.

公开(公告)号：US20210125931A1

公开(公告)日：2021-04-29

申请号：US16667698

申请日：2019-10-29

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Aleksandar Aleksov ,  Feras Eid ,  Telesphor Kamgaing ,  Johanna M. Swan

IPC: H01L23/538 ,  B81B7/00 ,  H01L23/28 ,  H01L23/552 ,  H01L21/56

Abstract: Embodiments may relate to a microelectronic package that includes a substrate with an overmold material. The microelectronic package may include a die in the overmold material, and an inactive side of the die may be coupled with a face of the substrate. A through-mold via (TMV) may be present in the overmold material. The TMV may be communicatively coupled with the substrate, and an active side of the die may be communicatively coupled with the TMV by a trace in the overmold material. Other embodiments may be described or claimed.

公开(公告)号：US10992021B2

公开(公告)日：2021-04-27

申请号：US15745681

申请日：2015-09-24

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Telesphor Kamgaing ,  Sasha N. Oster ,  Georgios C. Dogiamis

IPC: H01Q1/22 ,  H01Q1/52

Abstract: Embodiments of the invention may include packaged device that may be used for reducing cross-talk between neighboring antennas. In an embodiment the packaged device may comprise a first package substrate that is mounted to a printed circuit board (PCB). A plurality of first antennas may also be formed on the first package. Embodiments may also include a second package substrate that is mounted to the PCB, and the second package substrate may include a second plurality of antennas. According to an embodiment, the cross-talk between the first and second plurality of antennas is reduced by forming a guiding structure between the first and second packages. In an embodiment the guiding structure comprises a plurality of fins that define a plurality of pathways between the first antennas and the second antennas.

公开(公告)号：US10950919B2

公开(公告)日：2021-03-16

申请号：US16325522

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Sasha N. Oster ,  Adel A. Elsherbini ,  Brandon M. Rawlings ,  Aleksandar Aleksov ,  Shawna M. Liff ,  Richard J. Dischler ,  Johanna M. Swan

IPC: H01P5/02 ,  H01P3/12 ,  H01P3/16 ,  H01P1/04 ,  H01P1/02 ,  H01P11/00

Abstract: An apparatus comprises a waveguide section including an outer layer of conductive material tubular in shape and having multiple ends; and a joining feature on at least one of the ends of the waveguide section configured for joining to a second separate waveguide section.

公开(公告)号：US20210067132A1

公开(公告)日：2021-03-04

申请号：US16550673

申请日：2019-08-26

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios Dogiamis ,  Feras Eid ,  Aleksandar Aleksov ,  Johanna M. Swan

IPC: H03H9/08 ,  H01L27/20 ,  H03H9/70 ,  H01L23/552 ,  H01L23/367 ,  H01L25/16 ,  H01L23/498 ,  H03H3/02 ,  H03H9/54 ,  H03H9/05 ,  H01L23/66

Abstract: Embodiments may relate to a radio frequency (RF) front-end module (FEM). The RF FEM may include an integrated die with an active portion and an acoustic wave resonator (AWR) portion adjacent to the active portion. The RF FEM may further include a lid coupled with the die. The lid may at least partially overlap the AWR portion at a surface of the die. Other embodiments may be described or claimed.

公开(公告)号：US20210043543A1

公开(公告)日：2021-02-11

申请号：US16533065

申请日：2019-08-06

Applicant: Intel Corporation

Inventor： Feras Eid ,  Telesphor Kamgaing ,  Georgios Dogiamis ,  Aleksandar Aleksov ,  Johanna M. Swan

IPC: H01L23/427 ,  H01L23/00 ,  H03H9/46 ,  H01L23/48 ,  H01L23/66 ,  H01L23/31 ,  H01L23/373 ,  H01L23/38

Abstract: Disclosed herein are structures and assemblies that may be used for thermal management in integrated circuit (IC) packages.