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181.发明申请公开(公告)号：US20210194201A1
公开(公告)日：2021-06-24
申请号：US16718329
申请日：2019-12-18
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor： Yusheng Bian , Ajey Poovannummoottil Jacob
Abstract: Embodiments of the disclosure provide a waveguide-confining layer, a photonic integrated circuit (PIC) die with embodiments of a waveguide-confining layer, and methods to form the same. The waveguide-confining layer may include an oxide layer over a buried insulator layer, a silicon-based optical confinement structure embedded within or positioned on the oxide layer, and first and second blocking layers over the oxide layer and separated from each other by a horizontal slot. The first and second blocking layers include a metal or an oxide. A gain medium is positioned on the oxide layer and within the horizontal slot between the first and second blocking layers, and has a lower refractive index than each of the first and second blocking layers. The gain medium is vertically aligned with the silicon-based optical confinement structure, and a portion of the oxide layer separates the gain medium from the silicon-based optical confinement structure.
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公开(公告)号：US10989873B1
公开(公告)日：2021-04-27
申请号：US16663696
申请日：2019-10-25
Inventor： Ajey Poovannummoottil Jacob , Yusheng Bian , Sujith Chandran , Marcus Dahlem
Abstract: Structures for a waveguide crossing and methods of fabricating a structure for a waveguide crossing. A waveguide crossing includes a central section and an arm positioned between a waveguide core and the central section. The arm and the waveguide core are aligned along a longitudinal axis. The arm is coupled to the waveguide core at a first interface, and the arm is coupled to a portion of the central section at a second interface. The arm has a first width at the first interface, a second width at the second interface, and a third width between the first interface and the second interface. The third width is greater than either the first width or the second width.
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公开(公告)号：US12272758B2
公开(公告)日：2025-04-08
申请号：US17241525
申请日：2021-04-27
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor： Asif J. Chowdhury , Yusheng Bian , Abdelsalam Aboketaf , Andreas D. Stricker
IPC: H01L31/0232 , G02B6/24 , G02B6/12
Abstract: Structures for a photodetector or light absorber and methods of forming a structure for a photodetector or light absorber. The structure includes a pad, a waveguide core adjoined to the pad, and a light-absorbing layer on the pad. The waveguide core includes a first longitudinal axis, and the light-absorbing layer includes a second longitudinal axis and an end surface intersected by the second longitudinal axis. The end surface of the light-absorbing layer is positioned adjacent to the waveguide core. The first longitudinal axis of the first waveguide core is inclined relative to the second longitudinal axis of the light-absorbing layer and/or the end surface slanted relative to the second longitudinal axis.
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184.发明授权公开(公告)号：US12271030B2
公开(公告)日：2025-04-08
申请号：US17952969
申请日：2022-09-26
Applicant: GlobalFoundries U.S. Inc.
Inventor： Yusheng Bian , Won Suk Lee
Abstract: Structures for an optical coupler and methods of forming a structure for an optical coupler. The structure comprises a stacked waveguide core including a first waveguide core and a second waveguide core. The first waveguide core includes a first tapered section, and the second waveguide core includes a second tapered section positioned to overlap with the first tapered section. The structure further comprises a third waveguide core including a third tapered section positioned adjacent to the first tapered section of the first waveguide core and the second tapered section of the second waveguide core.
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公开(公告)号：US12265255B2
公开(公告)日：2025-04-01
申请号：US17944252
申请日：2022-09-14
Applicant: GlobalFoundries U.S. Inc.
Inventor： Yusheng Bian , Steven M. Shank , Judson Holt , Michal Rakowski , Bartlomiej Jan Pawlak
Abstract: Structures including an electro-absorption modulator and methods of forming such structures. The structure comprises a waveguide core including a first tapered section, a second tapered section, and a longitudinal axis. The first tapered section and the second tapered section are aligned along the longitudinal axis. The structure further comprises a first waveguide taper overlapping the first tapered section of the waveguide core, a second waveguide taper overlapping the second tapered section of the waveguide core, and a multiple-layer structure on the waveguide core between the first waveguide taper and the second waveguide taper.
