Securement of solder unit upon contact

    公开(公告)号:US10559906B2

    公开(公告)日:2020-02-11

    申请号:US16170000

    申请日:2018-10-24

    Inventor: Shan-Yong Cheng

    Abstract: An electronic component includes a first module, a second module and a third module between the first module and the second module. Each of the first module and the second module includes a plurality of conductive pads thereon. A connecting part includes a plate body and a plurality of first tails and a plurality of second tails respectively extending on two opposite sides of the plate body wherein the first tails are soldered upon the first conductive pads and the second tails are soldered upon the second conductive pads, respectively. Each of the first tails and the second tails includes a mounting pad with a through hole therein, and a folded section on the end edge with a solder unit received with a space formed in the folded section and communicatively above the corresponding through hole.

    ELECTRICAL CONTACT
    175.
    发明申请
    ELECTRICAL CONTACT 审中-公开

    公开(公告)号:US20190334272A1

    公开(公告)日:2019-10-31

    申请号:US16395254

    申请日:2019-04-26

    Inventor: SHUO-HSIU HSU

    Abstract: An electrical contact for connecting a chip module to a print circuit board, the electrical contact comprises a main body, an upper elastic arm and a lower mounting arm extending upwardly from the main body, and a lower elastic arm and a lower mounting arm extending downwardly from the main body. The upper mounting arm is disposed at the downside of the upper elastic arm and forms a space therebetween; the lower mounting arm is disposed at the downside of the lower elastic arm and forms a space therebetween. The upper elastic arm and the lower elastic arm are respectively deformed by the chip module and print circuit board to resist to the upper mounting arm and lower mounting arm, thereby shortening the current path between the chip module and the print circuit board for improving the high frequency performance of an electrical connector.

Patent Agency Ranking