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    Optical demultiplexer with truncated profile and an optical transceiver module implementing same
    184.
    发明授权
    Optical demultiplexer with truncated profile and an optical transceiver module implementing same 有权

    公开(公告)号：US11320598B2

    公开(公告)日：2022-05-03

    申请号：US16693364

    申请日：2019-11-24

    Applicant: Applied Optoelectronics, Inc.

    Inventor： Kai-Sheng Lin ,  Hao-Chiang Cheng ,  Ziliang Cai

    IPC: G02B6/12 ,  G02B6/42 ,  G02B6/35 ,  G02B6/125 ,  H04B10/40

    Abstract: The present disclosure is generally directed to an optical demultiplexer for use in an optical transceiver module having a truncated profile/shape to increase tolerance and accommodate adjacent optical components. In more detail, the optical demultiplexer comprises a body with at least one truncated corner at the input end. The at least one truncated corner allows the optical demultiplexer to be disposed/mounted, e.g., directly, on a densely populated transceiver substrate, e.g., a printed circuit board (PBC), and provide additional tolerance/space for mounting of circuitry and/or components within the region that would normally be occupied by corner(s) of the optical demultiplexer body. The at least one truncated corner may be introduced in a post-production step, e.g., via cut & polishing, or introduced during formation of the optical demultiplexer using, for instance, photolithography techniques.

    Lens clip for coupling and optical alignment of an optical lens array and an optical subassembly module implementing same
    186.
    发明授权
    Lens clip for coupling and optical alignment of an optical lens array and an optical subassembly module implementing same 有权

    公开(公告)号：US11221460B2

    公开(公告)日：2022-01-11

    申请号：US16514580

    申请日：2019-07-17

    Applicant: Applied Optoelectronics, Inc.

    Inventor： I-Lung Ho ,  Hsiu-Che Wang ,  Qin Li

    IPC: G02B7/02 ,  H04B10/50

    Abstract: The present disclosure is generally directed to a lens clip that defines at least one mounting surface for coupling to and supporting an array of optical components, e.g., a laser diode and associated components, and an optical lens slot to receive and securely hold an array of optical lenses at a predetermined position relative to the optical components to ensure nominal optical coupling. The optical lens slot includes dimensions that permit insertion of each optical lens into the same and restrict travel along one or more axis. Accordingly, disposing an optical lens within the lens slot ensures correct alignment along at least two axis, e.g., Z and X, with the third axis (e.g., Y) extending parallel along the slot to permit lateral adjustment of each lens.

    Temperature controlled multi-channel transmitter optical subassembly and transceiver module including same
    187.
    发明授权
    Temperature controlled multi-channel transmitter optical subassembly and transceiver module including same 有权

    公开(公告)号：US11146039B2

    公开(公告)日：2021-10-12

    申请号：US16419379

    申请日：2019-05-22

    Applicant: Applied Optoelectronics, Inc.

    Inventor： Kai-Sheng Lin ,  Hsiu-Che Wang ,  Ziliang Cai

    IPC: H04B10/00 ,  H01S5/068 ,  H01S5/0683 ,  H04B10/40 ,  H01S5/024 ,  H01S5/40 ,  H04B10/50 ,  H01S5/00

    Abstract: A temperature controlled multi-channel transmitter optical subassembly (TOSA), consistent with embodiments described herein, may be used in a multi-channel optical transceiver. The temperature controlled multi-channel TOSA generally includes an array of lasers to emit a plurality of different channel wavelengths. The lasers may be thermally tuned to the channel wavelengths by establishing a global temperature for the array of lasers such that the amount of heat communicated to each laser is substantially the same. The global temperature may be established, at least in part, by monitoring the shortest channel wavelength and/or a temperature of the lasers. The temperature of the lasers may then get increased via a shared heating device in thermal communication with the lasers until the shortest monitored wavelength substantially reaches the nominal shortest wavelength or the measured temperature substantially equals the global temperature.

    COAXIAL CONNECTOR SEIZURE ASSEMBLY WITH INTEGRATED MECHANICAL STOP AND A HYBRID FIBER-COAXIAL (HFC) MODULE IMPLEMENTING SAME
    188.
    发明申请
    COAXIAL CONNECTOR SEIZURE ASSEMBLY WITH INTEGRATED MECHANICAL STOP AND A HYBRID FIBER-COAXIAL (HFC) MODULE IMPLEMENTING SAME 有权

    公开(公告)号：US20210281026A1

    公开(公告)日：2021-09-09

    申请号：US16810517

    申请日：2020-03-05

    Applicant: Applied Optoelectronics, Inc.

    Inventor： William G. MAHONEY ,  Simon FARFOUD

    IPC: H01R24/52 ,  H01R13/631 ,  H01R24/54 ,  H01R13/642

    Abstract: A coaxial seizure assembly is disclosed that includes an integrated mechanical stop that prevents over-insertion and maintains a nominal/expected impedance value to enable high-frequency switching, e.g., 1.8-3 Ghz or greater. In more detail, the coaxial seizure assembly includes a coaxial receptacle defined by an opening configured to at least partially receive and couple to a coaxial connector. The opening communicates with a seizure cavity defined within the coaxial seizure assembly. A radio frequency (RF) interconnect at least partially extends into the seizure cavity, with the RF interconnect having a first end to electrically couple to an electrical component and a second end that extends a predetermined angle relative to the first end, e.g., substantially 90 degrees. The second end defines a mating surface that aligns within the seizure cavity such that an imaginary line drawn along an insertion path of a coaxial cable conductor pin intersects with the mating surface.

    COMPONENT BRIDGE FOR INCREASING MOUNTING SURFACE AREA ON FEEDTHROUGH DEVICE AND AN OPTICAL SUBASSEMBLY IMPLEMENTING SAME
    189.
    发明申请
    COMPONENT BRIDGE FOR INCREASING MOUNTING SURFACE AREA ON FEEDTHROUGH DEVICE AND AN OPTICAL SUBASSEMBLY IMPLEMENTING SAME 有权

    公开(公告)号：US20210234612A1

    公开(公告)日：2021-07-29

    申请号：US16751817

    申请日：2020-01-24

    Applicant: Applied Optoelectronics, Inc.

    Inventor： Kai-Sheng LIN ,  Kevin LIU ,  Hao-Chiang CHENG

    IPC: H04B10/40 ,  G02B6/42 ,  H05K1/02 ,  H05K1/18 ,  H04B10/50 ,  H04B10/66

    Abstract: The present disclosure is generally directed to a component bridge that couples to a feedthrough device to provide additional component mounting surface area within a TOSA housing, and preferably, within a hermetically-sealed TOSA housing. The component bridge includes a body that defines a component mounting surface to couple to electrical components, e.g., one or more filtering capacitors, and a notched portion to provide an accommodation groove. The component bridge includes at least one projection/leg for coupling to a mounting surface of a feedthrough device. The accommodation groove of the component bridge allows for other electrical components, e.g., RF traces, to be patterned/disposed on to the mounting surface and extend at least partially through the accommodation groove while remaining electrically isolated from the same. Accordingly, the component bridge further increases available component mounting surface area for existing feedthrough devices without necessity of re-design and/or modification.

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