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Patent Agency Ranking
公开(公告)号：US20250035840A1
公开(公告)日：2025-01-30
申请号：US18225709
申请日：2023-07-25
Applicant: GlobalFoundries U.S. Inc.
Inventor： Yusheng Bian , Kenneth Giewont , Takako Hirokawa
Abstract: Structures for a photonics chip that include a photonic component and methods of forming such structures. The structure may comprise a photodetector on a substrate and a waveguide core. The photodetector includes a light-absorbing layer having a longitudinal axis, a first sidewall, and a second sidewall adjoined to the first sidewall at an interior angle. The first sidewall is slanted relative to the longitudinal axis, and the second sidewall is oriented transverse to the longitudinal axis. The waveguide core includes a tapered section adjacent to the first sidewall and the second sidewall of the light-absorbing layer.
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公开(公告)号：US12204146B2
公开(公告)日：2025-01-21
申请号：US17869065
申请日：2022-07-20
Applicant: GlobalFoundries U.S. Inc.
Inventor： Yusheng Bian
Abstract: Structures for a waveguide crossing and methods of forming such structures. The structure comprises a first waveguide core including a first section, a second section, and a first longitudinal axis. The first section and the second section are aligned along the first longitudinal axis, the first section is terminated by a first end, the second section is terminated by a second end, and the first end of the first section is longitudinally spaced from the second end of the second section by a gap. The structure further comprises a second waveguide core having a second longitudinal axis angled relative to the first longitudinal axis. The second longitudinal axis of the second waveguide core crosses the first longitudinal axis of the first waveguide core within the gap.
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公开(公告)号：US12189183B2
公开(公告)日：2025-01-07
申请号：US18046189
申请日：2022-10-13
Applicant: GlobalFoundries U.S. Inc.
Inventor： Yusheng Bian , Won Suk Lee , Andreas D. Stricker
Abstract: A structure includes a polarization device such as a polarization splitter, a polarization combiner or a polarization splitter rotator including a waveguide having a light absorber at an end section with an at least hook shape, e.g., it can be hooked or spiral shape. The structure also includes another waveguide adjacent the stated waveguide. The hook or spiral shape acts as a light absorber that reduces undesired optical noise such as excessive light insertion loss and/or light scattering. The hook or spiral shape may also be used on supplemental waveguides used to further filter and/or refine an optical signal in one of the waveguides of the polarization device, e.g., downstream of an output section of the polarization splitter and/or rotator.
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189.发明申请公开(公告)号：US20240427177A1
公开(公告)日：2024-12-26
申请号：US18212437
申请日：2023-06-21
Applicant: GlobalFoundries U.S. Inc.
Inventor： Yusheng Bian
Abstract: Plasmonic photonic structures that include a layer that exhibits an electric-field-induced Pockels effect and methods of forming such structures. The structure comprises a waveguide core on a substrate, a first layer that has an overlapping relationship with the first waveguide core, and a second layer that has an overlapping relationship with the first waveguide core and the first layer. The first layer comprises a metal, and the second layer comprising a material that exhibits an electric-field-induced Pockels effect.
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公开(公告)号：US20240427095A1
公开(公告)日：2024-12-26
申请号：US18338712
申请日：2023-06-21
Applicant: GlobalFoundries U.S. Inc.
Inventor： Ravi Prakash Srivastava , Yusheng Bian , Vibhor Jain
IPC: G02B6/42
Abstract: Embodiments of the disclosure provide a multi-substrate coupling for photonic integrated circuits (PICs). Structures of the disclosure may include a first substrate having a first surface. The first surface includes a groove therein. A second substrate has a second surface coupled to the first surface. The second substrate includes a cavity substantially aligned with the groove of the first surface, and a photonic integrated circuit (PIC) structure horizontally distal to the cavity.
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